|Numéro de publication||US7606059 B2|
|Type de publication||Octroi|
|Numéro de demande||US 10/548,291|
|Date de publication||20 oct. 2009|
|Date de dépôt||18 mars 2003|
|Date de priorité||18 mars 2003|
|État de paiement des frais||Payé|
|Autre référence de publication||CN1759450A, CN1759450B, US7826249, US8102697, US8717804, US20060268594, US20100165702, US20110019462, US20120099365, WO2004084229A1|
|Numéro de publication||10548291, 548291, PCT/2003/3257, PCT/JP/2003/003257, PCT/JP/2003/03257, PCT/JP/3/003257, PCT/JP/3/03257, PCT/JP2003/003257, PCT/JP2003/03257, PCT/JP2003003257, PCT/JP200303257, PCT/JP3/003257, PCT/JP3/03257, PCT/JP3003257, PCT/JP303257, US 7606059 B2, US 7606059B2, US-B2-7606059, US7606059 B2, US7606059B2|
|Cessionnaire d'origine||Kabushiki Kaisha Toshiba|
|Exporter la citation||BiBTeX, EndNote, RefMan|
|Citations de brevets (29), Citations hors brevets (1), Référencé par (118), Classifications (32), Événements juridiques (2)|
|Liens externes: USPTO, Cession USPTO, Espacenet|
This invention relates to a programmable resistance memory device for storing a resistance state as data in a non-volatile manner, with a programmable resistance element which is switchable between a low resistance state and a high resistance state by reversing the polarity of voltage application.
Recently, there have been proposed some memory devices having programmable resistance elements. One of these memory devices is known as a phase change memory which uses phase transition between an amorphous state and a crystalline state of a memory material (for example, U.S. Pat. No. 6,314,014B1). In such a phase change memory device, by controlling the current of a chalcogenide cell, reversible switching may be performed between a crystalline state (i.e. low resistance state) and an amorphous state (i.e. high resistance state). By applying a large current to a cell so as to cause the cell chalcogenide to be melted, then rapidly cooled down it, a low resistance state may be written. Annealing the chalcogenide to such a degree as to crystallize it without melting, and a high resistance state may be written. Therefore, it is possible to obtain an electrically rewritable non-volatile memory device.
Other programmable resistance memories have been proposed as including programmable resistances switchable between a low resistance state and a high resistance state by reversing the polarity of voltage application. One of these has an ion conductor formed of a chalcogenide containing metals (for example, U.S. Pat. No. 6,418,049B1), and another one has a polymer in which conductive particles are dispersed (for example, U.S. Pat. No. 6,072,716). In these memories, dendrite growth and retraction thereof in a solid by voltage application are used. In order to write a low resistance state into a cell, a voltage is applied between the anode and cathode of a cell in such a polarity that the anode is positive. As a result, a dendrite grows from the cathode to reach the anode, whereby the cell comes to be in a low resistance state. A reverse voltage application retracts the dendrite to cause the cell to be in a high resistance state. Such a resistance change is reversible, and the low resistance state and the high resistance state may be stored in a non-volatile manner.
It has been suggested that it is possible to achieve an electrically rewritable non-volatile memory with a high density by use of such a programmable resistance. However, there has not been proposed a detailed configuration of a cell array and a read/write circuit thereof. In order to achieve a practical non-volatile memory with a high density and a high performance, how to combine the programmable resistance with what kinds of switching devices for constituting a cell array, how to construct the read/write circuit in communication with the cell array, and the like become important technical issues.
A programmable resistance memory device according to one aspect of the present invention includes:
a semiconductor substrate;
at least one cell array, in which memory cells are arranged, formed above the semiconductor substrate, each the memory cell having a stack structure of a programmable resistance element and an access element, the programmable resistance element storing a high resistance state or a low resistance state determined due to the polarity of voltage application in a non-volatile manner, the access element having such a resistance value in an off-state in a certain voltage range that is ten times or more as high as that in a select state; and
a read/write circuit formed on the semiconductor substrate as underlying the cell array for data reading and data writing in communication with the cell array.
The resistance film 3 stores, for example, a high resistance state as a data “0” and a low resistance state as a data “1”. In this programmable resistance VR, by applying a positive anode-cathode voltage (VAK>0) that is over a threshold value, and a data “1” will be written. By applying a negative anode-cathode voltage (VAK<0) that is over a threshold value, and a data “0” will be written. When “1” data is written, as a result of the voltage application of VAK>0, a conductive dendrite 4 grows from the cathode electrode 1 toward the anode electrode 2 in the resistance film 3 as shown in
It should be appreciated that the resistance film 3 may be formed of a polymer in which conductive particles are dispersed (for example, carbon polymer in which carbon black particles are dispersed). In this case, a low resistance state and a high resistance state are reversibly written based on the same principle as above.
The principle of the above-described memory operation is based on a mechanism as described below. An ion conductor or a polymer is amorphous, and potential barriers are formed at random and statically therein. In addition, in the potential barrier distribution, potential valleys are formed continuously from the cathode to the anode. By dispersing some of metals in such a solid material, and it is possible to move metal ions along the potential valleys due to electric field application. When a voltage is applied in such a polarity that the anode side is positive, metal ions move toward the cathode, and metal dendrite grows from the cathode electrode. Reverse the polarity of the electric field, and the metals in the dendrite are charged and separated from the dendrite, and move toward the cathode along the potential valleys. As a result, the dendrite may be retracted.
Data read of such a programmable resistance VR may be performed by current monitoring when a voltage is applied to the programmable resistance VR at a level such that dendrite growth and retraction thereof do not occur. Alternatively, it is possible to use a large read voltage without data disturbance in a condition that it has a polarity so as to accelerate the data “0”, “1” state.
