<s>
H2Ceramic	B-Device
cooling	I-Device
(	O
also	O
called	O
H2C	B-Device
or	O
Hot-to-Cold	O
)	O
is	O
a	O
computer	B-General_Concept
cooling	I-General_Concept
product	O
offered	O
as	O
an	O
option	O
in	O
Dell	O
's	O
XPS	B-Device
gaming	I-Device
systems	I-Device
,	O
advertised	O
specifically	O
as	O
facilitating	O
CPU	B-Device
overclocking	B-Application
.	O
</s>
<s>
H2C	B-Device
is	O
a	O
two-stage	O
Liquid/Thermoelectric	O
(	O
TEC	O
)	O
hybrid	O
cooling	O
system	O
that	O
combines	O
a	O
liquid-to-air	O
heat	O
exchanger	O
(	O
much	O
like	O
a	O
liquid	O
radiator	O
)	O
,	O
a	O
thermoelectric	O
fluid	O
chiller	B-Application
,	O
and	O
control	O
circuitry	O
to	O
optimize	O
CPU	B-General_Concept
cooling	I-General_Concept
with	O
minimal	O
power	O
.	O
</s>
<s>
The	O
XPS	O
710	O
H2C	B-Device
and	O
Dell	B-Device
XPS	I-Device
720	O
H2C	B-Device
featured	O
a	O
design	O
where	O
all	O
components	O
were	O
mounted	O
in	O
a	O
single	O
plastic	O
chassis	O
and	O
which	O
only	O
cooled	O
the	O
CPU	B-Device
.	O
</s>
<s>
This	O
design	O
only	O
matched	O
motherboards	O
with	O
a	O
very	O
specific	O
CPU	B-Device
socket	O
location	O
and	O
was	O
later	O
replaced	O
by	O
a	O
new	O
and	O
more	O
flexible	O
design	O
featuring	O
a	O
separate	O
pump	O
unit	O
which	O
made	O
it	O
much	O
easier	O
to	O
fit	O
a	O
broader	O
range	O
of	O
motherboards	O
with	O
different	O
CPU	B-Device
socket	O
locations	O
.	O
</s>
<s>
After	O
passing	O
the	O
radiator	O
,	O
the	O
cooling	O
liquid	O
moves	O
through	O
a	O
thermoelectric	O
fluid	O
chiller	B-Application
consisting	O
of	O
a	O
liquid	O
cooling	O
block	O
with	O
two	O
Peltier	O
plates	O
.	O
</s>
<s>
The	O
first	O
version	O
of	O
the	O
H2C	B-Device
cooled	O
the	O
CPU	B-Device
only	O
.	O
</s>
<s>
Later	O
versions	O
cooled	O
both	O
the	O
chipset	O
and	O
CPU	B-Device
using	O
a	O
design	O
with	O
automotive	O
rubber	O
tubing	O
to	O
allow	O
greater	O
flexibility	O
in	O
the	O
placement	O
of	O
the	O
cooling	O
plates	O
.	O
</s>
<s>
Rather	O
than	O
having	O
the	O
control	O
mechanism	O
integrated	O
into	O
the	O
H2C	B-Device
unit	O
,	O
the	O
pump	O
,	O
fans	O
and	O
TEC	O
are	O
controlled	O
separately	O
by	O
a	O
Dell	O
daughterboard	O
,	O
the	O
Master	O
Control	O
Board	O
(	O
MCB	O
)	O
.	O
</s>
<s>
To	O
avoid	O
condensation	O
the	O
MCB	O
firmware	O
limits	O
the	O
use	O
of	O
the	O
TECs	O
and	O
turns	O
them	O
on	O
only	O
when	O
the	O
CPU	B-Device
is	O
under	O
heavy	O
load	O
.	O
</s>
<s>
The	O
TECs	O
are	O
turned	O
off	O
when	O
the	O
CPU	B-Device
is	O
idle	O
or	O
when	O
the	O
CPU	B-Device
temperature	O
is	O
the	O
same	O
as	O
the	O
ambient	O
temperature	O
(	O
measured	O
by	O
the	O
MCB	O
)	O
.	O
</s>
<s>
The	O
H2C	B-Device
system	O
cannot	O
be	O
reused	O
in	O
another	O
computer	O
case	O
without	O
the	O
MCB	O
or	O
custom-made	O
control	O
circuits	O
to	O
take	O
its	O
place	O
.	O
</s>
<s>
According	O
to	O
Dell	O
,	O
the	O
cooling	O
efficiency	O
of	O
H2C	B-Device
contributes	O
to	O
PC	O
systems	O
that	O
are	O
cooler	O
in	O
over-clocked	O
mode	O
and	O
potentially	O
quieter	O
in	O
normal	O
operating	O
mode	O
.	O
</s>
<s>
By	O
cooling	O
the	O
CPU	B-Device
below	O
what	O
is	O
possible	O
with	O
traditional	O
forced-air	O
convection	O
or	O
water	O
cooling	O
systems	O
,	O
but	O
preventing	O
the	O
temperature	O
from	O
falling	O
below	O
ambient	O
room	O
temperature	O
,	O
H2C	B-Device
is	O
advertised	O
as	O
extending	O
CPU	B-Device
life	O
while	O
eliminating	O
the	O
risk	O
of	O
humidity	O
condensation	O
.	O
</s>
<s>
While	O
Dell	O
continues	O
to	O
offer	O
liquid	O
cooling	O
in	O
their	O
Alienware	O
gaming	O
computers	O
,	O
they	O
have	O
discontinued	O
use	O
of	O
the	O
H2C	B-Device
technology	O
with	O
the	O
XPS	O
730X	O
being	O
the	O
last	O
model	O
to	O
utilize	O
it	O
.	O
</s>
