|Publication number||US7461961 B2|
|Application number||US 11/740,569|
|Publication date||Dec 9, 2008|
|Filing date||Apr 26, 2007|
|Priority date||Jul 11, 2003|
|Also published as||US7220034, US20050007792, US20070201020|
|Publication number||11740569, 740569, US 7461961 B2, US 7461961B2, US-B2-7461961, US7461961 B2, US7461961B2|
|Original Assignee||Rudolph Technologies, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (30), Referenced by (24), Classifications (17), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a continuation of U.S. Non-Provisional patent application Ser. No. 10/888,302, filed on Jul. 9, 2004, now U.S. Pat. No. 7,220,034 and entitled “Fiber Optic Darkfield Ring Light”, which claims the benefit of U.S. Provisional Patent Application No. 60/486,502, filed on Jul. 11, 2003, and entitled Fiber Optic Darkfield Ring Light.
1. Technical Field
The present invention relates to dark field illumination as is widely used in machine vision to detect features higher or lower than regular surfaces.
2. Background Information
Over the past several decades, the semiconductor has exponentially grown in use and popularity. The semiconductor has in effect revolutionized society by introducing computers, electronic advances, and generally revolutionizing many previously difficult, expensive and/or time consuming mechanical processes into simplistic and quick electronic processes. This boom in semiconductors has been fueled by an insatiable desire by business and individuals for computers and electronics, and more particularly, faster, more advanced computers and electronics whether it be on an assembly line, on test equipment in a lab, on the personal computer at one's desk, or in the home electronics and toys.
The manufacturers of semiconductors have made vast improvements in end product quality, speed and performance as well as in manufacturing process quality, speed and performance. However, there continues to be demand for faster, more reliable and higher performing semiconductors.
Processors who are building semiconductors and like microelectronics must be able to provide ample illumination for the machine vision process. Users of inspection equipment continue to demand smaller, more intense, more robust illumination.
In the past, it was typical to use halogen, laser or other illumination methods rather than fiber optic. Where fiber optic has been tried, the setup has typically involved using a metal ring with a polished surface attached to standard fiber optic ring light to achieve some dark field illumination.
An illuminator including a base with multiple light heads attached thereto, and fiber optics provided in each of the multiple heads.
Preferred embodiment of the invention, illustrative of the best mode in which applicant has contemplated applying the principles, are set forth in the following description and are shown in the drawings and are particularly and distinctly pointed out and set forth in the appended claims. Similar numerals refer to similar parts throughout the drawings.
System 10 includes a wafer test plate 12, means for providing a wafer to the test plate referred to as 14, a wafer alignment device 16 for aligning each and every wafer at the same x, y, and θ location or x, y, z, and θ location, a focusing mechanism 18, a camera 20 or other visual inspection device for visual inputting of good die during training and for visual inspection of other unknown quality die during inspection, a parameter input device 22 for inputting parameters and other constraints or information such as sensitivity parameters, geometries, die size, die shape, die pitch, number of rows, number of columns, etc., a display 24 for displaying the view being seen by the camera presently or at any previously saved period, a computer system 26 or other computer-like device having processing and memory capabilities for saving the inputted good die, developing a model therefrom, and comparing or analyzing other die in comparison to the model, a frame 30, a hood 32, a control panel 34, a system parameters display 36, objective 38, and a fiber optic darkfield ring light 40.
The means for providing a wafer to the test plate referred to as 14 may be either manual in that the user moves the wafer from a cassette or magazine to the test plate 12, or automatic as is shown in the embodiment of
In one form of the invention, system 10 is trained as to what a “good die” comprises by aligning via device 16 and viewing via camera 20 a plurality of known good die and forming a model within computer system 26 to define what an ideal die should look like based upon the common characteristics viewed. In one embodiment, after being trained, system 10 is used to inspect die of unknown quality. During inspection according to one embodiment, system 10 collects an image of a wafer using the camera 20 by moving the plate 12 to align the camera with a first die or other portion thereof, viewing and recording that die or portion thereof by opening the shutter and allowing the camera to view and record the image, moving the plate 12 to align the camera with a second die or portion thereof, viewing and recording the second die or portion thereof, and repeating these steps until all of the die or portions thereof on the wafer that are desired to be viewed have been viewed and recorded. In one embodiment, system 10 determines where defects are located on a given die being viewed based upon the “good die” model.
In another embodiment, rather than using a stop and go procedure to capture images of die on the wafer, system 10 collects an image of the wafer using the camera 20 by continuously moving the plate 12 so as to scan over all of the die on the wafer, whereby the wafer is illuminated by a strobe light at a sequence correlating to the speed of the moving plate so that each die is strobed at the precise time it is under the camera 20. This allows for the continuous collecting of images without necessitating the stop and go procedure of aligning the camera with a first die, viewing and recording that die, moving the plate 12 to align the camera with a second die, viewing and recording this second die, and repeating these steps until all of the die on the wafer have been viewed and recorded, etc.
