<s>
In	O
electronics	O
manufacturing	O
,	O
integrated	B-Algorithm
circuit	I-Algorithm
packaging	I-Algorithm
is	O
the	O
final	O
stage	O
of	O
semiconductor	B-Architecture
device	I-Architecture
fabrication	I-Architecture
,	O
in	O
which	O
the	O
block	O
of	O
semiconductor	O
material	O
is	O
encapsulated	O
in	O
a	O
supporting	O
case	O
that	O
prevents	O
physical	O
damage	O
and	O
corrosion	O
.	O
</s>
<s>
The	O
case	O
,	O
known	O
as	O
a	O
"	O
package	B-Algorithm
"	O
,	O
supports	O
the	O
electrical	O
contacts	O
which	O
connect	O
the	O
device	O
to	O
a	O
circuit	O
board	O
.	O
</s>
<s>
In	O
the	O
integrated	O
circuit	O
industry	O
,	O
the	O
process	O
is	O
often	O
referred	O
to	O
as	O
packaging	B-Algorithm
.	O
</s>
<s>
The	O
packaging	B-Algorithm
stage	O
is	O
followed	O
by	O
testing	O
of	O
the	O
integrated	O
circuit	O
.	O
</s>
<s>
The	O
term	O
is	O
sometimes	O
confused	O
with	O
electronic	B-Algorithm
packaging	I-Algorithm
,	O
which	O
is	O
the	O
mounting	O
and	O
interconnecting	O
of	O
integrated	O
circuits	O
(	O
and	O
other	O
components	O
)	O
onto	O
printed-circuit	O
boards	O
.	O
</s>
<s>
The	O
current-carrying	O
traces	O
that	O
run	O
out	O
of	O
the	O
die	O
,	O
through	O
the	O
package	B-Algorithm
,	O
and	O
into	O
the	O
printed	O
circuit	O
board	O
(	O
PCB	O
)	O
have	O
very	O
different	O
electrical	O
properties	O
compared	O
to	O
on-chip	O
signals	O
.	O
</s>
<s>
Packaging	B-Algorithm
delays	O
have	O
the	O
potential	O
to	O
make	O
up	O
almost	O
half	O
of	O
a	O
high-performance	O
computer	O
's	O
delay	O
,	O
and	O
this	O
bottleneck	O
on	O
speed	O
is	O
expected	O
to	O
increase	O
.	O
</s>
<s>
The	O
integrated	O
circuit	O
package	B-Algorithm
must	O
resist	O
physical	O
breakage	O
,	O
keep	O
out	O
moisture	O
,	O
and	O
also	O
provide	O
effective	O
heat	O
dissipation	O
from	O
the	O
chip	O
.	O
</s>
<s>
Moreover	O
,	O
for	O
RF	B-Protocol
applications	O
,	O
the	O
package	B-Algorithm
is	O
commonly	O
required	O
to	O
shield	O
electromagnetic	O
interference	O
,	O
that	O
may	O
either	O
degrade	O
the	O
circuit	O
performance	O
or	O
adversely	O
affect	O
neighboring	O
circuits	O
.	O
</s>
<s>
Finally	O
,	O
the	O
package	B-Algorithm
must	O
permit	O
interconnecting	O
the	O
chip	O
to	O
a	O
PCB	O
.	O
</s>
<s>
The	O
materials	O
of	O
the	O
package	B-Algorithm
are	O
either	O
plastic	O
(	O
thermoset	O
or	O
thermoplastic	O
)	O
,	O
metal	O
(	O
commonly	O
Kovar	O
)	O
or	O
ceramic	O
.	O
</s>
<s>
Generally	O
speaking	O
,	O
ceramic	O
packages	O
are	O
more	O
expensive	O
than	O
a	O
similar	O
plastic	O
package	B-Algorithm
.	O
</s>
<s>
Cost	O
is	O
a	O
factor	O
in	O
selection	O
of	O
integrated	B-Algorithm
circuit	I-Algorithm
packaging	I-Algorithm
.	O
</s>
<s>
Typically	O
,	O
an	O
inexpensive	O
plastic	O
package	B-Algorithm
can	O
dissipate	O
heat	O
up	O
to	O
2W	O
,	O
which	O
is	O
sufficient	O
for	O
many	O
simple	O
applications	O
,	O
though	O
a	O
similar	O
ceramic	O
package	B-Algorithm
can	O
dissipate	O
up	O
to	O
50W	O
in	O
the	O
same	O
