<s>
LGA	B-Device
3647	I-Device
is	O
an	O
Intel	O
microprocessor	B-Architecture
compatible	O
socket	B-General_Concept
used	O
by	O
Xeon	B-General_Concept
Phi	I-General_Concept
x200	O
(	O
"	O
Knights	B-General_Concept
Landing	I-General_Concept
"	O
)	O
,	O
Xeon	B-General_Concept
Phi	I-General_Concept
72x5	O
(	O
"	O
Knights	B-General_Concept
Mill	I-General_Concept
"	O
)	O
,	O
Skylake-SP	B-Architecture
,	O
Cascade	B-Device
Lake-SP/AP	I-Device
,	O
and	O
Cascade	B-Device
Lake-W	I-Device
microprocessors	B-Architecture
.	O
</s>
<s>
The	O
socket	B-General_Concept
supports	O
a	O
6-channel	O
memory	O
controller	O
,	O
non-volatile	O
3D	B-Device
XPoint	I-Device
memory	I-Device
DIMMs	O
,	O
Intel	B-Architecture
Ultra	I-Architecture
Path	I-Architecture
Interconnect	I-Architecture
(	O
UPI	O
)	O
,	O
as	O
a	O
replacement	O
for	O
QPI	B-Architecture
,	O
and	O
100G	O
Omni-Path	B-Operating_System
interconnect	O
and	O
also	O
has	O
a	O
new	O
mounting	O
mechanism	O
which	O
does	O
not	O
use	O
a	O
lever	O
to	O
secure	O
it	O
in	O
place	O
but	O
the	O
CPU	O
cooler	O
's	O
pressure	O
and	O
its	O
screws	O
to	O
secure	O
it	O
in	O
place	O
.	O
</s>
<s>
There	O
are	O
two	O
sub-versions	O
of	O
this	O
socket	B-General_Concept
with	O
differences	O
also	O
in	O
the	O
ILM	O
(	O
Independent	O
Loading	O
Mechanism	O
,	O
pitch	O
of	O
center	O
screws	O
changed	O
slightly	O
and	O
a	O
more	O
visible	O
one	O
being	O
that	O
the	O
guiding	O
pins	O
are	O
in	O
other	O
corners	O
)	O
.	O
</s>
<s>
The	O
processor	B-General_Concept
socket	I-General_Concept
and	O
the	O
matching	O
notches	O
on	O
the	O
processor	O
are	O
at	O
different	O
location	O
,	O
preventing	O
insertion	O
of	O
an	O
incompatible	O
processor	O
and	O
preventing	O
use	O
of	O
the	O
wrong	O
heatsink	O
in	O
a	O
system	O
.	O
</s>
