<s>
Integrated	O
circuits	O
are	O
put	O
into	O
protective	O
packages	B-Algorithm
to	O
allow	O
easy	O
handling	O
and	O
assembly	O
onto	O
printed	O
circuit	O
boards	O
and	O
to	O
protect	O
the	O
devices	O
from	O
damage	O
.	O
</s>
<s>
Integrated	B-Algorithm
circuit	I-Algorithm
packaging	I-Algorithm
is	O
the	O
last	O
assembly	O
process	O
before	O
testing	O
and	O
shipping	O
devices	O
to	O
customers	O
.	O
</s>
<s>
In	O
flip	B-Device
chip	I-Device
systems	O
the	O
IC	O
is	O
connected	O
by	O
solder	O
bumps	O
to	O
a	O
substrate	O
.	O
</s>
<s>
In	O
beam-lead	B-Algorithm
technology	O
,	O
the	O
metallized	O
pads	O
that	O
would	O
be	O
used	O
for	O
wire	B-Algorithm
bonding	I-Algorithm
connections	O
in	O
a	O
conventional	O
chip	O
are	O
thickened	O
and	O
extended	O
to	O
allow	O
external	O
connections	O
to	O
the	O
circuit	O
.	O
</s>
<s>
Assemblies	O
using	O
"	O
bare	O
"	O
chips	O
have	O
additional	O
packaging	B-Algorithm
or	O
filling	O
with	O
epoxy	O
to	O
protect	O
the	O
devices	O
from	O
moisture	O
.	O
</s>
<s>
Acronym	O
Full	O
name	O
Remark	O
SIP	O
Single	O
in-line	O
package	O
DIP	B-Algorithm
Dual	B-Algorithm
in-line	I-Algorithm
package	I-Algorithm
pin	O
spacing	O
,	O
rows	O
or	O
apart	O
.	O
</s>
<s>
CDIP	O
Ceramic	O
DIP	B-Algorithm
CERDIP	B-Algorithm
Glass-sealed	O
ceramic	O
DIP	B-Algorithm
QIP	O
Quadruple	O
in-line	O
package	O
Like	O
DIP	B-Algorithm
but	O
with	O
staggered	O
(	O
zig-zag	O
)	O
pins	O
.	O
</s>
<s>
SKDIP	O
Skinny	B-Algorithm
DIP	I-Algorithm
Standard	O
DIP	B-Algorithm
with	O
pin	O
spacing	O
,	O
rows	O
apart	O
.	O
</s>
<s>
SDIP	O
Shrink	B-Algorithm
DIP	I-Algorithm
Non-standard	O
DIP	B-Algorithm
with	O
smaller	O
pin	O
spacing	O
.	O
</s>
<s>
Chip	O
on	O
board	O
is	O
a	O
packaging	B-Algorithm
technique	O
that	O
directly	O
connects	O
a	O
die	O
to	O
a	O
PCB	O
,	O
without	O
an	O
interposer	O
or	O
lead	B-Algorithm
frame	I-Algorithm
.	O
</s>
<s>
A	O
chip	B-Algorithm
carrier	I-Algorithm
is	O
a	O
rectangular	O
package	O
with	O
contacts	O
on	O
all	O
four	O
edges	O
.	O
</s>
<s>
Leaded	B-Algorithm
chip	I-Algorithm
carriers	I-Algorithm
have	O
metal	O
leads	O
wrapped	O
around	O
the	O
edge	O
of	O
the	O
package	O
,	O
in	O
the	O
shape	O
of	O
a	O
letter	O
J	O
.	O
Leadless	O
chip	B-Algorithm
carriers	I-Algorithm
have	O
metal	O
pads	O
on	O
the	O
edges	O
.	O
</s>
<s>
Chip	B-Algorithm
carrier	I-Algorithm
packages	B-Algorithm
may	O
be	O
made	O
of	O
ceramic	O
or	O
plastic	O
and	O
are	O
usually	O
secured	O
to	O
a	O
printed	O
circuit	O
board	O
by	O
soldering	O
,	O
though	O
sockets	O
can	O
be	O
used	O
for	O
testing	O
.	O
</s>
<s>
Acronym	O
Full	O
name	O
Remark	O
BCC	O
Bump	O
chip	B-Algorithm
carrier	I-Algorithm
CLCC	O
Ceramic	O
lead-less	O
