<s>
Wafer	B-Algorithm
bonding	I-Algorithm
is	O
a	O
packaging	O
technology	O
on	O
wafer-level	O
for	O
the	O
fabrication	O
of	O
microelectromechanical	B-Architecture
systems	I-Architecture
(	O
MEMS	B-Architecture
)	O
,	O
nanoelectromechanical	O
systems	O
(	O
NEMS	O
)	O
,	O
microelectronics	O
and	O
optoelectronics	O
,	O
ensuring	O
a	O
mechanically	O
stable	O
and	O
hermetically	O
sealed	O
encapsulation	O
.	O
</s>
<s>
The	O
wafers	B-Architecture
 '	O
diameter	O
range	O
from	O
100mm	O
to	O
200mm	O
(	O
4	O
inch	O
to	O
8	O
inch	O
)	O
for	O
MEMS/NEMS	O
and	O
up	O
to	O
300mm	O
(	O
12	O
inch	O
)	O
for	O
the	O
production	O
of	O
microelectronic	O
devices	O
.	O
</s>
<s>
Smaller	O
wafers	B-Architecture
were	O
used	O
in	O
the	O
early	O
days	O
of	O
the	O
microelectronics	O
industry	O
,	O
with	O
wafers	B-Architecture
being	O
just	O
1	O
inch	O
in	O
diameter	O
in	O
the	O
1950s	O
.	O
</s>
<s>
In	O
microelectromechanical	B-Architecture
systems	I-Architecture
(	O
MEMS	B-Architecture
)	O
and	O
nanoelectromechanical	O
systems	O
(	O
NEMS	O
)	O
,	O
the	O
package	O
protects	O
the	O
sensitive	O
internal	O
structures	O
from	O
environmental	O
influences	O
such	O
as	O
temperature	O
,	O
moisture	O
,	O
high	O
pressure	O
and	O
oxidizing	O
species	O
.	O
</s>
<s>
The	O
bonding	O
of	O
wafers	B-Architecture
requires	O
specific	O
environmental	O
conditions	O
which	O
can	O
generally	O
be	O
defined	O
as	O
follows	O
:	O
</s>
<s>
Hence	O
,	O
the	O
applied	O
technology	O
needs	O
to	O
be	O
chosen	O
in	O
respect	O
to	O
the	O
present	O
substrate	B-Architecture
and	O
defined	O
specification	O
like	O
max	O
.	O
</s>
<s>
The	O
bonded	O
wafers	B-Architecture
are	O
characterized	O
in	O
order	O
to	O
evaluate	O
a	O
technology	O
's	O
yield	O
,	O
bonding	O
strength	O
and	O
level	O
of	O
hermeticity	O
either	O
for	O
fabricated	O
devices	O
or	O
for	O
the	O
purpose	O
of	O
process	O
development	O
.	O
</s>
<s>
Therefore	O
,	O
several	O
different	O
approaches	O
for	O
the	O
bond	B-Algorithm
characterization	I-Algorithm
have	O
emerged	O
.	O
</s>
