|Publication number||US6969638 B2|
|Application number||US 10/677,438|
|Publication date||Nov 29, 2005|
|Filing date||Oct 2, 2003|
|Priority date||Jun 27, 2003|
|Also published as||US20050074920|
|Publication number||10677438, 677438, US 6969638 B2, US 6969638B2, US-B2-6969638, US6969638 B2, US6969638B2|
|Inventors||Erwin R. Estepa, Joel T. Medina, Maria Alesssandra Azurin, Kazuaki Ano|
|Original Assignee||Texas Instruments Incorporated|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (34), Referenced by (8), Classifications (20), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This Application claims the benefit of U.S. Provisional Application Ser. No. 60/483,457, filed on Jun. 27, 2003, which is commonly assigned with the present Application and incorporated herein by reference for all purposes.
Disclosed embodiments relate generally to integrated circuits, and more particularly to methods for assembling integrated circuit assemblies, as well as the resulting integrated circuit assemblies, by employing a surface treatment on bondpad surfaces prior to soldering terminals to the bondpads.
Integrated circuits (ICs) are usually formed on semiconductor wafers. The wafers are separated into individual dies or chips, and the individual chips are then handled and packaged. The packaging process is one of the most critical steps in the IC fabrication process, both from the point of view of cost and of reliability. For example, the packaging cost can easily exceed the cost of the IC chip itself. In addition, many of the device failures that occur are generally packaging related.
The IC chip should be packaged in a suitable medium that will protect it in subsequent manufacturing steps, as well as from the environment of its intended application. Wire-bonding and encapsulation are the two main steps employed in the packaging process. Wire-bonding connects the leads from the IC chip to terminals on one side of the package substrate. Following wire-bonding of the IC chip to the package substrate, encapsulation is employed to seal the surfaces from moisture and contamination and to protect the wire-bonding and other components from corrosion and mechanical shock.
The terminals to which the leads of the IC chip are wire-bonded are electrically coupled through the package substrate, using vias extending through the package substrate, to package bondpads on a second, opposing side of the package substrate. These bondpads on the package substrate allow the completed package to be connected to other components. Specifically, the exposed bondpads have a solder ball attached to them. As a result, an array of solder balls is formed on the bondpads so that the package may be electrically and mechanically coupled to other circuitry, generally through a printed circuit board (PCB), using the array of solder balls that is referred to as a ball grid array (BGA). When such a BGA is employed to connect the package, it may be referred to as a BGA package.
Unfortunately, the material typically used for the bondpads, for example, copper, oxidizes when remaining exposed throughout the assembly process, until the bondpads are soldered. Oxidation on the surface of the bondpads, as well as contaminants that may gather on the bondpad surface when exposed during the assembly process, often detrimentally affect the metallurgical bond between the bondpads and the corresponding traces on the PCB. Specifically, the dielectric nature of the oxidation may affect the electrical connection between the two, while in some cases also affecting the strength of the bond used to hold the IC package to the PCB. Problems with the electrical connections between the bondpads on the packages and PCBs, as well as the strength of the mechanical bond between the two, can often affect the overall operation and longevity of the assembly.
Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate having electrical terminals on a first side of the substrate and a bondpad on a second side of the substrate opposing the first side. In this embodiment, the bondpad is electrically coupled to at least one of the terminals on the first side. In addition, the method includes mounting an integrated circuit chip to the first side of the substrate, where the integrated circuit component has a lead adapted to be wire-bonded to the terminal. The method further includes removing oxidation from the bondpad, where the bondpad is adapted to be metallurgically bonded to a trace on a printed circuit board. Moreover, this embodiment of the method includes metallurgically bonding the bondpad to the trace.
In another aspect, an integrated circuit assembly is disclosed. In one embodiment, the assembly includes a substrate having electrical terminals on a first side thereof. The assembly also includes a bondpad on a second side of the substrate opposing the first side, where the bondpad is electrically coupled to at least one of the terminals. In addition, the assembly includes an integrated circuit chip mounted to the first side of the substrate, where the integrated circuit chip has lead adapted to be wire-bonded to the terminal. The assembly still further includes a solder joint metallurgically bonded to the bondpad and adapted to metallurgically bond the bondpad to a trace on a printed circuit board.