chip	B-Algorithm
carrier	I-Algorithm
LCC	O
Lead-less	O
chip	B-Algorithm
carrier	I-Algorithm
Contacts	O
are	O
recessed	O
vertically	O
.	O
</s>
<s>
Acronym	O
Full	O
name	O
Remark	O
-	O
Flat-pack	B-Algorithm
Earliest	O
version	O
metal/ceramic	O
packaging	B-Algorithm
with	O
flat	O
leads	O
CFP	O
Ceramic	O
flat-pack	B-Algorithm
CQFP	O
Ceramic	O
quad	O
flat-pack	B-Algorithm
Similar	O
to	O
PQFP	O
BQFP	O
Bumpered	O
quad	O
flat-pack	B-Algorithm
DFN	O
Dual	O
flat-pack	B-Algorithm
No	O
lead	O
ETQFP	O
Exposed	O
thin	O
quad	O
flat-package	O
PQFN	O
Power	O
quad	O
flat-pack	B-Algorithm
No-leads	O
,	O
with	O
exposed	O
die-pad[s]	O
for	O
heatsinking	O
PQFP	O
Plastic	O
quad	O
flat-package	O
LQFP	B-Algorithm
Low-profile	O
quad	O
flat-package	O
QFN	B-Algorithm
Quad	B-Algorithm
flat	I-Algorithm
no-leads	I-Algorithm
package	I-Algorithm
Also	O
called	O
as	O
micro	O
lead	B-Algorithm
frame	I-Algorithm
(	O
MLF	B-Algorithm
)	O
.	O
</s>
<s>
Acronym	O
Full	O
name	O
Remark	O
SOP	O
Small-outline	O
package	O
CSOP	O
Ceramic	O
small-outline	O
package	O
DSOPDual	O
small-outline	O
package	O
HSOP	O
Thermally-enhanced	O
small-outline	O
package	O
HSSOPThermally-enhanced	O
shrink	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
HTSSOPThermally-enhanced	O
thin	B-Algorithm
shrink	I-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
mini-SOIC	O
Mini	O
small-outline	B-Algorithm
integrated	I-Algorithm
circuit	I-Algorithm
MSOP	B-Algorithm
Mini	O
small-outline	O
package	O
Maxim	O
uses	O
the	O
trademarked	O
name	O
µMAX	O
for	O
MSOP	B-Algorithm
packages	B-Algorithm
PSOP	O
Plastic	O
small-outline	O
package	O
PSON	O
Plastic	O
small-outline	O
no-lead	O
package	O
QSOP	O
Quarter-size	O
small-outline	O
package	O
The	O
terminal	O
pitch	O
is	O
0.635	O
mm	O
.	O
</s>
<s>
Acronym	O
Full	O
name	O
Remark	O
BL	O
Beam	B-Algorithm
lead	I-Algorithm
technology	I-Algorithm
Bare	O
silicon	O
chip	O
,	O
an	O
early	O
chip-scale	B-Algorithm
package	I-Algorithm
CSP	B-Algorithm
Chip-scale	B-Algorithm
package	I-Algorithm
Package	O
size	O
is	O
no	O
more	O
than	O
1.2	O
×	O
the	O
size	O
of	O
the	O
silicon	O
chip	O
TCSP	O
True	O
chip-size	O
package	O
Package	O
is	O
same	O
size	O
as	O
silicon	O
TDSP	O
True	O
die-size	O
package	O
Same	O
as	O
TCSP	O
WCSP	O
or	O
WL-CSP	O
or	O
WLCSP	B-Algorithm
Wafer-level	O
chip-scale	O
packageA	O
WL-CSP	O
or	O
WLCSP	B-Algorithm
package	O
is	O
just	O
a	O
bare	O
die	O
with	O
a	O
redistribution	B-Algorithm
layer	I-Algorithm
(	O
or	O
I/O	B-General_Concept
pitch	O
)	O
to	O
rearrange	O
the	O
pins	O
or	O
contacts	O
on	O
the	O
die	O
so	O
that	O
they	O
can	O
be	O
big	O
enough	O
and	O
have	O
sufficient	O
spacing	O
so	O
that	O
they	O
can	O
be	O
handled	O
just	O
