<s>
Surface	B-Algorithm
activated	I-Algorithm
bonding	I-Algorithm
(	O
SAB	O
)	O
is	O
a	O
low-temperature	O
wafer	B-Algorithm
bonding	I-Algorithm
technology	O
with	O
atomically	O
clean	O
and	O
activated	O
surfaces	O
.	O
</s>
<s>
Kondou	O
and	O
T	O
.	O
Suga	O
,	O
“	O
Room	O
temperature	O
SiO2	O
wafer	B-Algorithm
bonding	I-Algorithm
by	O
adhesion	O
layer	O
method	O
,	O
”	O
presented	O
at	O
the	O
Electronic	O
Components	O
and	O
Technology	O
Conference	O
(	O
ECTC	O
)	O
,	O
2011	O
IEEE	O
61st	O
,	O
2011	O
,	O
pp	O
.	O
</s>
