<s>
A	O
Flip-Chip	B-Device
module	I-Device
is	O
a	O
component	O
of	O
digital	O
logic	O
systems	O
made	O
by	O
the	O
Digital	O
Equipment	O
Corporation	O
(	O
DEC	O
)	O
for	O
its	O
PDP-7	B-Device
,	O
PDP-8	B-Device
,	O
PDP-9	B-Device
,	O
and	O
PDP-10	B-Device
computers	O
,	O
and	O
related	O
peripherals	O
,	O
beginning	O
on	O
August	O
24	O
,	O
1964	O
.	O
</s>
<s>
As	O
used	O
by	O
DEC	O
,	O
the	O
term	O
described	O
a	O
proprietary	O
way	O
to	O
package	O
electronic	O
circuitry	O
which	O
was	O
used	O
for	O
central	B-General_Concept
processing	I-General_Concept
units	I-General_Concept
,	O
peripheral	O
controllers	O
,	O
and	O
many	O
other	O
digital	O
or	O
analog	O
electronic	O
products	O
produced	O
by	O
the	O
company	O
.	O
</s>
<s>
The	O
first	O
flip-chip	B-Device
modules	I-Device
mated	O
with	O
single-sided	O
18-contact	O
card	O
edge	O
connectors	O
with	O
contacts	O
on	O
1/8	O
inch	O
centers	O
.	O
</s>
<s>
The	O
trademark	O
"	O
Flip-Chip	B-Device
"	O
 '	O
was	O
filed	O
on	O
August	O
27	O
,	O
1964	O
.	O
</s>
<s>
Various	O
manuals	O
produced	O
by	O
DEC	O
refer	O
to	O
the	O
modules	O
as	O
"	O
FLIP	B-Device
CHIP	I-Device
"	O
,	O
"	O
FLIP-CHIP	B-Device
"	O
,	O
"	O
Flip	B-Device
Chip	I-Device
"	O
,	O
and	O
"	O
Flip-Chip	B-Device
"	O
,	O
with	O
trademark	O
and	O
registered	O
trademark	O
symbols	O
.	O
</s>
<s>
The	O
modules	O
were	O
called	O
"	O
Flip-Chips	B-Device
"	O
because	O
early	O
versions	O
of	O
some	O
of	O
these	O
modules	O
,	O
for	O
example	O
,	O
the	O
R107	O
module	O
shown	O
,	O
used	O
hybrid	O
integrated	O
circuits	O
built	O
using	O
flip	B-Device
chip	I-Device
mounting	O
of	O
individual	O
diode	O
chips	O
on	O
a	O
ceramic	O
substrate	O
.	O
</s>
<s>
Some	O
boards	O
containing	O
flip	B-Device
chip	I-Device
modules	I-Device
were	O
etched	O
and	O
drilled	O
to	O
allow	O
those	O
modules	O
to	O
be	O
replaced	O
by	O
discrete	O
components	O
.	O
</s>
<s>
At	O
some	O
points	O
during	O
production	O
,	O
conventional	O
discrete	O
components	O
may	O
have	O
replaced	O
these	O
flip-chip	B-Device
devices	O
,	O
but	O
the	O
early	O
use	O
of	O
hybrid	O
integrated	O
circuits	O
allowed	O
DEC	O
to	O
market	O
the	O
PDP-8	B-Device
as	O
an	O
integrated	O
circuit	O
computer	O
.	O
</s>
<s>
When	O
DEC	O
began	O
to	O
use	O
monolithic	O
integrated	O
circuits	O
,	O
they	O
continued	O
to	O
refer	O
to	O
their	O
circuit	O
boards	O
as	O
"	O
Flip-Chip	B-Device
"	O
modules	O
,	O
despite	O
the	O
fact	O
that	O
actual	O
flip	B-Device
chip	I-Device
mounting	O
was	O
not	O
used	O
.	O
</s>
<s>
DEC	O
continued	O
to	O
hold	O
the	O
"	O
Flip-Chip	B-Device
"	O
trademark	O
until	O
June	O
6	O
,	O
1987	O
,	O
when	O
it	O
was	O
allowed	O
to	O
expire	O
.	O
</s>