In a non-select state, the bit lines BL are held at a high level voltage VH, and the word lines WL are held at a low level voltage VL. In this state, Zener diodes ZD are in a reverse-biased state and thus are in an off-state.
The above-described level relationship is an example. For example, in
In this embodiment, the cell selection method in which the forward bias characteristic of the diode is used as shown in
In the first quadrant of
In order to cause the programmable resistance of “1” data to take place, it is required that a voltage higher than a certain level is applied to the programmable resistance. Such a level is shown as a “0” write threshold value VT in
In the third quadrant, “1” write is performed. In this case, by applying a large backward bias, it may cause the Zener diode to breakdown. It allows current with an approximately constant voltage. In the drawing, “1” write operation is shown as follows; when write voltage Vw(1)=VLL−VHH is applied as being over the breakdown voltage (Zener voltage) Vz, the programmable resistance VR changes from a high resistive state 56 of “0” data to a low resistive state 55 of “1” data. Load lines 56, 55, which express “0”, “1” states respectively, have inclinations in correspondence with resistance values. Therefore, these are in parallel with the load lines 53, 54 in the first quadrant, respectively. In this case, it is also required for successfully writing to the programmable resistance that a voltage higher than a threshold value VT is applied to it. This threshold value VT is expressed in a positive direction with reference to Vw(1). If the cross point B2 between the breakdown characteristic curve 51 b of the Zener diode ZD and the load line 56 of “0” data state of the programmable resistance is positioned between the origin and Vw(1)+VT, “1” write may be entered into the programmable resistance. Voltages VLL, VHH and the like are selected in such a condition that sufficiently high voltage is applied to the programmable resistance.
If the resistance value of “1” data written programmable resistance is too low, a large current will flow through the Zener diode ZD, thereby causing thermal breakdown. Therefore, it is required to give attention to the current value. Corresponding to some cases, it will be necessary to include a current limiter.
If the third quadrant is used for “0” writing, there is not any danger of thermal breakdown, because the load line variation due to writing is in such a direction that the current value decreases. In this case, however, since it is required to use the first quadrant for “1” writing, the possibility of erroneous writing in a read operation is certain.
In the above-described read operation, it is required to prevent the cell from erroneous write due to the read voltage application. As shown in
As previously described, it is possible to use the first quadrant for “1” data writing in principle. However, in such the case, a “0” read operation becomes a weak “1” write mode. To avoid such the mode, it is preferable to use the first quadrant for “0” write operations.
As described above, in the read scheme of
As above-explained, in this embodiment, a Zener diode serves as an access element for applying voltages to the programmable resistance in opposite polarities, and the forward bias characteristic and the backward bias breakdown characteristic thereof are be used. In the backward bias characteristic, there is a voltage region, in which a resistance value is regarded as being approximately infinite, under Zener voltage Vz. This is an important characteristic required for the access element of the programmable resistance. In general, it is required of the access element to have such a resistance value in an off-state in a certain voltage range that is ten times or more as high as that in a select state. In consideration of this, it should be appreciated that other access elements, for example, a PN junction diode, a Schottky diode and the like, may be used as long as that they are held in a high-resistive off-state in a certain voltage range. In addition, it should be appreciated that the programmable resistance element may be formed of not only above-described materials but also such a material which carries current in different directions corresponding to the polarity of voltage application to have different resistance values corresponding to the current directions.
So far, the configuration of the basic cell array and the principle of the data read/write operation have been explained. In this embodiment, a three-dimensional cell array structure in which a plurality of cell arrays are stacked above a semiconductor substrate is utilized. Such a three dimensional cell array will be explained below.
A silicon substrate 10 is covered with an insulator film such as a silicon dioxide film. Above the substrate, a plurality of bit lines (BL) 12 a are arranged in parallel with each other. Pillar-type memory cells MC are arranged on each bit line 12 a at a certain pitch, each of which has a programmable resistance element VR and a Zener diode ZD stacked thereon. Word lines (WL) 18 ab are formed to commonly connect the upper ends of the memory cells MC in a direction perpendicular to the bit lines 12 a, whereby first cell array MA0 is formed.
As above-described, the programmable resistance element VR is written into a “0” state by applying a high level voltage to the word line WL and a low level voltage to the bit line BL to cause it to be forward-biased. Therefore, the programmable resistance element VR is disposed with such a polarity that cathode and anode thereof are to be connected to the word line WL and bit line BL, respectively. This is the same for every cell array stacked.
In detail, the memory cells MC are formed by patterning laminated layers having programmable resistance element layer 13 a, an ohmic electrode 14 a, an n+-type silicon layer 15 a and a p+-type silicon layer 16 a. The programmable resistance element layer 13 a is, as shown in
Second cell array MA1 is formed to share the word lines (WL0) 18 ab with the first cell array MA0. In detail, pillar-type memory cells MC are arranged on each word line 18 ab at a certain pitch, each of which is formed by patterning the laminated films of a p+-type silicon film 16 b, an n+-type silicon film 15 b, an ohmic electrode 14 b and a programmable resistance element film 13 b to have a stacked structure of a Zener diode ZD and a programmable resistance element VR. The cell layout is the same as that of the first cell array MA0. Bit lines (BL1) 12 ab are patterned to commonly connect the programmable resistance element layers 13 b arranged along a direction perpendicular to the word lines 18 ab. An interlayer dielectric film 19 is buried around the memory cells MC to planarize the cell array MA1.
The stacked structure of third and fourth cell arrays MA2 and MA3 is periodically formed as similar to the first and second cell arrays MA0 and MA1. Bit lines (BL1) 12 bc are shared with the second cell array MA1 and the third cell array MA2. The third cell array MA2 and the fourth cell array MA3 share the word lines (WL1) 18 cd with each other. Bit lines (BL0) 12 a of the lowest cell array MA0 and bit lines (BL3) 12 d of the uppermost cell array MA3 are independently prepared, respectively. Although the cross section along II-II′ line of
As shown in
In the above-described 3D cell array in which many memory cells are integrated, variation of cell characteristics causes trouble. In detail, since the resistance value of the programmable resistance element VR is determined by dendrite growth and retraction thereof, variation occurs due to a history thereof, environment and the like.
