<s>
The	O
problems	O
of	O
micro-processes	O
,	O
and	O
thin	O
films	O
and	O
must	O
be	O
fully	O
understood	O
as	O
they	O
apply	O
to	O
metallization	O
and	O
wire	B-Algorithm
bonding	I-Algorithm
.	O
</s>
<s>
Design	O
factors	O
affecting	O
semiconductor	O
reliability	O
include	O
:	O
voltage	O
,	O
power	O
,	O
and	O
current	O
derating	O
;	O
metastability	O
;	O
logic	O
timing	O
margins	O
(	O
logic	O
simulation	O
)	O
;	O
timing	B-Application
analysis	I-Application
;	O
temperature	O
derating	O
;	O
and	O
process	O
control	O
.	O
</s>
<s>
Cleanrooms	B-Application
control	O
impurities	O
,	O
</s>
