<s>
LGA	B-Device
1700	I-Device
(	O
Socket	B-General_Concept
V	O
)	O
is	O
a	O
zero	B-General_Concept
insertion	I-General_Concept
force	I-General_Concept
flip-chip	B-Device
land	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
LGA	B-Algorithm
)	O
socket	B-General_Concept
,	O
compatible	O
with	O
Intel	O
desktop	O
processors	B-General_Concept
Alder	B-Device
Lake	I-Device
and	O
Raptor	B-Device
Lake	I-Device
,	O
which	O
was	O
first	O
released	O
in	O
November	O
2021	O
.	O
</s>
<s>
LGA	B-Device
1700	I-Device
is	O
designed	O
as	O
a	O
replacement	O
for	O
LGA	B-Device
1200	I-Device
(	O
known	O
as	O
Socket	B-General_Concept
H5	O
)	O
and	O
it	O
has	O
1700	O
protruding	O
pins	O
to	O
make	O
contact	O
with	O
the	O
pads	O
on	O
the	O
processor	O
.	O
</s>
<s>
Compared	O
to	O
its	O
predecessor	O
,	O
it	O
has	O
500	O
more	O
pins	O
,	O
which	O
required	O
a	O
major	O
change	O
in	O
socket	B-General_Concept
and	O
processor	O
sizes	O
;	O
it	O
is	O
7.5mm	O
longer	O
.	O
</s>
<s>
It	O
is	O
the	O
first	O
major	O
change	O
in	O
Intel	O
's	O
LGA	B-Algorithm
desktop	O
CPU	B-General_Concept
socket	I-General_Concept
size	O
since	O
the	O
introduction	O
of	O
LGA	B-Device
775	I-Device
in	O
2004	O
,	O
especially	O
for	O
consumer-grade	O
CPU	B-General_Concept
sockets	I-General_Concept
.	O
</s>
<s>
The	O
larger	O
size	O
also	O
required	O
a	O
change	O
in	O
the	O
heatsink	O
fastening	O
holes	O
configuration	O
,	O
making	O
previously	O
used	O
cooling	O
solutions	O
incompatible	O
with	O
LGA	B-Device
1700	I-Device
motherboards	O
and	O
CPUs	O
.	O
</s>
<s>
Since	O
the	O
introduction	O
of	O
Land	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
LGA	B-Algorithm
)	O
-based	O
sockets	O
in	O
the	O
consumer	O
hardware	O
space	O
in	O
2004	O
,	O
the	O
thermal	O
solution	O
hole	O
pattern	O
(	O
the	O
distance	O
between	O
centers	O
of	O
the	O
screw-holes	O
for	O
the	O
heatsink	O
)	O
has	O
changed	O
three	O
times	O
for	O
Intel	O
's	O
mainstream	O
platforms	O
:	O
</s>
<s>
for	O
using	O
an	O
LGA115x	O
cooler	O
on	O
an	O
LGA1700	B-Device
motherboard	O
,	O
differences	O
in	O
Z-height	O
and	O
the	O
mounting	O
pressure	O
will	O
result	O
in	O
worse	O
than	O
expected	O
cooling	O
performance	O
.	O
</s>
<s>
For	O
heatsinks	O
to	O
be	O
interchangeable	O
,	O
not	O
only	O
the	O
hole	O
pattern	O
,	O
but	O
also	O
the	O
socket	B-General_Concept
seating	O
plane	O
height	O
,	O
the	O
maximum	O
thermal	O
solution	O
center	O
of	O
gravity	O
height	O
from	O
the	O
IHS	O
and	O
the	O
static	O
total	O
compressive	O
minimum	O
need	O
to	O
match	O
.	O
</s>
<s>
Even	O
though	O
some	O
CPU	O
cooler	O
manufacturers	O
are	O
providing	O
adapter	O
kits	O
(	O
usually	O
in	O
the	O
form	O
of	O
different	O
screws	O
)	O
to	O
go	O
with	O
existing	O
LGA115x	O
retention	O
brackets	O
,	O
there	O
have	O
been	O
reports	O
of	O
the	O
CPU	O
bending	O
or	O
bowing	O
due	O
to	O
uneven	O
mounting	O
pressure	O
from	O
the	O
LGA	B-Device
1700	I-Device
integrated	O
loading	O
mechanism	O
(	O
ILM	O
)	O
.	O
</s>
<s>
LGA	B-Device
1700	I-Device
contact	O
frames	O
to	O
replace	O
the	O
stock	O
ILM	O
have	O
been	O
released	O
by	O
Thermal	O
Grizzly	O
and	O
Thermalright	O
to	O
ensure	O
even	O
CPU	O
mounting	O
pressure	O
and	O
cooler	O
contact	O
.	O
</s>