In consideration of the above-described view points, in this embodiment, two nearby cells constitute a cell pair for storing complementary data therein in such a manner that data “0” is stored in one cell and data “1” is stored in the other cell. Read operation is done by detecting the difference between cell currents of the two cells constituting the pair. By use of this scheme, even if there is a partial overlap between the high resistive state distribution and the low resistive distribution in the entire 3D cell array, it is possible to precisely read/write the cell data.
Data read/write methods in such the case that two memory cells constitute a cell pair will be described in detail below.
In a read selection mode as shown in
Next, data write operations into cell pairs will be described. Although a pair of cells store a data “0” in one cell and a data “1” in the other cell, “0” and “1” write voltages applied between the word line and the bit line have to be opposite each other as above-described. This means that it is impossible to simultaneously write data into the true cell, T-cell, and the complementary cell, C-cell, which share a word line. Therefore, it is required to perform data write operations for a cell pair twice.
As a result, in the former half T1, “0” write voltage, Vw(0)=VH−VL, is applied to one cell, T-cell, of the pair cell to forward-bias the diode thereof due to the high level voltage VH of the word line WL and the low level voltage VL of the bit line BL0 (or BL1), whereby the T-cell is written into a “0” data state. At this time, since the voltage applied to the other cell, C-cell, is VH−VHH, the diode of C-cell is held at an off-state. Therefore, no error data are written into the C-cell. In the latter half T2, “1” write voltage, Vw(1)=VLL−VHH, is applied to the other cell, C-cell, of the pair cell to cause the diode thereof to breakdown due to the low level voltage VLL of the word line WL and the high level voltage VHH of the bit line /BL0 (or /BL1), whereby the C-cell is written into a “1” data state. At this time, the voltage applied to the cell T-cell, in which a data has been written, is VLL−VL. Since the diode of the T-cell is held at an off-state in this condition, no error data are written into the T-cell.
In order to write “1” data, one of the bit line pair, BL0 (or BL1), is boosted to the higher level voltage VHH from the high level voltage VH, and the other, /BL0 (or /BL1), is pulled down to the low level voltage VL from the high level voltage VH. And, similarly to the “0” write mode, the high level voltage VH is applied to the word line WL in the former half T1 of the above-described bit line selection period, and then the low level voltage VLL is applied to the same in the latter half T2.
As a result, in the former half T1, one of the cell pair, C-cell, is written into a “0” data state because the cell diode is forward-biased due to the high level voltage VH of the word line WL and the low level voltage VL of the bit line /BL0 (or /BL1). In the latter half T2, the other cell, T-cell, is written into a “1” data state because the low level voltage VLL of the word line WL and the high level voltage VHH of the bit line BL0 (or BL1) cause the cell diode to breakdown. No erroneous writes occur in both the former half for “0” writing and the latter half for “1” writing, similarly to the above-described “0” writing mode.
As apparent from
As is apparent from the above-described write operations, it should be appreciated that it is possible to simultaneously access the respective plural cell pairs within the first and second cell arrays MA0 and MA1 with shared word lines. Similarly, it is possible to simultaneously access the respective plural cell pairs within the third and fourth cell arrays MA2 and MA3 with shared word lines. In contrast to this, note that it is not possible to simultaneously access the second and third cell arrays MA1 and MA2 with shared bit lines.
Up to this point, it has been explained that such a cell pair configuration laterally neighbouring two memory cells constitute a cell pair in each cell array layer in the three-dimensional cell array. However, the cell pair configuration method is not so limited. As shown in
As shown in
A group of bit lines BL0 of the first cell array MA0 and a group of bit lines BL2 of the fourth cell array MA3 are drawn to the first boundary A1 side to be connected to a bit line select circuit 201, which is disposed along the boundary A1 in the read/write circuit 200, through vertical wirings (i.e., passages that vertically run to the substrate) 101 that are disposed along the boundary A1. A group of bit lines BL1 shared by the second and third cell arrays MA1 and MA2 are drawn to the second boundary A2 side to be connected to another bit line select circuit 202, which is disposed along the boundary A2 in the read/write circuit 200, through vertical wirings 102 that are disposed along the second boundary A2.
The reason why the bit lines BL0 and BL2 are drawn to the same side to be commonly connected to the bit line select circuit 201 through the vertical wirings 101 is such a fact that these groups of bit lines are not simultaneously activated. In detail, cell arrays MA0 and MA1 are simultaneously activated because these have shared word lines WL0. Similarly to this, cell arrays MA2 and MA3 are simultaneously activated because these have shared the word lines WL1. However, since the cell arrays MA1 and MA2 share the bit lines BL1, the lower cell arrays (MA0, MA1) and the upper cell arrays (MA2, MA3) are not activated simultaneously. The bit line select circuits 201, 202 include bit line decoders/multiplexers (BL-DEC/MUX).
The word lines WL0 and WL1 are drawn to the third boundary B1 side to be connected to word line select circuit 208, which is disposed along the boundary B1 in the read/write circuit 200, through vertical wirings 103 and 104, respectively, that are disposed along the boundary B1. The word line select circuit 208 has word line decoders/multiplexers (WL-DEC/MUX).