like	O
a	O
BGA	B-Algorithm
package.https://www.nxp.com/docs/en/application-note/AN3846.pdf	O
PMCP	O
Power	O
mount	O
CSP	B-Algorithm
(	O
chip-scale	B-Algorithm
package	I-Algorithm
)	O
Variation	O
of	O
WLCSP	B-Algorithm
,	O
for	O
power	O
devices	O
like	O
MOSFETs	O
.	O
</s>
<s>
Fan-out	O
WLCSP	B-Algorithm
Fan-out	O
wafer-level	O
packaging	B-Algorithm
Variation	O
of	O
WLCSP	B-Algorithm
.	O
</s>
<s>
Like	O
a	O
BGA	B-Algorithm
package	O
but	O
with	O
the	O
interposer	O
built	O
directly	O
atop	O
the	O
die	O
and	O
encapsulated	O
alongside	O
it	O
.	O
</s>
<s>
eWLB	B-Algorithm
Embedded	B-Algorithm
wafer	I-Algorithm
level	I-Algorithm
ball	I-Algorithm
grid	I-Algorithm
array	I-Algorithm
Variation	O
of	O
WLCSP	B-Algorithm
.	O
</s>
<s>
MICRO	O
SMD	O
-	O
Chip-size	O
package	O
(	O
CSP	B-Algorithm
)	O
developed	O
by	O
National	O
Semiconductor	O
COB	O
Chip	O
on	O
board	O
Bare	O
die	O
supplied	O
without	O
a	O
package	O
.	O
</s>
<s>
TAB	O
Tape-automated	O
bonding	O
Variation	O
of	O
COF	O
,	O
where	O
a	O
flip	B-Device
chip	I-Device
is	O
mounted	O
directly	O
to	O
a	O
flex	O
circuit	O
without	B-Device
the	I-Device
use	I-Device
of	I-Device
bonding	I-Device
wires	I-Device
.	O
</s>
<s>
Used	O
by	O
LCD	B-Device
driver	O
ICs	O
.	O
</s>
<s>
COG	O
Chip-on-glass	O
Variation	O
of	O
TAB	O
,	O
where	O
a	O
chip	O
is	O
mounted	O
directly	O
to	O
a	O
piece	O
of	O
glass	O
-	O
typically	O
an	O
LCD	B-Device
.	O
</s>
<s>
Used	O
by	O
LCD	B-Device
and	O
OLED	O
driver	O
ICs	O
.	O
</s>
<s>
Ball	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
BGA	B-Algorithm
)	O
uses	O
the	O
underside	O
of	O
the	O
package	O
to	O
place	O
pads	O
with	O
balls	B-Algorithm
of	I-Algorithm
solder	I-Algorithm
in	O
grid	O
pattern	O
as	O
connections	O
to	O
PCB	O
.	O
</s>
<s>
SOT	B-Algorithm
:	O
Small-outline	B-Algorithm
transistor	I-Algorithm
(	O
also	O
SOT-23	B-Algorithm
,	O
SOT-223	O
,	O
SOT-323	O
)	O
.	O
</s>
<s>
TO-XX	O
:	O
wide	O
range	O
of	O
small	O
pin	O
count	O
packages	B-Algorithm
often	O
used	O
for	O
discrete	O
parts	O
like	O
transistors	O
or	O
diodes	O
.	O
</s>
<s>
DPAK	O
(	O
TO-252	B-Algorithm
,	O
SOT-428	O
)	O
:	O
Discrete	O
Packaging	B-Algorithm
.	O
</s>
<s>
D2PAK	B-Algorithm
(	O
TO-263	B-Algorithm
,	O
SOT-404	B-Algorithm
)	O
:	O
Bigger	O
than	O
the	O
DPAK	O
;	O
basically	O
a	O
surface	O
mount	O
equivalent	O
of	O
the	O
TO220	B-Algorithm
through-hole	O
package	O
.	O
</s>
<s>
D3PAK	O
(	O
TO-268	O
)	O
:	O
Even	O
larger	O
than	O
D2PAK	B-Algorithm
.	O
</s>
<s>
Flatpack	B-Algorithm
was	O
one	O
of	O
the	O
earliest	O
surface-mounted	O
packages	B-Algorithm
.	O
</s>
<s>
Small-outline	B-Algorithm
integrated	I-Algorithm
circuit	I-Algorithm
(	O
SOIC	B-Algorithm
)	O
:	O