Reference is now made to the following detailed description of the preferred embodiments, taken in conjunction with the accompanying drawings. It is emphasized that various features may not be drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion. In addition, it is emphasized that some components may not be illustrated for clarity of discussion. Reference is now made to the following description taken in conjunction with the accompanying drawings, in which:
Referring initially to
The IC assembly 100 further includes multiple electrical terminals (one of which is labeled 120) formed on a first side of the substrate 110. In an advantageous embodiment, the terminals 120 may be formed from copper, and may be electrically connected through the substrate 110 using vias 125. The IC assembly 100 further includes a plurality of package bondpads (one of which is labeled 130) formed on the second side of the substrate 110. As illustrated, various ones of the bondpads 130 are electrically interconnected to various ones of the terminals 120 through the vias 125. Typically, the bondpads 130 provide an electrically conductive surface through which the IC assembly 100 may be electrically coupled to a PCB (not illustrated) to form complete and functional circuitry.
Also in the illustrated embodiment, an IC chip 140 is mounted on the first side of the substrate 110. The IC chip 140 is mounted to the substrate 110 using leads (one of which is labeled 150) extending from the body of the IC chip 140. These leads 150 provide the electrical interconnection between the circuitry within the IC chip 140 and the substrate 110 to form an operative IC package assembly. More specifically, the leads 150 of the IC chip 140 are wire-bonded to the terminals 120 on the substrate 110, but other types of metallurgical bonding may also be employed. Once the chip 140 is mounted on the substrate 110, but before the soldering of the bondpads 130 to a PCB, the surface treatment provided by the principles disclosed herein is performed on the substrate 110. A specific example of the process employed for this surface treatment is illustrated and described with reference to FIG. 2.
At block 210, a substrate is provided for the IC assembly. In one embodiment, the substrate is comprised of dielectric material and includes electrical interconnection in the form of vias through the substrate, as shown in FIG. 1. At block 215, electrical interconnects, such as the terminals 120 illustrated in
However, as mentioned above, while copper is an excellent electrical conductor, the exposed copper surface of the bondpads typically oxidizes when left exposed during the manufacturing process used to form the IC assembly and prepare it for mounting to a PCB. As the exposed surface of the bondpads oxidizes, the impurities and dielectric material that form during oxidation detrimentally affect the connection between traces on a PCB and the oxidized bondpad. Specifically, such oxidation or contamination may result in a weak metallurgical bond between the surface of the bondpad and the solder (e.g. solder balls) used to affix the bondpad to the PCB. Moreover, the oxidation may also affect the electrical connection between the bondpad and the trace on the PCB, possible affecting overall assembly operation. To combat such oxidation, conventional techniques typically plate copper bondpads with conductive metals that do not usually suffer from significant oxidation. For example, many current techniques plate the copper bondpads with nickel and/or gold soon after the formation of the bondpads. If such plating is delayed until later in the assembly process, the copper bondpads may begin to oxidize even before the plating can be done, which may detrimentally affect the plating itself. Thus, by plating the bondpads soon after formation, the plating used in conventional techniques typically prevents oxidation by covering the bondpads from exposure.
In contrast to such conventional techniques, the process disclosed herein can allow the bondpads to remain exposed during early stages of the process, alleviating the need to have a plating step during the manufacturing process. As such, at block 225, IC the substrate may simply be metallurgically bonded to the PCB without the need to divert the process to a plating step. In an exemplary embodiment, at block 230, the IC chips mounted on the substrate are encapsulated, in accordance with conventional techniques. Typically, such an encapsulation step promotes further oxidation of the copper bondpads due primarily to the extreme temperatures imparted on the assembly. However, since the novel process disclosed herein provides for the removal of oxidation from the surfaces of the bondpads before soldering, even after encapsulation, accelerated oxidation does not detrimentally affect the assembly process or the operation of the resulting IC assembly. Of course, encapsulation of various chips or other areas of the IC assembly need not be performed in order to enjoy the benefits provided by the surface treatment disclosed herein.
