<s>
The	O
Compact	B-Device
Electronics	I-Device
Bay	I-Device
Specification	O
(	O
CEB	O
)	O
as	O
well	O
as	O
EEB	O
,	O
MEB	O
and	O
TEB	O
(	O
"	O
Thin	O
Electronics	O
Bay	O
"	O
)	O
are	O
standard	O
form	O
factors	O
for	O
dual	O
or	O
multi	O
processor	O
motherboards	B-Device
defined	O
by	O
the	O
Server	O
System	O
Infrastructure	O
(	O
SSI	O
)	O
Forum	O
.	O
</s>
<s>
The	O
SSI	B-Device
CEB	I-Device
specification	O
was	O
derived	O
from	O
the	O
EEB	O
and	O
ATX	B-Language
specifications	O
.	O
</s>
<s>
SSI	B-Device
CEB	I-Device
motherboards	B-Device
have	O
the	O
same	O
IO	O
connector	O
area	O
and	O
many	O
of	O
the	O
same	O
motherboard	B-Device
mounting	O
holes	O
as	O
ATX	B-Language
motherboards	B-Device
,	O
although	O
SSI	B-Device
CEB	I-Device
motherboards	B-Device
are	O
larger	O
in	O
size	O
than	O
ATX	B-Language
motherboards	B-Device
and	O
have	O
different	O
processor	O
mounting	O
holes	O
.	O
</s>
<s>
The	O
rear	O
panel	O
aperture	O
is	O
identical	O
to	O
the	O
EEB	O
and	O
ATX	B-Language
specification	O
and	O
expansion	O
cards	O
mounted	O
on	O
an	O
SSI	B-Device
CEB	I-Device
motherboard	B-Device
appear	O
much	O
the	O
same	O
as	O
they	O
would	O
on	O
an	O
ATX	B-Language
motherboard	B-Device
.	O
</s>
<s>
For	O
motherboards	B-Device
with	O
only	O
one	O
processor	O
installed	O
,	O
it	O
is	O
recommended	O
the	O
primary	O
processor	O
socket	O
be	O
populated	O
first	O
.	O
</s>
