<s>
A	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
(	O
QFP	B-Algorithm
)	O
is	O
a	O
surface-mounted	O
integrated	O
circuit	O
package	B-Algorithm
with	O
"	O
gull	O
wing	O
"	O
leads	O
extending	O
from	O
each	O
of	O
the	O
four	O
sides	O
.	O
</s>
<s>
Socketing	O
such	O
packages	O
is	O
rare	O
and	O
through-hole	B-Algorithm
mounting	O
is	O
not	O
possible	O
.	O
</s>
<s>
Other	O
special	O
variants	O
include	O
low-profile	O
QFP	B-Algorithm
(	O
LQFP	O
)	O
and	O
thin	O
QFP	B-Algorithm
(	O
TQFP	O
)	O
.	O
</s>
<s>
The	O
QFP	B-Algorithm
component	O
package	B-Algorithm
type	O
became	O
common	O
in	O
Europe	O
and	O
United	O
States	O
during	O
the	O
early	O
nineties	O
,	O
even	O
though	O
it	O
has	O
been	O
used	O
in	O
Japanese	O
consumer	O
electronics	O
since	O
the	O
seventies	O
.	O
</s>
<s>
It	O
is	O
often	O
mixed	O
with	O
hole	B-Algorithm
mounted	I-Algorithm
,	O
and	O
sometimes	O
socketed	O
,	O
components	O
on	O
the	O
same	O
printed	O
circuit	O
board	O
(	O
PCB	O
)	O
.	O
</s>
<s>
A	O
package	B-Algorithm
related	O
to	O
QFP	B-Algorithm
is	O
plastic	B-Algorithm
leaded	I-Algorithm
chip	I-Algorithm
carrier	I-Algorithm
(	O
PLCC	O
)	O
which	O
is	O
similar	O
but	O
has	O
pins	O
with	O
larger	O
pitch	O
,	O
1.27mm	O
(	O
or	O
1/20inch	O
)	O
,	O
curved	O
up	O
underneath	O
a	O
thicker	O
body	O
to	O
simplify	O
socketing	O
(	O
soldering	O
is	O
also	O
possible	O
)	O
.	O
</s>
<s>
The	O
quad	O
flat-pack	O
has	O
connections	O
only	O
around	O
the	O
periphery	O
of	O
the	O
package	B-Algorithm
.	O
</s>
<s>
The	O
later	O
pin	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
PGA	O
)	O
and	O
ball	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
BGA	O
)	O
packages	O
,	O
by	O
allowing	O
connections	O
to	O
be	O
made	O
over	O
the	O
area	O
of	O
the	O
package	B-Algorithm
and	O
not	O
just	O
around	O
the	O
edges	O
,	O
allowed	O
for	O
higher	O
pin	O
counts	O
with	O
similar	O
package	B-Algorithm
sizes	O
,	O
and	O
reduced	O
the	O
problems	O
with	O
close	O
lead	O
spacing	O
.	O
</s>
<s>
A	O
clear	O
variation	O
is	O
bumpered	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
(	O
BQFP	O
)	O
with	O
extensions	O
at	O
the	O
four	O
corners	O
to	O
protect	O
the	O
leads	O
against	O
mechanical	O
damage	O
before	O
the	O
unit	O
is	O
soldered	O
.	O
</s>
<s>
Heat	O
sink	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
,	O
heatsink	O
very	O
thin	O
quad	O
flat-pack	O
no-leads	O
(	O
HVQFN	B-Algorithm
)	O
is	O
a	O
package	B-Algorithm
with	O
no	O
component	O
leads	O
extending	O
from	O
the	O
IC	O
.	O
</s>
<s>
A	O
thin	O
quad	B-Algorithm
flat	I-Algorithm
pack	I-Algorithm
(	O
TQFP	O
)	O
provides	O
the	O
same	O
benefits	O
as	O
the	O
metric	O
QFP	B-Algorithm
,	O
but	O
is	O
thinner	O
.	O
</s>
<s>
Regular	O
QFP	B-Algorithm
are	O
2.0	O
to	O
3.8mm	O
thick	O
depending	O
on	O
size	O
.	O
</s>
<s>
TQFP	O
packages	O
range	O
from	O
32	O
pins	O
with	O
a	O
0.8mm	O
lead	O
pitch	O
,	O
in	O
a	O
package	B-Algorithm
5mm	O
by	O
5mm	O
by	O
1mm	O
thick	O
,	O
to	O
256	O
pins	O
,	O
28mm	O
square	O
,	O
1.4mm	O
thick	O
and	O
a	O
lead	O
pitch	O
of	O
0.4mm	O
.	O
</s>
<s>
PQFP	O
,	O
or	O
plastic	O
quad	B-Algorithm
flat	I-Algorithm
pack	I-Algorithm
,	O
is	O
a	O
type	O
of	O
QFP	B-Algorithm
,	O
as	O
is	O
the	O
thinner	O
TQFP	O
package	B-Algorithm
.	O
</s>
<s>
A	O
low-profile	B-Algorithm
quad	I-Algorithm
flat	I-Algorithm
package	I-Algorithm
(	O
LQFP	O
)	O
is	O
a	O
surface	O
mount	O
integrated	O
circuit	O
package	B-Algorithm
format	O
with	O
component	O
leads	O
extending	O
from	O
each	O
of	O