To begin the disclosed surface treatment, at block 235 oxidation formed on the surface of the bondpads is removed. In a particularly advantageous embodiment, the oxidation is removed using a solution having an etchant. In such an embodiment, the solution containing the etchant may be sprayed onto the bondpads during the assembly process, or the entire substrate may simply be submerged in a solution having an etchant. In an exemplary embodiment, the etchant comprises potassium peroxymonosulfate. In a more specific embodiment, the solution may be a water-based solution, and may include about 80 grams to about 120 grams of potassium peroxymonosulfate per liter of water. In another specific embodiment, the solution containing the etchant may also include about 1% to about 3% sulfuric acid per volume. In a related embodiment, the etchant solution is applied to the bondpads at about room temperature, however other temperatures may also be appropriate. At block 240, the solution having the etchant is rinsed from the substrate to prevent further etching of the materials thereon unnecessarily. In one embodiment, the etching solution is rinsed with deionized water, but other rinsing agents may also be employed.
In the exemplary embodiments discussed above, concentrations of the various compounds in the solution are selected to provide for the removal of oxidation from bondpads manufactured from copper. It should be understood, however, that bondpads formed from other oxidizing materials may require adjustments in these concentrations, as well as in saturation times and process temperatures. Such variations in the parameters of the process disclosed herein are readily determinable by persons skilled in the pertinent field of art for the present process, and remain within the broad scope of the disclosed process. As such, the novel surface treatment may be easily adapted for use with bondpads or other assembly portions that may be detrimentally affected by oxidation, which are constructed from materials other than copper, while still falling within the scope of the claims set forth herein.
Moving on to block 245, an anti-tarnish coating is applied to the substrate, to coat the freshly etched bondpad surfaces. Since the bondpads are constructed from material that oxidizes upon exposure to the elements, as mentioned above, applying an anti-tarnish coating to the etched surfaces of the bondpads is important, although not required, to prevent future oxidation of those surfaces. Like the solution containing the etchant, the anti-tarnish coating may be applied by spraying the substrate with a solution containing the anti-tarnish compound. Alternatively, the substrate may be submerged in an anti-tarnish solution to apply the anti-tarnish coating. In an exemplary embodiment, the anti-tarnish solution comprises methyl alcohol, benzotriazole, a nonionic surfactant, and water. In a more specific, but related, embodiment, the anti-tarnish solution comprises about 5% methyl alcohol, about 1% benzotriazole, about 3% nonionic surfactant, and about 91% water.
In other embodiments, the anti-tarnish solution may further comprise about 1% to about 2.5% sulfuric acid per volume. Of course, other mixtures and concentrations may be used to create the anti-tarnish solution. In yet another embodiment, the anti-tarnish coating may be formed over the surfaces of the bondpads using a process temperature of about 60° C. As with the removal of oxidation using a solution having an etchant, variations in the parameters of the application of the anti-tarnish coating may also be determinable by persons skilled in the pertinent field of art for the present process, depending on the materials involved and the results desired. However, such variations in parameters remain within the broad scope of the disclosed process. Moving on to block 250, the anti-tarnish coating formed on the surfaces of the bondpads is dried so the assembly may quickly move on in the assembly process. Such drying may be accomplished by blowing heated air over the substrates, or, alternatively, by exposing the substrates to an appropriate heat source. Of course, accelerated drying is not required, and the substrates may also simply be air-dried before moving on in the assembly process.