A central portion of the read/write circuit 200 serves as a global bus region 207, in which I/O data lines and pulse signal lines are disposed crossing this region in the direction of the word lines. Between this global bus region 207 and the bit line select circuits 201 and 202, are disposed sense amplifier arrays 203 and 204, respectively. Signal lines formed at the global bus region 207 are shared by the sense amplifier arrays 203 and 204. The sense amplifiers in the sense amplifier arrays 203 and 204 are connected to bit line select circuits 201 and 202 through signal lines disposed at local bus regions 205 and 206, respectively. Therefore, some selected from the bit lines BL0 or BL2 by the bit line select circuit 201 are connected to the sense amp array 203. Similarly, some selected from the bit lines BL1 by the bit line select circuit 202 are connected to the sense amp array 204.
The I/O data lines and pulse signal lines disposed at the global bus region 207 are drawn to the fourth boundary B2 side of the cell layout region 210. Along this boundary B2, disposed is a write circuit (i.e., write pulse generator circuit) 209 for applying write pulse signals to selected bit lines.
As above-described referring to
As shown in
As shown in
As shown in
Although the lowest contact plugs 101 a, 102 a, 103 a and 104 a of the laminated cell arrays in
One cell block 100 shown in
One cell unit is selected in one cell block, and cell data of lower two cell arrays or upper two cell arrays in each cell unit are simultaneously activated. Therefore, data lines 304 are prepared for 32IO×2=64IO. The write pulse signal lines are the same. In detail, in a read mode, read data on plural bit lines, which are respectively selected from the lower two cell arrays (MA0, MA1) or the upper two cell arrays (MA2, MA3) by the bit line select circuits 201 and 202, are simultaneously sensed by the sense amp arrays 203 and 204, and then simultaneously transferred to the data lines 304. In a write mode, write pulse signals, which are to be supplied to plural bit lines respectively selected from the lower two cell arrays (MA0, MA1) or the upper two cell arrays (MA2, MA3), are output to the write pulse signal lines 304 from the write circuit 209, and then transferred to the plural bit lines respectively selected by the bit line select circuits 201 and 202.
On the lower and upper ends of the read/write circuit 200, are disposed the bit line select circuits 201 and 202, respectively. Column address (CA) signal lines 302 and 303 are disposed to laterally run on the respective regions. One of the bit line select circuits, i.e., circuit 201, selects 32 bit line pairs from 512 bit line pairs (=64IO×4Col) in the upper two cell arrays, and the other selects 32 bit line pairs from 512 bit line pairs in the lower two cell arrays. Therefore, on the respective local bus regions 205 and 206, are disposed four pairs of current pass lines BP, /BP for common 4-columns (=8 bit lines) data so as to cross the regions of sense amplifier arrays 203 and 204 for applying the pulse signals of the pulse signal lines 305 to bit lines selected by the respective bit line select circuits 201 and 202. Additionally, 64 pairs of local data lines DL, /DL for 4 data columns are disposed on the respective local bus regions 205 and 207, and these are connected to the respective sense amps in the sense amplifier arrays 203 and 204.
One circuit portion 310, that is to be connected to 4 Row×2 (=8 word lines) and another circuit portion 312, that is to be connected to 4 Col(=8 bit lines), each being surrounded by a broken line in
Two multiplexers MUX0 and MUX1 have select gate circuits for selecting the lower word lines WL0 shared by the cell arrays MA0 and MA1, and the upper word lines WL1 shared by the cell arrays MA2 and MA3, respectively. Eight word lines input to the multiplexer MUX0 in
The multiplexer MUX0 has a reset circuit 402 composed of NMOS transistors QN (QN11 to QN14, QN15 to QN18, . . . ) for holding non-selected word lines as being at low level voltage VL=Vss. The multiplexer MUX1 is composed as similar to the multiplexer MUX0.
A sense amp SA shown in
The sense amplifier SA is a CMOS flip-flop type current sensing amplifier with an activating PMOS transistor QP30. Two nodes N1 and N2 thereof are directly connected to a pair of lines GBi, /GBi in the global data lines 304, respectively. Drains of sensing NMOS transistors QN61 and QN62 are selectively connected to data lines DL and /DL through NMOS transistors QN31 and QN32, respectively, that are controlled by a read control signal R to turn-on during a read operation. Except on the data read time, the nodes N1 and N2 are shorted with each other by an equalizing transistor QN73. Data lines DL, /DL are connected to a pair of bit lines selected by the bit line decoder/multiplexer BL-DEC/MUX.
Drains of the sensing transistors QN61, QN62 may be selectively set at Vss or at floating states by NMOS transistors QN71, QN72 which are controlled by a clock CLK. Based on the operations of transistors QN71, QN72, it is possible to apply the low level voltage VLr(=Vss) shown in the waveforms of
The bit line decoder/multiplexer BL-DEC/MUX has a select gate 403 composed of NMOS transistors QN51 to QN54, and Q55 to Q58 controlled by decoded signals S20 to S23 for selecting one pair from four pairs of bit lines to connect these to the data lines DL and /DL, respectively. Additionally, the bit line decoder/multiplexer BL-DEC/MUX has a reset circuit 404 composed of PMOS transistors QP51 to QP54, and QP55 to QP58 for holding non-selected bit lines as being at a high level of Vdd.
The pair of data lines DL, /DL are connected to a pair of signal lines WPi, /WPi in the pulse signal lines 305 through NMOS transistors QN41, QN42 that are driven by a write control signal W to turn-on, and through signal lines BP, /BP.
In the above-described configuration, when a data read operation is performed, word lines selected by select gate circuit 403 become “H”, and bit line pairs selected by select gate circuit 403 become “L”. At this time, cell currents from the selected complementary cells on the selected bit line pair are transferred to the drains of NMOS transistors QN61, QN62 of the sense amp SA through data lines DL, /DL and through NMOS transistors QN31, QN32. During this operation, NMOS transistors QN71, QN72 are held at an off-state. Thereafter, clock CLK becomes “H” to turn-on the NMOS transistors QN71, QN72, whereby the drains of the sensing NMOS transistors QN61, QN62 are clamped at Vss. As a result, a differential voltage generated between the nodes N1 and N2 due to the difference of cell currents is positively fed back to be amplified such that one of the nodes N1, N2 becomes Vdd, while the other becomes Vss. Amplified cell data as above-described is output to the main data lines GBi, /GBi.
