<s>
Thermosonic	B-Algorithm
bonding	I-Algorithm
is	O
widely	O
used	O
to	O
wire	O
bond	O
silicon	O
integrated	O
circuits	O
into	O
computers	O
.	O
</s>
<s>
Alexander	B-Algorithm
Coucoulas	I-Algorithm
was	O
named	O
"	O
Father	O
of	O
Thermosonic	B-Algorithm
Bonding	I-Algorithm
"	O
by	O
George	O
Harman	O
,	O
the	O
world	O
's	O
foremost	O
authority	O
on	O
wire	O
bonding	O
,	O
where	O
he	O
referenced	O
Coucoulas	O
's	O
leading	O
edge	O
publications	O
in	O
his	O
book	O
,	O
Wire	O
Bonding	O
In	O
Microelectronics	O
.	O
</s>
<s>
Owing	O
to	O
the	O
well	O
proven	O
reliability	O
of	O
thermosonic	O
bonds	O
,	O
it	O
is	O
extensively	O
used	O
to	O
connect	O
the	O
central	B-General_Concept
processing	I-General_Concept
units	I-General_Concept
(	O
CPUs	O
)	O
,	O
which	O
are	O
encapsulated	O
silicon	O
integrated	O
circuits	O
that	O
serve	O
as	O
the	O
"	O
brains	O
"	O
of	O
today	O
's	O
computers	O
.	O
</s>
<s>
A	O
thermosonic	B-Algorithm
bonding	I-Algorithm
machine	O
includes	O
a	O
magnetostrictive	O
or	O
piezoelectric-type	O
transducer	O
which	O
is	O
used	O
to	O
convert	O
electrical	O
energy	O
into	O
vibratory	O
motion	O
which	O
is	O
known	O
as	O
piezoelectricity	O
.	O
</s>
<s>
As	O
a	O
result	O
of	O
the	O
frictional	O
action	O
and	O
ultrasonic	O
softening	O
induced	O
in	O
the	O
preheated	O
lead	O
wire	O
during	O
the	O
bonding	O
cycle	O
,	O
thermosonic	B-Algorithm
bonding	I-Algorithm
can	O
be	O
used	O
to	O
reliably	O
bond	O
high	O
melting	O
point	O
lead	O
wires	O
(	O
such	O
as	O
gold	O
and	O
lower	O
cost	O
aluminum	O
and	O
copper	O
)	O
using	O
relatively	O
low	O
bonding	O
parameters	O
.	O
</s>
<s>
Coucoulas	O
introduced	O
Thermosonic	B-Algorithm
bonding	I-Algorithm
which	O
significantly	O
improved	O
upon	O
the	O
bond-reliability	O
produced	O
by	O
available	O
commercial	O
solid-state	O
bonding	O
machines	O
where	O
he	O
pre-heated	O
the	O
lead	O
wire	O
(	O
and/or	O
metallized	O
silicon	O
chip	O
)	O
prior	O
to	O
introducing	O
an	O
ultrasonic	O
energy	O
cycle	O
.	O
</s>
<s>
Thermosonic	B-Algorithm
bonding	I-Algorithm
,	O
initially	O
referred	O
to	O
as	O
Hot	O
Work	O
Ultrasonic	O
Bonding	O
by	O
Alexander	B-Algorithm
Coucoulas	I-Algorithm
,	O
was	O
found	O
to	O
bond	O
a	O
wide	O
range	O
of	O
conductive	O
metals	O
such	O
as	O
aluminum	O
and	O
copper	O
wires	O
to	O
tantalum	O
and	O
palladium	O
thin	O
films	O
deposited	O
on	O
aluminum	O
oxide	O
and	O
glass	O
substrates	O
all	O
of	O
which	O
simulated	O
the	O
metallized	O
silicon	O
chip	O
.	O
</s>
<s>
At	O
present	O
,	O
the	O
majority	O
of	O
connections	O
to	O
the	O
silicon	O
integrated	O
circuit	O
chip	O
are	O
made	O
using	O
thermosonic	B-Algorithm
bonding	I-Algorithm
because	O
it	O
employs	O
lower	O
bonding	O
temperatures	O
,	O
forces	O
and	O
dwell	O
times	O
than	O
thermocompression	B-Algorithm
bonding	I-Algorithm
,	O
as	O
well	O
as	O
lower	O
vibratory	O
energy	O
levels	O
and	O
forces	O
than	O
ultrasonic	O
bonding	O
to	O
form	O
the	O
required	O
bond	O
area	O
.	O
</s>
<s>
Therefore	O
the	O
use	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
eliminates	O
damaging	O
the	O
relatively	O
fragile	O
silicon	O
integrated	O
circuit	O
chip	O
during	O
the	O
bonding	O
cycle	O
.	O
</s>
<s>
The	O
proven	O
reliability	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
has	O
made	O
it	O
the	O
process	O
of	O
choice	O
,	O
since	O
such	O
potential	O
failure	O
modes	O
could	O
be	O
costly	O
whether	O
they	O
occur	O
during	O
the	O
manufacturing	O
stage	O
or	O
detected	O
later	O
,	O
during	O
an	O
operational	O
field-failure	O
of	O
a	O
chip	O
which	O
had	O
been	O
connected	O
inside	O
a	O
computer	O
or	O
a	O
myriad	O
of	O
other	O
microelectronic	O
devices	O
.	O
</s>
<s>
Thermosonic	B-Algorithm
bonding	I-Algorithm
is	O
also	O
used	O
in	O
the	O
flip	B-Device
chip	I-Device
process	O
which	O
is	O
an	O
alternate	O
method	O
of	O
electrically	O
connecting	O
silicon	O
integrated	O
circuits	O
.	O
</s>
<s>
Josephson	O
effect	O
and	O
superconducting	O
interference	O
(	O
DC	O
SQUID	B-Protocol
)	O
devices	O
use	O
the	O
thermosonic	B-Algorithm
bonding	I-Algorithm
process	O
as	O
well	O
.	O
</s>
<s>
In	O
this	O
case	O
,	O
other	O
bonding	O
methods	O
would	O
degrade	O
or	O
even	O
destroy	O
YBaCuO7	O
microstructures	O
,	O
such	O
as	O
microbridges	O
,	O
Josephson	O
junctions	O
and	O
superconducting	O
interference	O
devices	O
(	O
DC	O
SQUID	B-Protocol
)	O
.	O
</s>
<s>
When	O
electrically	O
connecting	O
light-emitting	O
diodes	O
with	O
thermosonic	B-Algorithm
bonding	I-Algorithm
techniques	O
,	O
an	O
improved	O
performance	O
of	O
the	O
device	O
has	O
been	O
shown	O
.	O
</s>