scenario	O
.	O
</s>
<s>
As	O
the	O
chips	O
inside	O
the	O
package	B-Algorithm
get	O
smaller	O
and	O
faster	O
,	O
they	O
also	O
tend	O
to	O
get	O
hotter	O
.	O
</s>
<s>
As	O
the	O
subsequent	O
need	O
for	O
more	O
effective	O
heat	O
dissipation	O
increases	O
,	O
the	O
cost	O
of	O
packaging	B-Algorithm
rises	O
along	O
with	O
it	O
.	O
</s>
<s>
Generally	O
,	O
the	O
smaller	O
and	O
more	O
complex	O
the	O
package	B-Algorithm
needs	O
to	O
be	O
,	O
the	O
more	O
expensive	O
it	O
is	O
to	O
manufacture	O
.	O
</s>
<s>
Early	O
integrated	O
circuits	O
were	O
packaged	O
in	O
ceramic	B-Algorithm
flat	I-Algorithm
packs	I-Algorithm
,	O
which	O
the	O
military	O
used	O
for	O
many	O
years	O
for	O
their	O
reliability	O
and	O
small	O
size	O
.	O
</s>
<s>
The	O
other	O
type	O
of	O
packaging	B-Algorithm
used	O
in	O
the	O
1970s	O
,	O
called	O
the	O
ICP	O
(	O
Integrated	O
Circuit	O
Package	B-Algorithm
)	O
,	O
was	O
a	O
ceramic	O
package	B-Algorithm
(	O
sometime	O
round	O
as	O
the	O
transistor	O
package	B-Algorithm
)	O
,	O
with	O
the	O
leads	O
on	O
one	O
side	O
,	O
co-axially	O
with	O
the	O
package	B-Algorithm
axis	O
.	O
</s>
<s>
Commercial	O
circuit	O
packaging	B-Algorithm
quickly	O
moved	O
to	O
the	O
dual	B-Algorithm
in-line	I-Algorithm
package	I-Algorithm
(	O
DIP	B-Algorithm
)	O
,	O
first	O
in	O
ceramic	O
and	O
later	O
in	O
plastic	O
.	O
</s>
<s>
In	O
the	O
1980s	O
VLSI	O
pin	O
counts	O
exceeded	O
the	O
practical	O
limit	O
for	O
DIP	B-Algorithm
packaging	B-Algorithm
,	O
leading	O
to	O
pin	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
PGA	O
)	O
and	O
leadless	O
chip	B-Algorithm
carrier	I-Algorithm
(	O
LCC	O
)	O
packages	O
.	O
</s>
<s>
Surface	O
mount	O
packaging	B-Algorithm
appeared	O
in	O
the	O
early	O
1980s	O
and	O
became	O
popular	O
in	O
the	O
late	O
1980s	O
,	O
using	O
finer	O
lead	O
pitch	O
with	O
leads	O
formed	O
as	O
either	O
gull-wing	O
or	O
J-lead	O
,	O
as	O
exemplified	O
by	O
small-outline	B-Algorithm
integrated	I-Algorithm
circuit	I-Algorithm
—	O
a	O
carrier	O
which	O
occupies	O
an	O
area	O
about	O
30	O
–	O
50%	O
less	O
than	O
an	O
equivalent	O
DIP	B-Algorithm
,	O
with	O
a	O
typical	O
thickness	O
that	O
is	O
70%	O
less.The	O
next	O
big	O
innovation	O
was	O
the	O
area	B-Algorithm
array	I-Algorithm
package	I-Algorithm
,	O
which	O
places	O
the	O
interconnection	O
terminals	O
throughout	O
the	O
surface	O
area	O
of	O
the	O
package	B-Algorithm
,	O
providing	O
a	O
greater	O
number	O
of	O
connections	O
than	O
previous	O
package	B-Algorithm
types	O
where	O
only	O
the	O
outer	O
perimeter	O
is	O
used	O
.	O
</s>
<s>
The	O
first	O
area	B-Algorithm
array	I-Algorithm
package	I-Algorithm
was	O
a	O
ceramic	B-Algorithm
pin	I-Algorithm
grid	I-Algorithm
array	I-Algorithm
package	B-Algorithm
.	O
</s>
<s>
Not	O
long	O
after	O
,	O
the	O
plastic	B-Algorithm
ball	I-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
BGA	O
)	O
,	O
another	O
type	O
of	O
area	B-Algorithm
array	I-Algorithm
package	I-Algorithm
