<s>
In	O
microelectronics	O
,	O
a	O
dual	B-Algorithm
in-line	I-Algorithm
package	I-Algorithm
(	O
DIP	B-Algorithm
or	O
DIL	O
)	O
,	O
is	O
an	O
electronic	B-Algorithm
component	I-Algorithm
package	I-Algorithm
with	O
a	O
rectangular	O
housing	O
and	O
two	O
parallel	O
rows	O
of	O
electrical	O
connecting	O
pins	O
.	O
</s>
<s>
The	O
package	O
may	O
be	O
through-hole	B-Algorithm
mounted	I-Algorithm
to	O
a	O
printed	O
circuit	O
board	O
(	O
PCB	O
)	O
or	O
inserted	O
in	O
a	O
socket	O
.	O
</s>
<s>
Increasingly	O
complex	O
circuits	O
required	O
more	O
signal	O
and	O
power	O
supply	O
leads	O
(	O
as	O
observed	O
in	O
Rent	O
's	O
rule	O
)	O
;	O
eventually	O
microprocessors	O
and	O
similar	O
complex	O
devices	O
required	O
more	O
leads	O
than	O
could	O
be	O
put	O
on	O
a	O
DIP	B-Algorithm
package	O
,	O
leading	O
to	O
development	O
of	O
higher-density	O
chip	B-Algorithm
carriers	I-Algorithm
.	O
</s>
<s>
A	O
DIP	B-Algorithm
is	O
usually	O
referred	O
to	O
as	O
a	O
DIPn	O
,	O
where	O
n	O
is	O
the	O
total	O
number	O
of	O
pins	O
.	O
</s>
<s>
Many	O
analog	O
and	O
digital	O
integrated	O
circuit	O
types	O
are	O
available	O
in	O
DIP	B-Algorithm
packages	O
,	O
as	O
are	O
arrays	O
of	O
transistors	O
,	O
switches	O
,	O
light	O
emitting	O
diodes	O
,	O
and	O
resistors	O
.	O
</s>
<s>
DIP	B-Algorithm
plugs	O
for	O
ribbon	O
cables	O
can	O
be	O
used	O
with	O
standard	O
IC	O
sockets	O
.	O
</s>
<s>
DIP	B-Algorithm
packages	O
are	O
usually	O
made	O
from	O
an	O
opaque	O
molded	O
epoxy	O
plastic	O
pressed	O
around	O
a	O
tin-	O
,	O
silver-	O
,	O
or	O
gold-plated	O
lead	B-Algorithm
frame	I-Algorithm
that	O
supports	O
the	O
device	O
die	O
and	O
provides	O
connection	O
pins	O
.	O
</s>
<s>
Some	O
types	O
of	O
IC	O
are	O
made	O
in	O
ceramic	O
DIP	B-Algorithm
packages	O
,	O
where	O
high	O
temperature	O
or	O
high	O
reliability	O
is	O
required	O
,	O
or	O
where	O
the	O
device	O
has	O
an	O
optical	O
window	O
to	O
the	O
interior	O
of	O
the	O
package	O
.	O
</s>
<s>
Most	O
DIP	B-Algorithm
packages	O
are	O
secured	O
to	O
a	O
PCB	O
by	O
inserting	O
the	O
pins	O
through	O
holes	O
in	O
the	O
board	O
and	O
soldering	O
them	O
in	O
place	O
.	O
</s>
<s>
Where	O
replacement	O
of	O
the	O
parts	O
is	O
necessary	O
,	O
such	O
as	O
in	O
test	O
fixtures	O
or	O
where	O
programmable	O
devices	O
must	O
be	O
removed	O
for	O
changes	O
,	O
a	O
DIP	B-Algorithm
socket	O
is	O
used	O
.	O
</s>
<s>
Some	O
sockets	O
include	O
a	O
zero	B-General_Concept
insertion	I-General_Concept
force	I-General_Concept
(	O
ZIF	B-General_Concept
)	O
mechanism	O
.	O
</s>
<s>
Variations	O
of	O
the	O
DIP	B-Algorithm
package	O
include	O
those	O
with	O
only	O
a	O
