<s>
A	O
water	B-Device
block	I-Device
is	O
the	O
watercooling	O
equivalent	O
of	O
a	O
heatsink	O
.	O
</s>
<s>
It	O
is	O
a	O
type	O
of	O
plate	O
heat	O
exchanger	O
and	O
can	O
be	O
used	O
on	O
many	O
different	O
computer	O
components	O
,	O
including	O
the	O
central	B-General_Concept
processing	I-General_Concept
unit	I-General_Concept
(	O
CPU	O
)	O
,	O
GPU	B-Architecture
,	O
PPU	O
,	O
and	O
northbridge	B-Device
chipset	O
on	O
the	O
motherboard	O
.	O
</s>
<s>
The	O
second	O
part	O
,	O
the	O
"	O
top	O
"	O
ensures	O
the	O
water	O
is	O
contained	O
safely	O
inside	O
the	O
water	B-Device
block	I-Device
and	O
has	O
connections	O
that	O
allow	O
hosing	O
to	O
connect	O
it	O
with	O
the	O
water	O
cooling	O
loop	O
.	O
</s>
<s>
Most	O
newer	O
high-end	O
water	B-Device
blocks	I-Device
also	O
contain	O
mid-plates	O
which	O
serve	O
to	O
add	O
jet	O
tubes	O
,	O
nozzles	O
,	O
and	O
other	O
flow	O
altering	O
devices	O
.	O
</s>
<s>
Trial	O
and	O
error	O
and	O
the	O
evolution	O
of	O
water	B-Device
block	I-Device
design	O
has	O
shown	O
that	O
trading	O
flow	O
for	O
turbulence	O
can	O
often	O
improve	O
performance	O
.	O
</s>
<s>
The	O
Storm	O
series	O
of	O
water	B-Device
blocks	I-Device
is	O
an	O
example	O
of	O
this	O
.	O
</s>
<s>
A	O
water	B-Device
block	I-Device
is	O
better	O
at	O
dissipating	O
heat	O
than	O
an	O
air-cooled	O
heatsink	O
due	O
to	O
water	O
's	O
higher	O
specific	O
heat	O
capacity	O
and	O
thermal	O
conductivity	O
.	O
</s>
<s>
A	O
radiator	O
is	O
more	O
efficient	O
than	O
a	O
standard	O
CPU	O
or	O
GPU	B-Architecture
heatsink/air	O
cooler	O
at	O
removing	O
heat	O
because	O
it	O
has	O
a	O
much	O
larger	O
surface	O
area	O
.	O
</s>
<s>
Installation	O
of	O
a	O
water	B-Device
block	I-Device
is	O
also	O
similar	O
to	O
that	O
of	O
a	O
heatsink	O
,	O
with	O
a	O
thermal	O
pad	O
or	O
thermal	O
grease	O
placed	O
between	O
it	O
and	O
the	O
device	O
being	O
cooled	O
to	O
aid	O
in	O
heat	O
conduction	O
.	O
</s>