In a data write mode, the drive signal Vwdrv, which is at the high level voltage VH in the former half and at the low level voltage VL in the latter half, is applied to a selected word line. Simultaneously, write pulse signals, which are set at combinations among VHH, VH, VL and VLL corresponding to-be-written data, are applied to selected cell pairs through the write pulse signal lines WPi, /WPi, whereby data write operations are performed.
Since one word line is commonly connected to many cell pairs, it is required for the word line to supply a large current to the cell pairs. In consideration of such a current value, it is required to design drivability of the word line decoder, resistance of the word line itself, the transistor size, and the like. It should be appreciated that the word line multiplexer MUX0 for eight word lines shown in
Vertically running wirings 410 in
Bit lines and word lines in the above-described cell array are preferably formed with a line/space of 1F/1F (F: minimum device-feature size). These bit lines and word lines are connected while holding the line pitch to the read/write circuit 200 on the substrate as shown in
When the transistor size and metal wire pitch are determined as above-described, in order to effectively dispose the transistors, the select signal lines (S10, /S10)(S20), (S11, /S11)(S21), (S12, /S12)(S22) and (S13, /S13)(S23) which are suffixed in accordance with an address order of 0, 1, 2 and 3 are arranged in such an order of (S10, /S10)(S20), (S12, /S12)(S22), (S11, /S11)(S21) and (S13, /S13)(S23). As a result, between a transistor array of QN21 (QN51), QN23(QN53) selected by the select signal line S10(S20) and a transistor array of QN23(QN52), QN24(QN54) selected by the select signal line S11(S21), disposed is a transistor array of QN25(QN55), QN27(QN57) selected by the select signal line S12(S22). By employing such the transistor arrangement, it is possible to dispose transistors with a large size within a metal wiring area in which wirings are arranged at a small pitch without idle spaces.
Next, referring to
Then, as shown in
Continuously, memory cell formations, interlayer dielectric film depositions, wiring and contact plug formations by use of the damascene method are periodically performed. By use of such processes, as shown in
According to this invention, it is possible to provide a programmable resistance memory device in which a cell array and a read/write circuit are integrally formed in a small chip area.
|Brevet cité||Date de dépôt||Date de publication||Déposant||Titre|
|US3997883||8 oct. 1968||14 déc. 1976||The National Cash Register Company||LSI random access memory system|
|US5991193||2 déc. 1997||23 nov. 1999||International Business Machines Corporation||Voltage biasing for magnetic ram with magnetic tunnel memory cells|
|US6072716||14 avr. 1999||6 juin 2000||Massachusetts Institute Of Technology||Memory structures and methods of making same|
|US6204139||25 août 1998||20 mars 2001||University Of Houston||Method for switching the properties of perovskite materials used in thin film resistors|
|US6418049||4 déc. 1998||9 juil. 2002||Arizona Board Of Regents||Programmable sub-surface aggregating metallization structure and method of making same|
|US6504742||31 oct. 2001||7 janv. 2003||Hewlett-Packard Company||3-D memory device for large storage capacity|
|US6785156 *||16 janv. 2003||31 août 2004||Micron Technology, Inc.||Method and apparatus for sensing resistance values of memory cells|
|US7002859 *||2 juil. 2002||21 févr. 2006||Dell Products L.P.||On-die switchable test circuit|
|US7335906 *||3 avr. 2003||26 févr. 2008||Kabushiki Kaisha Toshiba||Phase change memory device|
|US7394680 *||12 juin 2007||1 juil. 2008||Kabushiki Kaisha Toshiba||Resistance change memory device having a variable resistance element with a recording layer electrode served as a cation source in a write or erase mode|
|US7400522 *||12 juin 2007||15 juil. 2008||Kabushiki Kaisha Toshiba||Resistance change memory device having a variable resistance element formed of a first and second composite compound for storing a cation|
|US20020168820||10 sept. 2001||14 nov. 2002||Kozicki Michael N.||Microelectronic programmable device and methods of forming and programming the same|
|US20030031047||9 août 2001||13 févr. 2003||Anthony Thomas C.||One-time programmable unit memory cell based on vertically oriented fuse and diode and one-time programmable memory using the same|
|US20070285963 *||11 juin 2007||13 déc. 2007||Kabushiki Kaisha Toshiba||Resistance change memory device|
|US20070285964 *||11 juin 2007||13 déc. 2007||Kabushiki Kaisha Toshiba||Resistance change memory device|
|US20070285965 *||11 juin 2007||13 déc. 2007||Kabushiki Kaisha Toshiba||Resistance change memory device|
|US20070285968 *||12 juin 2007||13 déc. 2007||Kabushiki Kaisha Toshiba||Resistance change memory device|
|US20080106931 *||17 déc. 2007||8 mai 2008||Kabushiki Kaisha Toshiba||Phase change memory device|
|EP0337393A2||11 avr. 1989||18 oct. 1989||Kabushiki Kaisha Toshiba||2-cell/1-bit type EPROM|
|EP0495494A1||16 janv. 1992||22 juil. 1992||Energy Conversion Devices, Inc.||Electrically erasable phase change memory|
|EP1081714A1||30 août 2000||7 mars 2001||Fujitsu Limited||DRAM for storing data in pairs of cells|