In one embodiment, fiber optic darkfield ring light 40 is mounted between two millimeters and five millimeters above test plate 12. Substrates to be inspected are placed through an inspection region 94 (shown in
The fiber optic darkfield ring light 40 of the present invention is shown in
In more detail, the fiber optic darkfield ring light 40 as shown in
The base 60 provides a mounting surface for the multiple fiber optic line arrays 90. In the embodiment shown, the base 60 provides a mounting surface for eight (8) fiber optic line arrays 90. The base 60 in more detail is a block with a top base surface 105 and a recessed area 64 therein having a first surface portion 70A on which the light heads 80 are mounted. The recessed area 64 is generally cylindrical in shape, and is defined by a wall 66 and a bottom recess surface 68. The bottom recess surface 68 includes the first surface portion 70A on which the light heads 80 are mounted, and a second surface portion 70B extending outward from and surrounding the first surface portion 70A. In the illustrated embodiment, surface portions 70A and 70B are ring-shaped. In the embodiment shown, the mounted heads 80 have an inward taper and are positioned in a generally circular manner around an inspection region 94. A fiber optic routing channel 72 is defined behind the light heads 80 and appears as an annual ring area. The surface 70A in the recessed area 64 on which the light heads 80 are mounted is designed in one embodiment in a polygonal fashion, in the embodiment shown an octagonal pattern with eight notches 92 extending upward from surface 70A for eight (8) fiber optic line arrays 90, to simulate a true circular ring. A cutout notch 62 from the routing channel 72 is notched out of the base 60, thereby providing a lateral access into the recessed area 64.
Each light head 80 includes a channel 82 formed therein that provides room for an individual set or group of fiber optic lines for each fiber optic line array 90 (as shown in
The cord grip 52 provides a transition for all fiber optics from eight (8) fiber optic line arrays 90 to one (1) fiber optic input bundle that is placed within the cord grip 52 positioned at the cut-out notch 62 (and attachable there). The fiber optic input bundle is positioned within a circular hole 56 in cord grip 52. The hood 48 provides protection for fiber optics in the transition into the unit 40 and also may assist in securing the fiber optics in place.
Assembly of the fiber optic darkfield ring light 40 occurs as follows in one embodiment: Assemble multiple fiber optic line arrays 90 where each line array 90 includes a light head 80, a light cover 74 and fiber optics (shown in
As shown in
In use, the ring light system 40 uses fiber optics 104 to deliver light from a light source 103 (such as a strobing light source) to the area to be inspected in the inspection region 94, which is at the center of the substantially circular arrangement of line arrays 90. In one embodiment, light source 103 provides light that is directed by fiber optic input bundle 102 to ring light 40. The light is then directed by each set 104 of fiber optic lines to corresponding ones of the line arrays 90, which direct the light to inspection region 94. In one form of the invention, light source 103 strobes to provide short flashes of light that are correlated with a velocity or position of a substrate being inspected. The multiple (in the embodiment shown eight) fiber optic line arrays 90 deliver intense light in a very small profile, and at a low angle (such as 15 degrees) from the fiber optic line arrays 90 to the inspection surface. This angle is determined by the angle of the mounting surface portion 70A (
As shown in
The unique fiber optic darkfield ring light system 40 according to one embodiment provides intense dark field illumination to highlight features that are higher or lower in height than a regular surface. Examples of such features are nodule and crater defects on the bump top of gold bumped wafers, particles and scratches on surface, etc. The system 40 can be used alone or with other bright field illumination. The system 40 is of much smaller profile compared to off-the-shelf products to provide maximum flexibility with current optics.
In sum, the system 40 is a fiber optic darkfield ring light for illumination. One application is darkfield illumination for use in defect inspection on semiconductors and microelectronics where it illuminates to assist in inspection for defects. One type of defect that it is useful in finding is nodules and craters. It is also very useful for defect detection on gold bump wafers and others wafers with flat bump top. This system is also useful for assisting in defect detection for surface defect detection such as on any relatively flat surface. Overall, it provides for a very low profile, intense dark field ring light 40 for general machine vision and the microscopy industry.
Accordingly, the invention as described above and understood by one of skill in the art is simplified, provides an effective, safe, inexpensive, and efficient device, system and process which achieves all the enumerated objectives, provides for eliminating difficulties encountered with prior devices, systems and processes, and solves problems and obtains new results in the art.
In the foregoing description, certain terms have been used for brevity, clearness and understanding; but no unnecessary limitations are to be implied therefrom beyond the requirement of the prior art, because such terms are used for descriptive purposes and are intended to be broadly construed.
Moreover, the invention's description and illustration is by way of example, and the invention's scope is not limited to the exact details shown or described.
Having now described the features, discoveries and principles of the invention, the manner in which it is constructed and used, the characteristics of the construction, and the advantageous, new and useful results obtained; the new and useful structures, devices, elements, arrangements, parts and combinations, are set forth in the appended claims.
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|U.S. Classification||362/554, 362/575, 362/33|
|International Classification||G01N21/95, G01N21/88, F21V7/00, F21V7/04, H01L21/00|
|Cooperative Classification||H01L21/67288, G01N21/9501, G01N21/8806, G01N2201/08, G01N2021/8822, G01N2201/0826|
|European Classification||H01L21/67S8G, G01N21/95A, G01N21/88K|
|Feb 17, 2009||CC||Certificate of correction|
|Jun 5, 2012||FPAY||Fee payment|
Year of fee payment: 4