<s>
A	O
redistribution	B-Algorithm
layer	I-Algorithm
(	O
RDL	O
)	O
is	O
an	O
extra	O
metal	O
layer	O
on	O
an	O
integrated	O
circuit	O
that	O
makes	O
its	O
I/O	B-General_Concept
pads	I-General_Concept
available	O
in	O
other	O
locations	O
of	O
the	O
chip	O
,	O
for	O
better	O
access	O
to	O
the	O
pads	O
where	O
necessary	O
.	O
</s>
<s>
When	O
an	O
integrated	O
circuit	O
is	O
manufactured	O
,	O
it	O
usually	O
has	O
a	O
set	O
of	O
I/O	B-General_Concept
pads	I-General_Concept
that	O
are	O
wirebonded	B-Algorithm
to	O
the	O
pins	O
of	O
the	O
package	O
.	O
</s>
<s>
A	O
redistribution	B-Algorithm
layer	I-Algorithm
is	O
an	O
extra	O
layer	O
of	O
wiring	O
on	O
the	O
chip	O
that	O
enables	O
bond	O
out	O
from	O
different	O
locations	O
on	O
the	O
chip	O
,	O
making	O
chip-to-chip	O
bonding	O
simpler	O
.	O
</s>
<s>
Another	O
example	O
of	O
the	O
use	O
for	O
RDL	O
is	O
for	O
spreading	O
the	O
contact	O
points	O
around	O
the	O
die	O
so	O
that	O
solder	B-Algorithm
balls	I-Algorithm
can	O
be	O
applied	O
,	O
and	O
the	O
thermal	O
stress	O
of	O
mounting	O
can	O
be	O
spread	O
.	O
</s>