single	O
row	O
of	O
pins	O
,	O
e.g.	O
</s>
<s>
DIP	B-Algorithm
packages	O
have	O
been	O
mostly	O
displaced	O
by	O
surface-mount	O
package	O
types	O
,	O
which	O
avoid	O
the	O
expense	O
of	O
drilling	O
holes	O
in	O
a	O
PCB	O
and	O
which	O
allow	O
higher	O
density	O
of	O
interconnections	O
.	O
</s>
<s>
DIPs	B-Algorithm
are	O
commonly	O
used	O
for	O
integrated	O
circuits	O
(	O
ICs	O
)	O
.	O
</s>
<s>
Other	O
devices	O
in	O
DIP	B-Algorithm
packages	O
include	O
resistor	O
networks	O
,	O
DIP	B-Algorithm
switches	O
,	O
LED	O
segmented	O
and	O
bar	O
graph	O
displays	O
,	O
and	O
electromechanical	O
relays	O
.	O
</s>
<s>
DIP	B-Algorithm
connector	O
plugs	O
for	O
ribbon	O
cables	O
are	O
common	O
in	O
computers	O
and	O
other	O
electronic	O
equipment	O
.	O
</s>
<s>
Dallas	O
Semiconductor	O
manufactured	O
integrated	O
DIP	B-Algorithm
real-time	O
clock	O
(	O
RTC	O
)	O
modules	O
which	O
contained	O
an	O
IC	O
chip	O
and	O
a	O
non-replaceable	O
10-year	O
lithium	O
battery	O
.	O
</s>
<s>
DIP	B-Algorithm
header	B-Protocol
blocks	O
on	O
to	O
which	O
discrete	O
components	O
could	O
be	O
soldered	O
were	O
used	O
where	O
groups	O
of	O
components	O
needed	O
to	O
be	O
easily	O
removed	O
,	O
for	O
configuration	O
changes	O
,	O
optional	O
features	O
or	O
calibration	O
.	O
</s>
<s>
DIP	B-Algorithm
packages	O
were	O
still	O
large	O
with	O
respect	O
to	O
the	O
integrated	O
circuits	O
within	O
them	O
.	O
</s>
<s>
DIP	B-Algorithm
chips	O
are	O
still	O
popular	O
for	O
circuit	O
prototyping	O
on	O
a	O
breadboard	O
because	O
of	O
how	O
easily	O
they	O
can	O
be	O
inserted	O
and	O
used	O
there	O
.	O
</s>
<s>
DIPs	B-Algorithm
were	O
the	O
mainstream	O
of	O
the	O
microelectronics	O
industry	O
in	O
the	O
1970s	O
and	O
1980s	O
.	O
</s>
<s>
Their	O
use	O
has	O
declined	O
in	O
the	O
first	O
decade	O
of	O
the	O
21st	O
century	O
due	O
to	O
the	O
emerging	O
new	O
surface-mount	O
technology	O
(	O
SMT	O
)	O
packages	O
such	O
as	O
plastic	B-Algorithm
leaded	I-Algorithm
chip	I-Algorithm
carrier	I-Algorithm
(	O
PLCC	O
)	O
and	O
small-outline	B-Algorithm
integrated	I-Algorithm
circuit	I-Algorithm
(	O
SOIC	B-Algorithm
)	O
,	O
though	O
DIPs	B-Algorithm
continued	O
in	O
extensive	O
use	O
through	O
the	O
1990s	O
,	O
and	O
still	O
continue	O
to	O
be	O
used	O
substantially	O
as	O
the	O
year	O
2011	O
passes	O
.	O
</s>
<s>
Because	O
some	O
modern	O
chips	O
are	O
available	O
only	O
in	O
surface-mount	O
package	O
types	O
,	O
a	O
number	O
of	O
companies	O
sell	O
various	O
prototyping	O
adapters	O
to	O
allow	O
those	O
surface-mount	O
devices	O
(	O
SMD	O
)	O
to	O
be	O
used	O
like	O
DIP	B-Algorithm
devices	O
with	O
through-hole	B-Algorithm
