<s>
Eutectic	B-Algorithm
bonding	I-Algorithm
,	O
also	O
referred	O
to	O
as	O
eutectic	O
soldering	O
,	O
describes	O
a	O
wafer	B-Algorithm
bonding	I-Algorithm
technique	O
with	O
an	O
intermediate	O
metal	O
layer	O
that	O
can	O
produce	O
a	O
eutectic	O
system	O
.	O
</s>
<s>
The	O
fact	O
that	O
the	O
eutectic	O
temperature	O
can	O
be	O
much	O
lower	O
than	O
the	O
melting	O
temperature	O
of	O
the	O
two	O
or	O
more	O
pure	O
elements	O
can	O
be	O
important	O
in	O
eutectic	B-Algorithm
bonding	I-Algorithm
.	O
</s>
<s>
Eutectic	B-Algorithm
bonding	I-Algorithm
to	O
transfer	O
epitaxial	O
materials	O
such	O
as	O
GaAs-AlGaAs	O
onto	O
Si	O
substrates	O
with	O
a	O
high	O
degree	O
of	O
success	O
,	O
for	O
the	O
general	O
purpose	O
of	O
optoelectronics	O
integration	O
with	O
Si	O
electronics	O
as	O
well	O
as	O
to	O
overcome	O
fundamental	O
issues	O
such	O
as	O
lattice	O
mismatch	O
in	O
hetero-epitaxy	O
,	O
was	O
developed	O
and	O
reported	O
by	O
Venkatasubramanian	O
et	O
al	O
.	O
</s>
<s>
Eutectic	B-Algorithm
bonding	I-Algorithm
is	O
able	O
to	O
produce	O
hermetically	O
sealed	O
packages	O
and	O
electrical	O
interconnection	O
within	O
a	O
single	O
process	O
(	O
compare	O
ultrasonic	O
images	O
)	O
.	O
</s>
<s>
The	O
most	O
important	O
parameters	O
for	O
eutectic	B-Algorithm
bonding	I-Algorithm
are	O
:	O
</s>
<s>
Eutectic	B-Algorithm
bonding	I-Algorithm
is	O
based	O
on	O
the	O
ability	O
of	O
silicon	O
(	O
Si	O
)	O
to	O
alloy	O
with	O
numerous	O
metals	O
and	O
form	O
a	O
eutectic	O
system	O
.	O
</s>
<s>
Additionally	O
,	O
often	O
used	O
eutectic	O
alloys	O
for	O
wafer	B-Algorithm
bonding	I-Algorithm
in	O
semiconductor	O
fabrication	O
are	O
shown	O
in	O
the	O
table	O
.	O
</s>
<s>
Additionally	O
,	O
the	O
eutectic	B-Algorithm
bonding	I-Algorithm
procedure	O
promotes	O
a	O
better	O
out-gassing	O
and	O
hermeticity	O
than	O
bonding	O
with	O
organic	O
intermediate	O
layers	O
.	O
</s>
<s>
The	O
temperature	O
of	O
the	O
eutectic	B-Algorithm
bonding	I-Algorithm
procedure	O
is	O
dependent	O
on	O
the	O
used	O
material	O
.	O
</s>
<s>
The	O
procedure	O
of	O
eutectic	B-Algorithm
bonding	I-Algorithm
is	O
divided	O
into	O
following	O
steps	O
:	O
</s>
<s>
The	O
surface	O
preparation	O
is	O
the	O
most	O
important	O
step	O
to	O
accomplish	O
a	O
successful	O
eutectic	B-Algorithm
bonding	I-Algorithm
.	O
</s>
<s>
Other	O
common	O
eutectic	B-Algorithm
bonding	I-Algorithm
alloys	O
commonly	O
used	O
for	O
wafer	B-Algorithm
bonding	I-Algorithm
include	O
Au-Sn	O
,	O
Al-Ge	O
,	O
Au-Ge	O
,	O
Au-In	O
and	O
Cu-Sn	O
.	O
</s>
