<s>
Reactive	B-Algorithm
bonding	I-Algorithm
describes	O
a	O
wafer	B-Algorithm
bonding	I-Algorithm
procedure	O
using	O
highly	O
reactive	O
nanoscale	O
multilayer	O
systems	O
as	O
an	O
intermediate	O
layer	O
between	O
the	O
bonding	O
substrates	O
.	O
</s>
<s>
metals	O
,	O
polymers	B-Language
and	O
ceramics	O
,	O
can	O
be	O
used	O
without	O
thermal	O
damage	O
.	O
</s>
<s>
The	O
deposition	O
of	O
the	O
multilayer	O
systems	O
on	O
silicon	O
is	O
achieved	O
by	O
magnetron	O
sputtering	O
,	O
electroplating	O
or	O
etching	B-Algorithm
.	O
</s>
<s>
In	O
addition	O
,	O
this	O
method	O
enables	O
pattern	O
plating	O
to	O
prevent	O
complex	O
etching	B-Algorithm
process	O
of	O
structures	O
.	O
</s>
<s>
At	O
first	O
,	O
needles	O
in	O
the	O
silicon	O
substrate	O
are	O
created	O
by	O
dry	B-Algorithm
etching	I-Algorithm
.	O
</s>
<s>
The	O
system	O
alloy	B-Application
,	O
or	O
an	O
intermetallic	O
compound	O
,	O
(	O
AB	O
)	O
is	O
formed	O
from	O
the	O
intermixing	O
elements	O
(	O
A+B	O
)	O
due	O
to	O
atomic	O
diffusion	O
.	O
</s>
<s>
The	O
reactive	O
foil	O
is	O
ignited	O
by	O
an	O
energy	O
pulse	O
resulting	O
in	O
an	O
immediate	O
self-propagating	O
reaction	O
(	O
compare	O
to	O
figure	O
"	O
Schematic	O
reactive	B-Algorithm
bonding	I-Algorithm
process	O
with	O
a	O
reactive	O
multilayer	O
as	O
heat	O
source	O
"	O
)	O
.	O
</s>
<s>
Ni/Ti	O
or	O
Ti/Co	O
,	O
as	O
well	O
as	O
in	O
nanostructured	O
multilayer	O
systems	O
,	O
e.g.	O
</s>
<s>
vacuum	B-General_Concept
,	O
with	O
a	O
force	O
providing	O
a	O
defined	O
mechanical	O
pressure	O
at	O
room	O
temperature	O
.	O
</s>
<s>
Reactive	B-Algorithm
bonding	I-Algorithm
approach	O
is	O
used	O
to	O
assemble	O
MEMS	B-General_Concept
components	O
including	O
die	B-Algorithm
attachment	I-Algorithm
and	O
the	O
hermetic	O
sealing	O
of	O
micro-system	O
packages	B-Algorithm
.	O
</s>