dual-in-line	O
,	O
8	O
or	O
more	O
pins	O
,	O
gull-wing	O
lead	O
form	O
,	O
pin	O
spacing	O
1.27mm	O
.	O
</s>
<s>
Small-outline	O
package	O
,	O
J-leaded	O
(	O
SOJ	O
)	O
:	O
The	O
same	O
as	O
SOIC	B-Algorithm
except	O
J-leaded	O
.	O
</s>
<s>
Thin	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
TSOP	B-Algorithm
)	O
:	O
thinner	O
than	O
SOIC	B-Algorithm
with	O
smaller	O
pin	O
spacing	O
of	O
0.5mm	O
.	O
</s>
<s>
Shrink	B-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
SSOP	B-Algorithm
)	O
:	O
pin	O
spacing	O
of	O
0.65mm	O
,	O
sometimes	O
0.635mm	O
or	O
in	O
some	O
cases	O
0.8mm	O
.	O
</s>
<s>
Thin	B-Algorithm
shrink	I-Algorithm
small-outline	I-Algorithm
package	I-Algorithm
(	O
TSSOP	B-Algorithm
)	O
.	O
</s>
<s>
Dual	B-Algorithm
flat	I-Algorithm
no-lead	I-Algorithm
(	O
DFN	O
)	O
:	O
smaller	O
footprint	O
than	O
leaded	O
equivalent	O
.	O
</s>
<s>
Leadless	O
chip	B-Algorithm
carrier	I-Algorithm
(	O
LCC	O
)	O
:	O
contacts	O
are	O
recessed	O
vertically	O
to	O
"	O
wick-in	O
"	O
solder	O
.	O
</s>
<s>
Land	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
LGA	B-Algorithm
)	O
:	O
An	O
array	O
of	O
bare	O
lands	O
only	O
.	O
</s>
<s>
Similar	O
to	O
in	O
appearance	O
to	O
QFN	B-Algorithm
,	O
but	O
mating	O
is	O
by	O
spring	O
pins	O
within	O
a	O
socket	O
rather	O
than	O
solder	O
.	O
</s>
<s>
Column	O
grid	O
array	O
(	O
CGA	O
)	O
:	O
A	O
circuit	O
package	O
in	O
which	O
the	O
input	B-General_Concept
and	I-General_Concept
output	I-General_Concept
points	O
are	O
high-temperature	O
solder	O
cylinders	O
or	O
columns	O
arranged	O
in	O
a	O
grid	O
pattern	O
.	O
</s>
<s>
Ceramic	O
column	O
grid	O
array	O
(	O
CCGA	O
)	O
:	O
A	O
circuit	O
package	O
in	O
which	O
the	O
input	B-General_Concept
and	I-General_Concept
output	I-General_Concept
points	O
are	O
high-temperature	O
solder	O
cylinders	O
or	O
columns	O
arranged	O
in	O
a	O
grid	O
pattern	O
.	O
</s>
<s>
Chip-on-board	O
(	O
COB	O
)	O
,	O
a	O
bare	O
silicon	O
chip	O
,	O
that	O
is	O
usually	O
an	O
integrated	O
circuit	O
,	O
is	O
supplied	O
without	O
a	O
package	O
(	O
which	O
is	O
usually	O
a	O
lead	B-Algorithm
frame	I-Algorithm
overmolded	O
with	O
epoxy	O
)	O
and	O
is	O
attached	O
,	O
often	O
with	O
epoxy	O
,	O
directly	O
to	O
a	O
circuit	O
board	O
.	O
</s>
<s>
The	O
chip	O
is	O
then	O
wire	B-Algorithm
bonded	I-Algorithm
and	O
protected	O
from	O
mechanical	O
damage	O
and	O
contamination	O
by	O
an	O
epoxy	O
"	O
glob-top	O
"	O
.	O
</s>
<s>
Chip-on-glass	O
(	O
COG	O
)	O
,	O
a	O
variation	O
of	O
COB	O
,	O
where	O
a	O
chip	O
,	O
typically	O
a	O
liquid	B-Device
crystal	I-Device
display	I-Device
(	O
LCD	B-Device
)	O
controller	O
,	O
is	O
mounted	O
directly	O
on	O
glass	O
.	O
</s>