|EP1265286A2||10 mai 2002||11 déc. 2002||Hewlett-Packard Company||Integrated circuit structure|
|JP2001525606A||Titre non disponible|
|JP2002530850A||Titre non disponible|
|JP2003007977A||Titre non disponible|
|WO1999028914A2||4 déc. 1998||10 juin 1999||Axon Technologies Corporation||Programmable sub-surface aggregating metallization structure and method of making same|
|WO2000030118A1||29 avr. 1999||25 mai 2000||Matrix Semiconductor, Inc.||Vertically stacked field programmable nonvolatile memory and method of fabrication|
|WO2002047089A2||22 nov. 2001||13 juin 2002||Infineon Technologies Ag||Magnetoresistive memory and method for reading out from the same|
|WO2003085675A2||10 janv. 2003||16 oct. 2003||Kabushiki Kaisha Toshiba||Phase-change memory device|
|Brevet citant||Date de dépôt||Date de publication||Déposant||Titre|
|US7826249 *||14 sept. 2009||2 nov. 2010||Kabushiki Kaisha Toshiba||Three dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array|
|US7830706 *||9 nov. 2010||Hitachi, Ltd.||Semiconductor device|
|US7859885 *||7 janv. 2008||28 déc. 2010||Kabushiki Kaisha Toshiba||Phase changing memory device|
|US7983109||19 juil. 2011||Hitachi, Ltd.||Semiconductor device|
|US8040715 *||18 oct. 2011||Kabushiki Kaisha Toshiba||Semiconductor storage device|
|US8080440||20 déc. 2011||Macronix International Co., Ltd.||Resistor random access memory cell with L-shaped electrode|
|US8094488 *||10 janv. 2012||Macronix International Co., Ltd.||Set algorithm for phase change memory cell|
|US8094489||10 janv. 2012||Hitachi, Ltd.||Semiconductor device|
|US8097535 *||31 août 2007||17 janv. 2012||Nxp B.V.||Fabrication of self-assembled nanowire-type interconnects on a semiconductor device|
|US8102697||24 janv. 2012||Kabushiki Kaisha Toshiba||Three-dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array|
|US8102699||24 janv. 2012||Kabushiki Kaisha Toshiba||Phase change memory device|
|US8110429||2 oct. 2009||7 févr. 2012||Macronix International Co., Ltd.||Bridge resistance random access memory device and method with a singular contact structure|
|US8138028||18 juin 2007||20 mars 2012||Macronix International Co., Ltd||Method for manufacturing a phase change memory device with pillar bottom electrode|
|US8158965||17 avr. 2012||Macronix International Co., Ltd.||Heating center PCRAM structure and methods for making|
|US8178386||15 mai 2012||Macronix International Co., Ltd.||Phase change memory cell array with self-converged bottom electrode and method for manufacturing|
|US8237140||7 août 2012||Macronix International Co., Ltd.||Self-aligned, embedded phase change RAM|
|US8310864||15 juin 2010||13 nov. 2012||Macronix International Co., Ltd.||Self-aligned bit line under word line memory array|
|US8351240 *||18 déc. 2009||8 janv. 2013||SK Hynix Inc.||Phase change memory device having multi-level and method of driving the same|
|US8374018||12 févr. 2013||Crossbar, Inc.||Resistive memory using SiGe material|
|US8391049||5 mars 2013||Crossbar, Inc.||Resistor structure for a non-volatile memory device and method|
|US8394670||12 mars 2013||Crossbar, Inc.||Vertical diodes for non-volatile memory device|
|US8400814||19 mars 2013||Kabushiki Kaisha Toshiba||Semiconductor memory device|
|US8404553||23 août 2010||26 mars 2013||Crossbar, Inc.||Disturb-resistant non-volatile memory device and method|
|US8441835||14 mai 2013||Crossbar, Inc.||Interface control for improved switching in RRAM|
|US8450209||28 mai 2013||Crossbar, Inc.||p+ Polysilicon material on aluminum for non-volatile memory device and method|
|US8450710||27 mai 2011||28 mai 2013||Crossbar, Inc.||Low temperature p+ silicon junction material for a non-volatile memory device|
|US8456940||4 juin 2013||Hitachi, Ltd.||Semiconductor device|
|US8467227||4 nov. 2011||18 juin 2013||Crossbar, Inc.||Hetero resistive switching material layer in RRAM device and method|
|US8467228||10 août 2011||18 juin 2013||Panasonic Corporation||Variable resistance nonvolatile memory device|
|US8467229||24 nov. 2011||18 juin 2013||Panasonic Corporation||Variable resistance nonvolatile memory device|
|US8492195||23 août 2010||23 juil. 2013||Crossbar, Inc.||Method for forming stackable non-volatile resistive switching memory devices|
|US8497182||19 avr. 2011||30 juil. 2013||Macronix International Co., Ltd.||Sidewall thin film electrode with self-aligned top electrode and programmable resistance memory|
|US8519485||7 mai 2012||27 août 2013||Crossbar, Inc.||Pillar structure for memory device and method|
|US8537595||13 sept. 2011||17 sept. 2013||Kabushiki Kaisha Toshiba||Resistance change memory device|
|US8558212 *||29 sept. 2010||15 oct. 2013||Crossbar, Inc.||Conductive path in switching material in a resistive random access memory device and control|
|US8559211||28 déc. 2011||15 oct. 2013||Kabushiki Kaisha Toshiba||Phase change memory device|
|US8599601||15 févr. 2013||3 déc. 2013||Crossbar, Inc.||Interface control for improved switching in RRAM|
|US8648327||16 nov. 2012||11 févr. 2014||Crossbar, Inc.||Stackable non-volatile resistive switching memory devices|
|US8648471||24 avr. 2012||11 févr. 2014||Kabushiki Kaisha Toshiba||Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same|
|US8658476||20 avr. 2012||25 févr. 2014||Crossbar, Inc.||Low temperature P+ polycrystalline silicon material for non-volatile memory device|
