<s>
The	O
program	O
resulted	O
in	O
commercial	O
development	O
and	O
deployment	O
of	O
the	O
Power	O
775	O
,	O
a	O
supercomputer	B-Architecture
design	O
with	O
extremely	O
high	O
performance	O
ratios	O
in	O
fabric	O
and	O
memory	O
bandwidth	O
,	O
as	O
well	O
as	O
very	O
high	O
performance	O
density	O
and	O
power	O
efficiency	O
.	O
</s>
<s>
The	O
first	O
supercomputer	B-Architecture
using	O
PERCS	O
technology	O
was	O
intended	O
to	O
be	O
the	O
Blue	B-Device
Waters	I-Device
system	O
,	O
however	O
the	O
high	O
costs	O
and	O
complexity	O
of	O
the	O
system	O
resulted	O
in	O
its	O
contract	O
being	O
canceled	O
.	O
</s>
<s>
Power775	O
/	O
PERCS	O
systems	O
were	O
subsequently	O
deployed	O
at	O
roughly	O
two	O
dozen	O
institutions	O
in	O
the	O
U.S.	O
and	O
other	O
countries	O
,	O
in	O
installations	O
ranging	O
from	O
2,000	O
to	O
over	O
64,000	O
Power7	B-Device
processing	O
cores	O
.	O
</s>
<s>
PERCS	O
will	O
use	O
IBM	O
's	O
large-scale	O
technologies	O
from	O
servers	O
and	O
supercomputers	B-Architecture
like	O
the	O
POWER7	B-Device
microprocessor	O
,	O
AIX	B-Application
operating	I-Application
system	I-Application
,	O
X10	B-Language
programming	O
language	O
and	O
General	B-Application
Parallel	I-Application
File	I-Application
System	I-Application
.	O
</s>
<s>
Sometimes	O
known	O
as	O
the	O
POWER7-IH	O
or	O
P7-IH	O
,	O
the	O
Power	O
775	O
is	O
the	O
commercial	O
product	O
that	O
was	O
developed	O
by	O
PERCS	O
as	O
a	O
part	O
of	O
IBM	B-Device
Power	I-Device
Systems	I-Device
line	O
.	O
</s>
<s>
The	O
Power	O
775	O
was	O
released	O
by	O
IBM	O
in	O
2011	O
as	O
a	O
commercial	O
product	O
after	O
IBM	O
ended	O
its	O
participation	O
in	O
the	O
Blue	B-Device
Waters	I-Device
petaflops	O
project	O
at	O
the	O
University	O
of	O
Illinois	O
,	O
but	O
marketed	O
the	O
775	O
based	O
on	O
the	O
growth	O
of	O
its	O
high-performance	B-Architecture
computing	I-Architecture
business	O
.	O
</s>
<s>
Unlike	O
the	O
IBM	B-Operating_System
Blue	I-Operating_System
Gene	I-Operating_System
series	O
,	O
which	O
uses	O
low-power	O
processors	O
to	O
avoid	O
heat-density	O
issues	O
,	O
the	O
Power	O
775	O
was	O
a	O
water-cooled	O
rack-module	O
system	O
,	O
and	O
each	O
module	O
was	O
34	O
inches	O
wide	O
,	O
54	O
inches	O
deep	O
and	O
3.5	O
inches	O
high	O
(	O
2U	O
)	O
.	O
</s>
<s>
Each	O
drawer	O
comprises	O
8	O
cache	O
coherent	O
nodes	O
(	O
each	O
of	O
which	O
can	O
host	O
single	O
one	O
or	O
more	O
O/S	O
images	O
)	O
with	O
a	O
MCM	B-Algorithm
with	O
four	O
POWER7	B-Device
CPUs	O
each	O
,	O
and	O
16	O
DDR3	O
SDRAM	O
slots	O
per	O
MCM	B-Algorithm
for	O
a	O
total	O
of	O
256	O
POWER7	B-Device
cores	O
and	O
2	O
TB	O
RAM	O
.	O
</s>
