<s>
A	O
MEMS	B-Algorithm
magnetic	I-Algorithm
actuator	I-Algorithm
is	O
a	O
device	O
that	O
uses	O
the	O
microelectromechanical	B-Architecture
systems	I-Architecture
(	O
MEMS	B-Architecture
)	O
to	O
convert	O
an	O
electric	O
current	O
into	O
a	O
mechanical	O
output	O
by	O
employing	O
the	O
well-known	O
Lorentz	O
Force	O
Equation	O
or	O
the	O
theory	O
of	O
Magnetism	O
.	O
</s>
<s>
Micro-Electro-Mechanical	O
System	O
(	O
MEMS	B-Architecture
)	O
technology	O
is	O
a	O
process	O
technology	O
in	O
which	O
mechanical	O
and	O
electro-mechanical	O
devices	O
or	O
structures	O
are	O
constructed	O
using	O
special	O
micro-fabrication	O
techniques	O
.	O
</s>
<s>
These	O
techniques	O
include	O
:	O
bulk	O
micro-machining	O
,	O
surface	O
micro-machining	O
,	O
LIGA	O
,	O
wafer	B-Algorithm
bonding	I-Algorithm
,	O
etc	O
.	O
</s>
<s>
A	O
device	O
is	O
considered	O
to	O
be	O
a	O
MEMS	B-Architecture
device	O
if	O
it	O
satisfies	O
the	O
following	O
:	O
</s>
<s>
For	O
the	O
analysis	O
of	O
every	O
MEMS	B-Architecture
device	O
,	O
the	O
Lumped	O
assumption	O
is	O
made	O
:	O
that	O
if	O
the	O
size	O
of	O
the	O
device	O
is	O
far	O
less	O
than	O
the	O
characteristic	O
length	O
scale	O
of	O
the	O
phenomenon	O
(	O
wave	O
or	O
diffusion	O
)	O
,	O
then	O
there	O
would	O
be	O
no	O
spatial	O
variations	O
across	O
the	O
entire	O
device	O
.	O
</s>
<s>
The	O
three	O
major	O
operations	O
in	O
MEMS	B-Architecture
are	O
:	O
</s>
<s>
The	O
MEMS	B-Algorithm
magnetic	I-Algorithm
actuators	I-Algorithm
use	O
the	O
last	O
three	O
schemes	O
for	O
their	O
operation	O
.	O
</s>
<s>
A	O
typical	O
MEMS	B-Architecture
actuator	O
is	O
shown	O
on	O
the	O
right	O
.	O
</s>
<s>
As	O
earlier	O
discussed	O
,	O
MEMS	B-Architecture
devices	O
are	O
designed	O
and	O
fabricated	O
using	O
special	O
micro-fabrication	O
techniques	O
.	O
</s>
<s>
The	O
major	O
challenge	O
however	O
for	O
magnetic	O
MEMS	B-Architecture
is	O
the	O
integration	O
of	O
the	O
magnet	O
into	O
the	O
MEMS	B-Architecture
device	O
.	O
</s>
<s>
There	O
are	O
several	O
ways	O
by	O
which	O
the	O
magnet	O
could	O
be	O
fabricated	O
on	O
a	O
MEMS	B-Architecture
structure	O
:	O
</s>
<s>
This	O
is	O
a	O
major	O
problem	O
for	O
magnetic	O
MEMS	B-Architecture
,	O
but	O
work	O
is	O
underway	O
to	O
circumvent	O
this	O
.	O
</s>
<s>
So	O
that	O
preexisting	O
processes	O
in	O
the	O
fabrication	O
of	O
the	O
MEMS	B-Architecture
device	O
will	O
not	O
be	O
tampered	O
with	O
,	O
deposition	O
temperatures	O
and	O
post-deposition	O
treatment/conditions	O
must	O
be	O
tolerable	O
.	O
</s>
