<s>
A	O
lead	B-Algorithm
frame	I-Algorithm
(	O
pronounced	O
)	O
is	O
a	O
metal	O
structure	O
inside	O
a	O
chip	B-Algorithm
package	I-Algorithm
that	O
carries	O
signals	O
from	O
the	O
die	O
to	O
the	O
outside	O
,	O
used	O
in	O
DIP	B-Algorithm
,	O
QFP	B-Algorithm
and	O
other	O
packages	O
where	O
connections	O
to	O
the	O
chip	O
are	O
made	O
on	O
its	O
edges	O
.	O
</s>
<s>
The	O
lead	B-Algorithm
frame	I-Algorithm
consists	O
of	O
a	O
central	O
die	O
pad	O
,	O
where	O
the	O
die	O
is	O
placed	O
,	O
surrounded	O
by	O
leads	O
,	O
metal	O
conductors	O
leading	O
away	O
from	O
the	O
die	O
to	O
the	O
outside	O
world	O
.	O
</s>
<s>
Small	O
bond	B-Algorithm
wires	I-Algorithm
connect	O
the	O
die	O
to	O
each	O
bond	O
pad	O
.	O
</s>
<s>
Mechanical	O
connections	O
fix	O
all	O
these	O
parts	O
into	O
a	O
rigid	O
structure	O
,	O
which	O
makes	O
the	O
whole	O
lead	B-Algorithm
frame	I-Algorithm
easy	O
to	O
handle	O
automatically	O
.	O
</s>
<s>
Lead	B-Algorithm
frames	I-Algorithm
are	O
manufactured	O
by	O
removing	O
material	O
from	O
a	O
flat	O
plate	O
of	O
copper	O
,	O
copper-alloy	O
,	O
or	O
iron-nickel	O
alloy	O
like	O
alloy	O
42	O
.	O
</s>
<s>
The	O
die	O
is	O
glued	O
or	O
soldered	O
to	O
the	O
die	O
pad	O
inside	O
the	O
lead	B-Algorithm
frame	I-Algorithm
,	O
and	O
then	O
bond	B-Algorithm
wires	I-Algorithm
are	O
attached	O
between	O
the	O
die	O
and	O
the	O
bond	O
pads	O
to	O
connect	O
the	O
die	O
to	O
the	O
leads	O
.	O
</s>
<s>
In	O
a	O
process	O
called	O
encapsulation	O
,	O
a	O
plastic	O
case	O
is	O
moulded	O
around	O
the	O
lead	B-Algorithm
frame	I-Algorithm
and	O
die	O
,	O
exposing	O
only	O
the	O
leads	O
.	O
</s>
<s>
Amongst	O
others	O
,	O
lead	B-Algorithm
frames	I-Algorithm
are	O
used	O
to	O
manufacture	O
a	O
quad	B-Algorithm
flat	I-Algorithm
no-leads	I-Algorithm
package	I-Algorithm
(	O
QFN	B-Algorithm
)	O
,	O
a	O
quad	B-Algorithm
flat	I-Algorithm
package	I-Algorithm
(	O
QFP	B-Algorithm
)	O
,	O
or	O
a	O
dual	B-Algorithm
in-line	I-Algorithm
package	I-Algorithm
(	O
DIP	B-Algorithm
)	O
.	O
</s>