|US8659929||30 juin 2011||25 févr. 2014||Crossbar, Inc.||Amorphous silicon RRAM with non-linear device and operation|
|US8659933||29 mai 2013||25 févr. 2014||Crossbar, Inc.||Hereto resistive switching material layer in RRAM device and method|
|US8675384 *||12 oct. 2012||18 mars 2014||Crossbar, Inc.||Circuit for concurrent read operation and method therefor|
|US8716098||9 mars 2012||6 mai 2014||Crossbar, Inc.||Selective removal method and structure of silver in resistive switching device for a non-volatile memory device|
|US8717804||29 déc. 2011||6 mai 2014||Kabushiki Kaisha Toshiba||Three dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array|
|US8750019||21 déc. 2012||10 juin 2014||Crossbar, Inc.||Resistive memory using SiGe material|
|US8755215 *||31 juil. 2012||17 juin 2014||SK Hynix Inc.||Resistive memory device|
|US8765566||10 mai 2012||1 juil. 2014||Crossbar, Inc.||Line and space architecture for a non-volatile memory device|
|US8773889||20 févr. 2013||8 juil. 2014||Kabushiki Kaisha Toshiba||Semiconductor memory device|
|US8791010||29 déc. 2011||29 juil. 2014||Crossbar, Inc.||Silver interconnects for stacked non-volatile memory device and method|
|US8796658||7 mai 2012||5 août 2014||Crossbar, Inc.||Filamentary based non-volatile resistive memory device and method|
|US8809831||30 mars 2012||19 août 2014||Crossbar, Inc.||On/off ratio for non-volatile memory device and method|
|US8815696||29 déc. 2011||26 août 2014||Crossbar, Inc.||Disturb-resistant non-volatile memory device using via-fill and etchback technique|
|US8829646||27 avr. 2009||9 sept. 2014||Macronix International Co., Ltd.||Integrated circuit 3D memory array and manufacturing method|
|US8848424||15 nov. 2012||30 sept. 2014||Panasonic Corporation||Variable resistance nonvolatile memory device, and accessing method for variable resistance nonvolatile memory device|
|US8860111||12 avr. 2012||14 oct. 2014||Macronix International Co., Ltd.||Phase change memory cell array with self-converged bottom electrode and method for manufacturing|
|US8884261||23 août 2010||11 nov. 2014||Crossbar, Inc.||Device switching using layered device structure|
|US8885387||21 nov. 2012||11 nov. 2014||Panasonic Corporation||Cross point variable resistance nonvolatile memory device|
|US8889521||14 sept. 2012||18 nov. 2014||Crossbar, Inc.||Method for silver deposition for a non-volatile memory device|
|US8912523||25 avr. 2013||16 déc. 2014||Crossbar, Inc.||Conductive path in switching material in a resistive random access memory device and control|
|US8916414||26 sept. 2013||23 déc. 2014||Macronix International Co., Ltd.||Method for making memory cell by melting phase change material in confined space|
|US8930174||31 mars 2011||6 janv. 2015||Crossbar, Inc.||Modeling technique for resistive random access memory (RRAM) cells|
|US8934280||6 févr. 2013||13 janv. 2015||Crossbar, Inc.||Capacitive discharge programming for two-terminal memory cells|
|US8946046||2 mai 2012||3 févr. 2015||Crossbar, Inc.||Guided path for forming a conductive filament in RRAM|
|US8946669||15 août 2012||3 févr. 2015||Crossbar, Inc.||Resistive memory device and fabrication methods|
|US8946673||24 août 2012||3 févr. 2015||Crossbar, Inc.||Resistive switching device structure with improved data retention for non-volatile memory device and method|
|US8947908||17 juin 2013||3 févr. 2015||Crossbar, Inc.||Hetero-switching layer in a RRAM device and method|
|US8981330||16 juil. 2012||17 mars 2015||Macronix International Co., Ltd.||Thermally-confined spacer PCM cells|
|US8982605 *||23 sept. 2014||17 mars 2015||SK Hynix Inc.||Phase change memory device having multi-level and method of driving the same|
|US8982606||23 sept. 2014||17 mars 2015||SK Hynix Inc.||Phase change memory device having multi-level and method of driving the same|
|US8982647||14 nov. 2012||17 mars 2015||Crossbar, Inc.||Resistive random access memory equalization and sensing|
|US8987700||2 déc. 2011||24 mars 2015||Macronix International Co., Ltd.||Thermally confined electrode for programmable resistance memory|
|US8988927||11 févr. 2013||24 mars 2015||Crossbar, Inc.||Non-volatile variable capacitive device including resistive memory cell|
|US8993397||27 août 2013||31 mars 2015||Crossbar, Inc.||Pillar structure for memory device and method|
|US9001552||22 juin 2012||7 avr. 2015||Crossbar, Inc.||Programming a RRAM method and apparatus|
|US9003242||23 mars 2012||7 avr. 2015||Kabushiki Kaisha Toshiba||Semiconductor memory device and method of controlling the same|
|US9012307||13 juil. 2010||21 avr. 2015||Crossbar, Inc.||Two terminal resistive switching device structure and method of fabricating|
|US9013911||21 juin 2012||21 avr. 2015||Crossbar, Inc.||Memory array architecture with two-terminal memory cells|
|US9035276||7 févr. 2014||19 mai 2015||Crossbar, Inc.||Stackable non-volatile resistive switching memory device|
|US9036400||5 nov. 2013||19 mai 2015||Crossbar, Inc.||Method and structure of monolithically integrated IC and resistive memory using IC foundry-compatible processes|
|US9047939||28 janv. 2014||2 juin 2015||Crossbar, Inc.||Circuit for concurrent read operation and method therefor|
