<s>
Mini	B-Device
ATX	I-Device
or	O
Mini-ATX	O
is	O
a	O
generic	O
name	O
that	O
may	O
be	O
used	O
by	O
motherboard	B-Device
manufacturers	O
to	O
describe	O
a	O
small	O
motherboard	B-Device
,	O
and	O
has	O
been	O
used	O
by	O
AOpen	O
in	O
reference	O
to	O
a	O
motherboard	B-Device
design	O
with	O
dimensions	O
.	O
</s>
<s>
Mini-ATX	O
motherboards	B-Device
were	O
designed	O
with	O
MoDT	O
(	O
Mobile	O
on	O
Desktop	O
Technology	O
)	O
which	O
adapt	O
mobile	O
CPUs	B-Device
for	O
lower	O
power	O
requirements	O
and	O
less	O
heat	O
generation	O
,	O
which	O
may	O
be	O
beneficial	O
for	O
home	O
theater	O
PCs	O
(	O
HTPC	O
)	O
,	O
in-car	O
PCs	O
,	O
or	O
industrial	O
use	O
.	O
</s>
<s>
The	O
term	O
miniATX	B-Device
was	O
originally	O
used	O
in	O
(	O
now	O
obsolete	O
versions	O
of	O
)	O
Intel	O
's	O
ATX	B-Language
specification	O
,	O
and	O
denoted	O
motherboards	B-Device
with	O
dimensions	O
of	O
284	O
x	O
208	O
mm	O
(	O
11.2	O
x	O
8.2	O
in	O
.	O
</s>
<s>
)	O
,	O
before	O
being	O
abandoned	O
in	O
v2.1	O
in	O
favor	O
of	O
the	O
microATX	B-Device
specification	O
.	O
</s>
<s>
With	O
dimensions	O
of	O
,	O
an	O
AOpen-spec	O
Mini-ATX	O
motherboard	B-Device
can	O
be	O
placed	O
into	O
a	O
single	O
DIN	O
space	O
for	O
standardized	O
application	O
conditions	O
such	O
as	O
a	O
car	O
,	O
rack	O
mount	O
,	O
tower	O
case	O
,	O
wall	O
mount	O
,	O
etc	O
.	O
</s>
<s>
which	O
may	O
be	O
impossible	O
for	O
the	O
larger	O
Mini-ITX	B-Architecture
form	O
factor	O
.	O
</s>
<s>
The	O
smaller	O
form	O
factor	O
Nano-ITX	B-Device
motherboard	B-Device
lacks	O
a	O
CPU	B-Device
socket	O
module	O
which	O
limits	O
its	O
flexibility	O
for	O
different	O
applications	O
.	O
</s>
<s>
Due	O
to	O
a	O
mobile	O
CPU	B-Device
having	O
lower	O
power	O
requirements	O
,	O
there	O
is	O
less	O
heat	O
generated	O
by	O
the	O
CPU	B-Device
and	O
internal	O
components	O
,	O
and	O
the	O
thermal	O
design	O
is	O
simplified	O
.	O
</s>
<s>
Mini-ATX	O
motherboards	B-Device
are	O
a	O
smaller	O
form	O
factor	O
of	O
the	O
ATX	B-Language
motherboards	B-Device
,	O
They	O
typically	O
use	O
surface-mount	O
technology	O
for	O
component	O
placement	O
,	O
solid	O
state	O
capacitors	O
to	O
ensure	O
stable	O
power	O
delivery	O
and	O
an	O
8-layer	O
PCB	O
design	O
to	O
increase	O
durability	O
and	O
longevity	O
.	O
</s>
<s>
The	O
DC-to-DC	O
converter	O
solution	O
design	O
removes	O
the	O
power	O
supply	O
unit	O
from	O
a	O
Mini-ATX	O
case	O
.	O
</s>