,	O
became	O
one	O
of	O
the	O
most	O
commonly	O
used	O
packaging	B-Algorithm
techniques	O
.	O
</s>
<s>
In	O
the	O
late	O
1990s	O
,	O
plastic	O
quad	B-Algorithm
flat	I-Algorithm
pack	I-Algorithm
(	O
PQFP	O
)	O
and	O
thin	B-Algorithm
small-outline	I-Algorithm
packages	I-Algorithm
(	O
TSOP	O
)	O
replaced	O
PGA	O
packages	O
as	O
the	O
most	O
common	O
for	O
high	O
pin	O
count	O
devices	O
,	O
though	O
PGA	O
packages	O
are	O
still	O
often	O
used	O
for	O
microprocessors	B-Architecture
.	O
</s>
<s>
However	O
,	O
industry	O
leaders	O
Intel	O
and	O
AMD	O
transitioned	O
in	O
the	O
2000s	O
from	O
PGA	O
packages	O
to	O
land	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
LGA	O
)	O
packages	O
.	O
</s>
<s>
Ball	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
BGA	O
)	O
packages	O
have	O
existed	O
since	O
the	O
1970s	O
,	O
but	O
evolved	O
into	O
flip-chip	B-Device
ball	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
FCBGA	O
)	O
packages	O
in	O
the	O
1990s	O
.	O
</s>
<s>
FCBGA	O
packages	O
allow	O
for	O
much	O
higher	O
pin	O
count	O
than	O
any	O
existing	O
package	B-Algorithm
types	O
.	O
</s>
<s>
In	O
an	O
FCBGA	O
package	B-Algorithm
,	O
the	O
die	O
is	O
mounted	O
upside-down	O
(	O
flipped	O
)	O
and	O
connects	O
to	O
the	O
package	B-Algorithm
balls	I-Algorithm
via	O
a	O
substrate	O
that	O
is	O
similar	O
to	O
a	O
printed-circuit	O
board	O
rather	O
than	O
by	O
wires	O
.	O
</s>
<s>
Traces	O
out	O
of	O
the	O
die	O
,	O
through	O
the	O
package	B-Algorithm
,	O
and	O
into	O
the	O
printed	O
circuit	O
board	O
have	O
very	O
different	O
electrical	O
properties	O
,	O
compared	O
to	O
on-chip	O
signals	O
.	O
</s>
<s>
Recent	O
developments	O
consist	O
of	O
stacking	O
multiple	O
dies	O
in	O
single	O
package	B-Algorithm
called	O
SiP	O
,	O
for	O
System	B-Algorithm
In	I-Algorithm
Package	I-Algorithm
,	O
or	O
three-dimensional	B-Architecture
integrated	I-Architecture
circuit	I-Architecture
.	O
</s>
<s>
Combining	O
multiple	O
dies	O
on	O
a	O
small	O
substrate	O
,	O
often	O
ceramic	O
,	O
is	O
called	O
an	O
MCM	O
,	O
or	O
Multi-Chip	B-Algorithm
Module	I-Algorithm
.	O
</s>
<s>
Die	B-Algorithm
attachment	I-Algorithm
is	O
the	O
step	O
during	O
which	O
a	O
die	O
is	O
mounted	O
and	O
fixed	O
to	O
the	O
package	B-Algorithm
or	O
support	O
structure	O
(	O
header	O
)	O
.	O
</s>
<s>
For	O
high-powered	O
applications	O
,	O
the	O
die	O
is	O
usually	O
eutectic	O
bonded	O
onto	O
the	O
package	B-Algorithm
,	O
using	O
e.g.	O
</s>
<s>
The	O
following	O
operations	O
are	O
performed	O
at	O
the	O
packaging	B-Algorithm
stage	O
,	O
as	O
broken	O
down	O
into	O
bonding	O
,	O
encapsulation	O
,	O
and	O
wafer	B-Algorithm
bonding	I-Algorithm
steps	O
.	O
</s>
<s>
Note	O
that	O
this	O
list	O
is	O
not	O
all-inclusive	O
and	O
not	O
all	O
of	O
these	O
operations	O
are	O
performed	O
for	O
every	O
package	B-Algorithm
,	O
as	O
the	O
process	O
is	O
highly	O
dependent	O
on	O
the	O
package	B-Algorithm
type	I-Algorithm
.	O
</s>
