<s>
Wafering	B-Algorithm
is	O
the	O
process	O
by	O
which	O
a	O
silicon	O
crystal	O
(	O
boule	B-Algorithm
)	O
is	O
made	O
into	O
wafers	B-Architecture
.	O
</s>
<s>
This	O
process	O
is	O
usually	O
carried	O
out	O
by	O
a	O
multi-wire	O
saw	O
which	O
cuts	O
multiple	O
wafers	B-Architecture
from	O
the	O
same	O
crystal	O
at	O
the	O
same	O
time	O
.	O
</s>
<s>
These	O
wafers	B-Architecture
are	O
then	O
polished	O
to	O
the	O
desired	O
degree	O
of	O
flatness	O
and	O
thickness	O
.	O
</s>
<s>
The	O
motivation	O
behind	O
this	O
evolution	O
was	O
to	O
reduce	O
material	O
losses	O
from	O
the	O
saw	O
's	O
kerf	O
,	O
and	O
to	O
improve	O
wafer	B-Architecture
's	O
surface	O
quality	O
,	O
flatness	O
,	O
and	O
bow	O
.	O
</s>
