<s>
The	O
FeaturePak	B-Device
standard	O
defines	O
a	O
small	O
form	O
factor	O
card	O
for	O
I/O	B-General_Concept
expansion	I-General_Concept
of	O
embedded	B-Architecture
systems	I-Architecture
and	O
other	O
space-constrained	O
computing	O
applications	O
.	O
</s>
<s>
The	O
cards	O
are	O
intended	O
to	O
be	O
used	O
for	O
adding	O
a	O
wide	O
range	O
of	O
capabilities	O
,	O
such	O
as	O
A/D	O
,	O
D/A	O
,	O
digital	O
I/O	B-General_Concept
,	O
counter/timers	O
,	O
serial	B-Protocol
I/O	I-Protocol
,	O
wired	O
or	O
wireless	O
networking	O
,	O
image	B-Algorithm
processing	I-Algorithm
,	O
GPS	O
,	O
etc	O
.	O
</s>
<s>
FeaturePak	B-Device
cards	O
plug	O
into	O
edgecard	O
sockets	O
,	O
parallel	O
to	O
the	O
mainboard	O
,	O
similarly	O
to	O
how	O
SO-DIMM	B-General_Concept
memory	O
modules	O
install	O
in	O
laptop	O
or	O
desktop	O
PCs	O
.	O
</s>
<s>
The	O
FeaturePak	B-Device
socket	O
consists	O
of	O
a	O
230-pin	O
"	O
MXM	O
"	O
connector	O
,	O
which	O
provides	O
all	O
connections	O
to	O
the	O
FeaturePak	B-Device
card	O
,	O
including	O
the	O
host	O
interface	O
,	O
external	O
I/O	B-General_Concept
signals	O
,	O
and	O
power	O
.	O
</s>
<s>
(	O
Note	O
,	O
however	O
,	O
that	O
the	O
FeaturePak	B-Device
specification	O
's	O
use	O
of	O
the	O
MXM	O
connector	O
differs	O
from	O
that	O
of	O
Nvidia	O
's	O
MXM	O
specification	O
.	O
)	O
</s>
<s>
The	O
balance	O
of	O
the	O
230-pin	O
FeaturePak	B-Device
socket	O
is	O
allocated	O
to	O
I/O	B-General_Concept
,	O
in	O
two	O
groups	O
:	O
</s>
<s>
The	O
FeaturePak	B-Device
socket	O
's	O
MXM	O
connector	O
is	O
claimed	O
capable	O
of	O
2.5	O
Gbit/s	O
bandwidth	O
on	O
each	O
pin	O
,	O
thereby	O
supporting	O
high-speed	O
interfaces	O
such	O
as	O
PCI	O
Express	O
,	O
gigabit	O
Ethernet	O
,	O
USB	B-Protocol
2.0	O
,	O
among	O
others	O
.	O
</s>
<s>
Enhanced	O
I/O	B-General_Concept
signal	O
isolation	O
within	O
the	O
Primary	O
I/O	B-General_Concept
group	O
is	O
accomplished	O
by	O
leaving	O
alternate	O
pins	O
on	O
the	O
MXM	O
connector	O
interface	O
unused	O
.	O
</s>
<s>
FeaturePak	B-Device
cards	O
are	O
powered	O
by	O
3.3V	O
and	O
use	O
standard	O
3.3V	O
logic	O
levels	O
.	O
</s>
<s>
Other	O
than	O
the	O
provision	O
of	O
extra	O
isolation	O
for	O
34	O
signal	O
pairs	O
,	O
there	O
is	O
no	O
defined	O
allocation	O
of	O
the	O
signals	O
within	O
the	O
Primary	O
I/O	B-General_Concept
and	O
Secondary	O
I/O	B-General_Concept
groups	O
,	O
leaving	O
each	O
FeaturePak	B-Device
to	O
define	O
its	O
own	O
utilization	O
of	O
the	O
I/O	B-General_Concept
signals	O
.	O
</s>
<s>
Consequently	O
,	O
there	O
is	O
little	O
limitation	O
as	O
to	O
what	O
can	O
be	O
implemented	O
on	O
a	O
FeaturePak	B-Device
card	O
.	O
</s>
<s>
Overall	O
FeaturePak	B-Device
horizontal	O
dimensions	O
are	O
1.75	O
x	O
2.55inches	O
(	O
43	O
x	O
65mm	O
)	O
.	O
</s>
<s>
There	O
are	O
two	O
options	O
for	O
topside	O
component	O
thickness	O
:	O
"	O
tall	O
"	O
FeaturePak	B-Device
modules	O
may	O
have	O
topside	O
components	O
of	O
up	O
to	O
0.4inch	O
(	O
10mm	O
)	O
thick	O
;	O
"	O
standard	O
"	O
modules	O
are	O
limited	O
to	O
0.19inch	O
(	O
4.8mm	O
)	O
topside	O
component	O
thickness	O
.	O
</s>
<s>
The	O
FeaturePak	B-Device
standard	O
was	O
launched	O
by	O
the	O
FeaturePak	B-Device
Initiative	O
at	O
Embedded	O
World	O
2010	O
in	O
Nuremberg	O
,	O
Germany	O
,	O
in	O
March	O
2010	O
.	O
</s>
<s>
At	O
launch	O
,	O
the	O
Initiative	O
consisted	O
of	O
FeaturePak	B-Device
originator	O
,	O
plus	O
FeaturePak	B-Device
Initiative	O
charter	O
members	O
,	O
,	O
,	O
,	O
,	O
,	O
and	O
.	O
</s>
<s>
The	O
FeaturePak	B-Device
Initiative	O
subsequently	O
was	O
superseded	O
by	O
a	O
California	O
nonprofit	O
corporation	O
known	O
as	O
the	O
FeaturePak	B-Device
Trade	O
Association	O
(	O
FPTA	O
)	O
,	O
which	O
assumed	O
ownership	O
of	O
the	O
FeaturePak	B-Device
specification	O
and	O
other	O
IP	O
(	O
intellectual	O
property	O
)	O
and	O
became	O
responsible	O
for	O
maintaining	O
,	O
extending	O
,	O
and	O
promoting	O
the	O
FeaturePak	B-Device
standard	O
and	O
established	O
restrictions	O
and	O
guidelines	O
pertaining	O
to	O
the	O
use	O
of	O
the	O
FeaturePak	B-Device
trademark	O
and	O
logos	O
.	O
</s>
<s>
The	O
FeaturePak	B-Device
specification	O
is	O
freely	O
available	O
by	O
application	O
on	O
the	O
FeaturePak	B-Device
Trade	O
Association	O
's	O
website	O
.	O
</s>
<s>
As	O
stated	O
on	O
FeaturePak.org,	O
"	O
You	O
need	O
not	O
join	O
the	O
FPTA	O
or	O
be	O
otherwise	O
licensed	O
,	O
in	O
order	O
to	O
develop	O
or	O
manufacture	O
products	O
based	O
on	O
or	O
incorporating	O
FPTA	O
specifications	O
.	O
</s>