the	O
four	O
sides	O
.	O
</s>
<s>
+Other	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
types	O
Package	B-Algorithm
description	O
BQFP	O
bumpered	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
BQFPH	O
bumpered	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
with	O
heat	O
spreader	O
CQFP	O
ceramic	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
EQFP	B-Algorithm
plastic	O
enhanced	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
FQFP	O
fine	O
pitch	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
LQFP	O
low	O
profile	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
MQFP	O
metric	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
NQFP	O
near	O
chip-scale	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
.	O
</s>
<s>
SQFP	B-Algorithm
small	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
TQFP	O
thin	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
VQFP	B-Algorithm
very	O
small	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
VTQFP	O
very	O
thin	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
TDFN	O
thin	O
dual	O
flat	O
no-lead	O
package	B-Algorithm
.	O
</s>
<s>
Some	O
QFP	B-Algorithm
packages	O
have	O
an	O
exposed	O
pad	O
.	O
</s>
<s>
The	O
exposed	O
pad	O
is	O
an	O
extra	O
pad	O
underneath	O
or	O
on	O
top	O
of	O
the	O
QFP	B-Algorithm
that	O
may	O
act	O
as	O
a	O
ground	O
connection	O
and/or	O
as	O
a	O
heat	O
sink	O
for	O
the	O
package	B-Algorithm
.	O
</s>
<s>
These	O
type	O
of	O
QFP	B-Algorithm
packages	O
often	O
have	O
a	O
-EP	O
suffix	O
(	O
e.g.	O
</s>
<s>
Ceramic	O
QFP	B-Algorithm
packages	O
come	O
in	O
two	O
variants	O
,	O
CERQUAD	O
and	O
CQFP	O
:	O
</s>
<s>
Hereby	O
the	O
leadframe	O
is	O
attached	O
between	O
two	O
ceramic	O
layers	O
of	O
the	O
package	B-Algorithm
.	O
</s>
<s>
This	O
package	B-Algorithm
is	O
a	O
variant	O
of	O
the	O
CERDIP	B-Algorithm
package	B-Algorithm
.	O
</s>
<s>
Hereby	O
the	O
leads	O
are	O
soldered	O
on	O
top	O
of	O
the	O
package	B-Algorithm
.	O
</s>
<s>
The	O
package	B-Algorithm
is	O
a	O
multilayer	O
package	B-Algorithm
,	O
and	O
is	O
offered	O
as	O
HTCC	O
(	O
high	O
temperature	O
co-fired	O
ceramic	O
)	O
.	O
</s>
<s>
Package	B-Algorithm
is	O
finished	O
with	O
a	O
nickel	O
plus	O
a	O
thick	O
gold	O
layer	O
,	O
except	O
where	O
the	O
leads	O
are	O
soldered	O
and	O
decoupling	O
capacitors	O
are	O
soldered	O
on	O
top	O
of	O
the	O
package	B-Algorithm
.	O
</s>
<s>
Seam	O
welding	O
gives	O
rise	O
to	O
significantly	O
less	O
temperature	O
rise	O
in	O
the	O
internal	O
of	O
the	O
package	B-Algorithm
(	O
e.g.	O
,	O
the	O
die	O
attach	O
)	O
.	O
</s>
<s>
This	O
package	B-Algorithm
is	O
the	O
main	O
package	B-Algorithm
used	O
for	O
Space	O
projects	O
.	O
</s>
<s>
Due	O
to	O
the	O
large	O
body	O
size	O
of	O
CQFP	O
packages	O
,	O
parasitics	O
are	O
important	O
for	O
this	O
package	B-Algorithm
.	O
</s>
<s>
Power	O
supply	O
decoupling	O
is	O
improved	O
by	O
having	O
the	O
decoupling	O
capacitors	O
mounted	O
on	O
top	O
of	O
this	O
package	B-Algorithm
.	O
</s>
<s>
TI	O
offers	O
256-pin	O
CQFP	O
packages	O
where	O
decoupling	O
capacitors	O
can	O
be	O
soldered	O
on	O
top	O
of	O
the	O
package	B-Algorithm
E.g.	O
</s>
<s>
Test-expert	O
256-pin	O
CQFP	O
packages	O
where	O
decoupling	O
capacitors	O
can	O
be	O
soldered	O
on	O
top	O
of	O
the	O
package	B-Algorithm
.	O
</s>
<s>
The	O
main	O
ceramic	O
package	B-Algorithm
manufacturers	O
are	O
Kyocera	O
(	O
Japan	O
)	O
,	O
NTK	O
(	O
Japan	O
)	O
,	O
Test-Expert	O
(	O
Russia	O
)	O
,	O
etc	O
.	O
</s>