breadboards	O
and	O
soldered	O
prototyping	O
boards	O
(	O
such	O
as	O
stripboard	O
and	O
perfboard	O
)	O
.	O
</s>
<s>
For	O
programmable	O
devices	O
like	O
EPROMs	B-General_Concept
and	O
GALs	O
,	O
DIPs	B-Algorithm
remained	O
popular	O
for	O
many	O
years	O
due	O
to	O
their	O
easy	O
handling	O
with	O
external	O
programming	O
circuitry	O
(	O
i.e.	O
,	O
the	O
DIP	B-Algorithm
devices	O
could	O
be	O
simply	O
plugged	O
into	O
a	O
socket	O
on	O
the	O
programming	O
device	O
.	O
)	O
</s>
<s>
However	O
,	O
with	O
In-System	B-Device
Programming	I-Device
(	O
ISP	O
)	O
technology	O
now	O
state	O
of	O
the	O
art	O
,	O
this	O
advantage	O
of	O
DIPs	B-Algorithm
is	O
rapidly	O
losing	O
importance	O
as	O
well	O
.	O
</s>
<s>
Through	O
the	O
1990s	O
,	O
devices	O
with	O
fewer	O
than	O
20	O
leads	O
were	O
manufactured	O
in	O
a	O
DIP	B-Algorithm
format	O
in	O
addition	O
to	O
the	O
newer	O
formats	O
.	O
</s>
<s>
Since	O
about	O
2000	O
,	O
newer	O
devices	O
are	O
often	O
unavailable	O
in	O
the	O
DIP	B-Algorithm
format	O
.	O
</s>
<s>
DIPs	B-Algorithm
can	O
be	O
mounted	O
either	O
by	O
through-hole	B-Algorithm
soldering	I-Algorithm
or	O
in	O
sockets	O
.	O
</s>
<s>
Where	O
devices	O
would	O
be	O
frequently	O
inserted	O
and	O
removed	O
,	O
such	O
as	O
in	O
test	O
equipment	O
or	O
EPROM	B-General_Concept
programmers	I-General_Concept
,	O
a	O
zero	B-General_Concept
insertion	I-General_Concept
force	I-General_Concept
socket	O
would	O
be	O
used	O
.	O
</s>
<s>
DIPs	B-Algorithm
are	O
also	O
used	O
with	O
breadboards	O
,	O
a	O
temporary	O
mounting	O
arrangement	O
for	O
education	O
,	O
design	O
development	O
or	O
device	O
testing	O
.	O
</s>
<s>
Some	O
hobbyists	O
,	O
for	O
one-off	O
construction	O
or	O
permanent	O
prototyping	O
,	O
use	O
point-to-point	O
wiring	O
with	O
DIPs	B-Algorithm
,	O
and	O
their	O
appearance	O
when	O
physically	O
inverted	O
as	O
part	O
of	O
this	O
method	O
inspires	O
the	O
informal	O
term	O
"	O
dead	O
bug	O
style	O
"	O
for	O
the	O
method	O
.	O
</s>
<s>
The	O
body	O
(	O
housing	O
)	O
of	O
a	O
DIP	B-Algorithm
containing	O
an	O
IC	O
chip	O
is	O
usually	O
made	O
from	O
molded	O
plastic	O
or	O
ceramic	O
.	O
</s>
<s>
However	O
,	O
the	O
vast	O
majority	O
of	O
DIPs	B-Algorithm
are	O
manufactured	O
via	O
a	O
thermoset	O
molding	O
process	O
in	O
which	O
an	O
epoxy	O
mold	O
compound	O
is	O
heated	O
and	O
transferred	O
under	O
pressure	O
to	O
encapsulate	O
the	O
device	O
.	O
</s>
<s>
(	O
The	O
SOIC	B-Algorithm
,	O
the	O
SMT	O
package	O
that	O
most	O
resembles	O
a	O
typical	O
DIP	B-Algorithm
,	O
appears	O
essentially	O
the	O
same	O
,	O
notwithstanding	O
size	O
scale	O
,	O
except	O
