<s>
A	O
small	B-Algorithm
outline	I-Algorithm
integrated	I-Algorithm
circuit	I-Algorithm
(	O
SOIC	O
)	O
is	O
a	O
surface-mounted	O
integrated	O
circuit	O
(	O
IC	O
)	O
package	O
which	O
occupies	O
an	O
area	O
about	O
30	O
–	O
50%	O
less	O
than	O
an	O
equivalent	O
dual	B-Algorithm
in-line	I-Algorithm
package	I-Algorithm
(	O
DIP	B-Algorithm
)	O
,	O
with	O
a	O
typical	O
thickness	O
being	O
70%	O
less	O
.	O
</s>
<s>
They	O
are	O
generally	O
available	O
in	O
the	O
same	O
pin-outs	O
as	O
their	O
counterpart	O
DIP	B-Algorithm
ICs	O
.	O
</s>
<s>
The	O
SOIC	O
package	O
is	O
shorter	O
and	O
narrower	O
than	O
DIP	B-Algorithm
,	O
the	O
side-to-side	O
pitch	O
being	O
6mm	O
for	O
an	O
SOIC-14	O
(	O
from	O
lead	O
tip	O
to	O
lead	O
tip	O
)	O
,	O
and	O
the	O
body	O
width	O
being	O
3.9mm	O
.	O
</s>
<s>
Shrink	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
SSOP	O
)	O
chips	O
have	O
"	O
gull	O
wing	O
"	O
leads	O
protruding	O
from	O
the	O
two	O
long	O
sides	O
,	O
and	O
a	O
lead	O
spacing	O
of	O
0.0256inches	O
(	O
0.65mm	O
)	O
or	O
0.025inches	O
(	O
0.635mm	O
)	O
.	O
</s>
<s>
A	O
thin	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
TSOP	O
)	O
is	O
a	O
rectangular	O
,	O
thin-bodied	O
component	O
.	O
</s>
<s>
The	O
ICs	O
on	O
DRAM	O
memory	B-General_Concept
modules	I-General_Concept
were	O
usually	O
TSOPs	O
until	O
they	O
were	O
replaced	O
by	O
ball	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
BGA	O
)	O
.	O
</s>
<s>
A	O
thin-shrink	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
TSSOP	B-Algorithm
)	O
is	O
a	O
rectangular	O
,	O
thin-body	O
component	O
.	O
</s>
<s>
A	O
TSSOP	B-Algorithm
's	O
leg	O
count	O
can	O
range	O
from	O
8	O
to	O
64	O
.	O
</s>
<s>
TSSOPs	B-Algorithm
are	O
particularly	O
suited	O
for	O
gate	O
drivers	O
,	O
controllers	O
,	O
wireless	O
/	O
RF	O
,	O
op-amps	O
,	O
logic	O
,	O
analog	O
,	O
ASICs	O
,	O
memory	O
(	O
EPROM	B-General_Concept
,	O
E2PROM	B-General_Concept
)	O
,	O
comparators	O
and	O
optoelectronics	O
.	O
</s>
<s>
Memory	B-General_Concept
modules	I-General_Concept
,	O
disk	O
drives	O
,	O
recordable	O
optical	O
disks	O
,	O
telephone	O
handsets	O
,	O
speed	O
dialers	O
,	O
video	O
/	O
audio	O
and	O
consumer	O
electronics	O
/	O
appliances	O
are	O
suggested	O
uses	O
for	O
TSSOP	B-Algorithm
packaging	O
.	O
</s>
<s>
The	O
exposed	O
pad	O
(	O
EP	O
)	O
variant	O
of	O
small	O
outline	O
packages	O
can	O
increase	O
heat	O
dissipation	O
by	O
as	O
much	O
as	O
over	O
a	O
standard	O
TSSOP	B-Algorithm
,	O
thereby	O
expanding	O
the	O
margin	O
of	O
operating	O
parameters	O
.	O
</s>
