Fan, Zhiyong and Ho, Johnny C. and Jacobson, Zachery A. and Yerushalmi, Roie and Alley, Robert L. and Razavi, Haleh and Javey, Ali. (2008) Wafer-Scale Assembly of Highly Ordered Semiconductor Nanowire Arrays by Contact Printing. Nano Letters, 8 (1). pp. 20-25. ISSN 1530-6984Full text not available from this repository.
Controlled and uniform assembly of “bottom-up” nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a simple contact printing process. The assembled NW pitch is shown to be readily modulated through the surface chemical treatment of the receiver substrate, with the highest density approaching 8 NW/μm, 95% directional alignment, and wafer-scale uniformity. Such fine control in the assembly is attained by applying a lubricant during the contact printing process which significantly minimizes the NW−NW mechanical interactions, therefore enabling well-controlled transfer of nanowires through surface chemical binding interactions. Furthermore, we demonstrate that our printing approach enables large-scale integration of NW arrays for various device structures on both rigid silicon and flexible plastic substrates, with a controlled semiconductor channel width ranging from a single NW (10 nm) up to 250 μm, consisting of a parallel array of over 1250 NWs and delivering over 1 mA of ON current.
|InterNano Taxonomy:||Nanoscale Objects and Nanostructured Materials > Nanowires
Nanomanufacturing Processes > Assembly Techniques
|Collections:||Nanomanufacturing Research Collection|
|Depositing User:||Rebecca Reznik-Zellen|
|Date Deposited:||28 Oct 2009 15:19|
|Last Modified:||28 Oct 2009 15:19|
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