|US9058865||15 juin 2012||16 juin 2015||Crossbar, Inc.||Multi-level cell operation in silver/amorphous silicon RRAM|
|US9059705||30 juin 2011||16 juin 2015||Crossbar, Inc.||Resistive random accessed memory device for FPGA configuration|
|US9082485 *||25 nov. 2013||14 juil. 2015||Micron Technology, Inc.||Apparatuses and methods including memory array and data line architecture|
|US9082954||15 août 2011||14 juil. 2015||Macronix International Co., Ltd.||PCRAM with current flowing laterally relative to axis defined by electrodes|
|US9087575||23 sept. 2014||21 juil. 2015||SK Hynix Inc.||Phase change memory device having multi-level and method of driving the same|
|US9087576||29 mars 2012||21 juil. 2015||Crossbar, Inc.||Low temperature fabrication method for a three-dimensional memory device and structure|
|US9112145||31 janv. 2013||18 août 2015||Crossbar, Inc.||Rectified switching of two-terminal memory via real time filament formation|
|US9129887||11 janv. 2013||8 sept. 2015||Crossbar, Inc.||Resistor structure for a non-volatile memory device and method|
|US9153623||29 déc. 2011||6 oct. 2015||Crossbar, Inc.||Thin film transistor steering element for a non-volatile memory device|
|US9177614||28 juil. 2014||3 nov. 2015||Micron Technology, Inc.||Apparatuses and methods including memory with top and bottom data lines|
|US9191000||28 janv. 2014||17 nov. 2015||Crossbar, Inc.||Field programmable gate array utilizing two-terminal non-volatile memory|
|US9214351||19 août 2013||15 déc. 2015||Macronix International Co., Ltd.||Memory architecture of thin film 3D array|
|US9236568||29 juil. 2013||12 janv. 2016||Macronix International Co., Ltd.||Sidewall thin film electrode with self-aligned top electrode and programmable resistance memory|
|US9252191||22 juil. 2011||2 févr. 2016||Crossbar, Inc.||Seed layer for a p+ silicon germanium material for a non-volatile memory device and method|
|US9312483||24 sept. 2012||12 avr. 2016||Crossbar, Inc.||Electrode structure for a non-volatile memory device and method|
|US9324942||31 janv. 2013||26 avr. 2016||Crossbar, Inc.||Resistive memory cell with solid state diode|
|US9336879||23 janv. 2015||10 mai 2016||Macronix International Co., Ltd.||Multiple phase change materials in an integrated circuit for system on a chip application|
|US20080112211 *||7 janv. 2008||15 mai 2008||Kabushiki Kaisha Toshiba||Phase changing memory device|
|US20080304308 *||25 juil. 2008||11 déc. 2008||Hitachi Global Storage Technologies Netherlands B.V.||Unipolar resistance random access memory (rram) device and vertically stacked architecture|
|US20090168505 *||15 déc. 2008||2 juil. 2009||Hitachi, Ltd.||Semiconductor device|
|US20090194758 *||5 févr. 2008||6 août 2009||Macronix International Co., Ltd.||Heating center pcram structure and methods for making|
|US20090256133 *||9 avr. 2008||15 oct. 2009||Kau Derchang||Multiple layer resistive memory|
|US20100052116 *||31 août 2007||4 mars 2010||Nxp, B.V.||Fabrication of self-assembled nanowire-type interconnects on a semiconductor device|
|US20100124097 *||30 oct. 2009||20 mai 2010||Kabushiki Kaisha Toshiba||Semiconductor storage device|
|US20100165702 *||14 sept. 2009||1 juil. 2010||Haruki Toda||Three dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array|
|US20100184803 *||7 mars 2008||22 juil. 2010||Link Medicine Corporation||Treatment of Lysosomal Storage Diseases|
|US20100270593 *||27 avr. 2009||28 oct. 2010||Macronix International Co., Ltd.||Integrated circuit 3d memory array and manufacturing method|
|US20100277968 *||4 nov. 2010||Naoya Tokiwa||Semiconductor memory device|
|US20100315866 *||18 déc. 2009||16 déc. 2010||Hynix Semiconductor Inc.||Phase change memory device having multi-level and method of driving the same|
|US20110002157 *||14 sept. 2010||6 janv. 2011||Naoharu Shimomura||Resistance change type memory|
|US20110013447 *||20 janv. 2011||Hitachi, Ltd.||Semiconductor device|
|US20110216583 *||8 sept. 2011||Hitachi, Ltd.||Semiconductor device|
|US20120074374 *||29 sept. 2010||29 mars 2012||Crossbar, Inc.||Conductive path in switching material in a resistive random access memory device and control|
|US20130033923 *||12 oct. 2012||7 févr. 2013||Crossbar, Inc.||Circuit for concurrent read operation and method therefor|
|US20140036569 *||31 juil. 2012||6 févr. 2014||Hyunsu YOON||Resistive memory device|
|US20140078827 *||25 nov. 2013||20 mars 2014||Micron Technology, Inc.||Apparatuses and methods including memory array and data line architecture|
|US20150009752 *||23 sept. 2014||8 janv. 2015||SK Hynix Inc.||Phase change memory device having multi-level and method of driving the same|
|Classification aux États-Unis||365/148, 365/151, 365/163|
|Classification internationale||H01L27/24, G11C11/00, G11C13/02, G11C11/36|
|Classification coopérative||G11C13/0069, H01L27/2481, H01L27/2409, G11C2213/15, G11C2013/009, G11C2213/71, G11C2213/72, G11C13/0011, H01L45/1233, H01L45/085, H01L45/143, H01L45/142|
|Classification européenne||G11C13/00R25W, H01L45/16P2, H01L27/24H3, H01L27/24F, H01L45/16P4, H01L45/12D4, H01L45/14B, H01L45/16M, H01L45/14B2, H01L45/14B4, H01L45/08M, H01L27/24D, G11C13/00R5B|
|1 sept. 2005||AS||Assignment|
Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TODA, HARUKI;REEL/FRAME:017747/0540
Effective date: 20050819
|6 mars 2013||FPAY||Fee payment|
Year of fee payment: 4