<s>
The	O
Memory	B-Device
Spot	I-Device
chip	I-Device
is	O
an	O
integrated	O
circuit	O
currently	O
in	O
development	O
by	O
Hewlett-Packard	O
.	O
</s>
<s>
The	O
chip	O
incorporates	O
a	O
central	B-General_Concept
processing	I-General_Concept
unit	I-General_Concept
,	O
random	B-Architecture
access	I-Architecture
memory	I-Architecture
and	O
a	O
wireless	O
receiver	O
,	O
all	O
bundled	O
together	O
in	O
a	O
device	O
1.4	O
or	O
2mm²	O
.	O
</s>