In the final stages of the assembly process disclosed in
Turning now to
The bonding point 300 also illustrates a solder ball 160, which is metallurgically bonded to the surface of the bondpad 130. In accordance with the process illustrated in
Yet another advantage to the surface treatment disclosed herein is the roughening of the surface of the bondpad 130 that typically occurs when the oxidation is removed using an etchant. As is well known, applying an etchant to a material typically results in a rough finish left on the surface of the material. As shown in
Looking finally at
Also illustrated in
By employing the surface treatment disclosed herein, the costs associated with manufacturing IC assemblies may be significantly reduced. Specifically, as discussed above, conventional techniques typically deposit a plating material, such as nickel or gold, over the surface of IC bondpads in an effort to avoid the issues caused by oxidation of the bondpads during the remainder of the manufacturing process. In addition, other stages of the process, such as the encapsulation stage, may even promote increased oxidation due to the elevated temperatures involved. However, by employing the novel surface treatment disclosed herein, costly plating materials, as well as the time associated with completing the plating process, may be avoided altogether.
Moreover, even in processes incorporating plating of the bondpad surfaces, later stages of the manufacturing process may result in contaminants landing or forming on the outer surface of the plating, possibly detrimentally affecting the bonding of the bondpads to the traces on a PCB. Since the surface treatment provided herein is employed late in the manufacturing process, such contaminants that may be present, in addition to the oxidation, may also be removed from the bondpad surfaces during the surface treatment. Furthermore, by forming an anti-tarnish coating over the freshly etched bondpad surfaces, further oxidation or contamination of those surfaces may be prevented. Additionally, contaminants that may land or form on the outer surface of the anti-tarnish coating are simply removed when the anti-tarnish coating is removed with flux during the soldering process used to attach the solder balls. Still further, by employing an etchant in the surface treatment of the bondpads, the bondpad surfaces may be left with a rough finish, promoting the strength of the metallurgical bond created between the bondpad surfaces and the solder balls, which also promotes a better electrical connection between the bondpads and the PCB.
While various embodiments of the surface treatment according to the principles disclosed herein, as well as completed IC assemblies and methods of manufacturing incorporating the surface treatment, have been described above, it should be understood that they have been presented by way of example only, and not limitation. Thus, the breadth and scope of the invention(s) should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents. Moreover, the above advantages and features are provided in described embodiments, but shall not limit the application of the claims to processes and structures accomplishing any or all of the above advantages.
Additionally, the section headings herein are provided for consistency with the suggestions under 37 CFR 1.77 or otherwise to provide organizational cues. These headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure. Specifically and by way of example, although the headings refer to a “Technical Field,” the claims should not be limited by the language chosen under this heading to describe the so-called technical field. Further, a description of a technology in the “Background” is not to be construed as an admission that technology is prior art to any invention(s) in this disclosure. Neither is the “Brief Summary” to be considered as a characterization of the invention(s) set forth in the claims found herein. Furthermore, any reference in this disclosure to “invention” in the singular should not be used to argue that there is only a single point of novelty claimed in this disclosure. Multiple inventions may be set forth according to the limitations of the multiple claims associated with this disclosure, and the claims accordingly define the invention(s), and their equivalents, that are protected thereby. In all instances, the scope of the claims shall be considered on their own merits in light of the specification, but should not be constrained by the headings set forth herein.
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|U.S. Classification||438/115, 438/687|
|International Classification||H01L21/48, H05K3/38, H01L21/44, H05K3/28, H05K3/34, H01L23/50, H01L21/50|
|Cooperative Classification||H01L2924/01019, H01L2924/14, H05K3/383, H05K2201/10734, H01L2224/48227, H01L2924/01078, H05K3/3457, H05K3/282, H01L2924/01079, H05K3/3489|
|Oct 2, 2003||AS||Assignment|
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ESTEPA, ERWIN R.;MEDINA, JOEL T.;AZURIN, MARIA A. KATINKA;REEL/FRAME:014584/0204
Effective date: 20031001
|Apr 15, 2004||AS||Assignment|
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ANO, KAZUAKI;REEL/FRAME:015216/0271
Effective date: 20040324
|Mar 26, 2009||FPAY||Fee payment|
Year of fee payment: 4
|Mar 18, 2013||FPAY||Fee payment|
Year of fee payment: 8