that	O
after	O
being	O
bent	O
down	O
the	O
leads	O
are	O
bent	O
upward	O
again	O
by	O
an	O
equal	O
angle	O
to	O
become	O
parallel	O
with	O
the	O
bottom	O
plane	O
of	O
the	O
package	O
.	O
)	O
</s>
<s>
In	O
ceramic	O
(	O
CERDIP	B-Algorithm
)	O
packages	O
,	O
an	O
epoxy	O
or	O
grout	O
is	O
used	O
to	O
hermetically	O
seal	O
the	O
two	O
halves	O
together	O
,	O
providing	O
an	O
air	O
and	O
moisture	O
tight	O
seal	O
to	O
protect	O
the	O
IC	O
die	O
inside	O
.	O
</s>
<s>
Plastic	O
DIP	B-Algorithm
(	O
PDIP	B-Algorithm
)	O
packages	O
are	O
usually	O
sealed	O
by	O
fusing	O
or	O
cementing	O
the	O
plastic	O
halves	O
around	O
the	O
leads	O
,	O
but	O
a	O
high	O
degree	O
of	O
hermeticity	O
is	O
not	O
achieved	O
because	O
the	O
plastic	O
itself	O
is	O
usually	O
somewhat	O
porous	O
to	O
moisture	O
and	O
the	O
process	O
cannot	O
ensure	O
a	O
good	O
microscopic	O
seal	O
between	O
the	O
leads	O
and	O
the	O
plastic	O
at	O
all	O
points	O
around	O
the	O
perimeter	O
.	O
</s>
<s>
Ultra-fine	O
bond	B-Algorithm
wires	I-Algorithm
(	O
barely	O
visible	O
to	O
the	O
naked	O
human	O
eye	O
)	O
are	O
welded	O
between	O
these	O
die	O
periphery	O
contacts	O
and	O
bond	O
pads	O
on	O
the	O
die	O
itself	O
,	O
connecting	O
one	O
lead	O
to	O
each	O
bond	O
pad	O
,	O
and	O
making	O
the	O
final	O
connection	O
between	O
the	O
microcircuits	O
and	O
the	O
external	O
DIP	B-Algorithm
leads	O
.	O
</s>
<s>
The	O
bond	B-Algorithm
wires	I-Algorithm
are	O
not	O
usually	O
taut	O
but	O
loop	O
upward	O
slightly	O
to	O
allow	O
slack	O
for	O
thermal	O
expansion	O
and	O
contraction	O
of	O
the	O
materials	O
;	O
if	O
a	O
single	O
bond	B-Algorithm
wire	I-Algorithm
breaks	O
or	O
detaches	O
,	O
the	O
entire	O
IC	O
may	O
become	O
useless	O
.	O
</s>
<s>
The	O
top	O
of	O
the	O
package	O
covers	O
all	O
of	O
this	O
delicate	O
assemblage	O
without	O
crushing	O
the	O
bond	B-Algorithm
wires	I-Algorithm
,	O
protecting	O
it	O
from	O
contamination	O
by	O
foreign	O
materials	O
.	O
</s>
<s>
The	O
necessity	O
of	O
laying	O
out	O
all	O
of	O
the	O
leads	O
in	O
a	O
basically	O
radial	O
pattern	O
in	O
a	O
single	O
plane	O
from	O
the	O
die	O
perimeter	O
to	O
two	O
rows	O
on	O
the	O
periphery	O
of	O
the	O
package	O
is	O
the	O
main	O
reason	O
that	O
DIP	B-Algorithm
packages	O
with	O
higher	O
lead	O
counts	O
must	O
have	O
wider	O
spacing	O
between	O
the	O
lead	O
rows	O
,	O
and	O
it	O
effectively	O
limits	O
the	O
number	O
of	O
leads	O
which	O
a	O
practical	O
DIP	B-Algorithm
package	O
may	O
have	O
.	O
</s>
<s>
a	O
chip	O
with	O
15	O
inverters	O
,	O
requiring	O
32	O
leads	O
)	O
,	O
a	O
wider	O
DIP	B-Algorithm
would	O
still	O
be	O
required	O
to	O
accommodate	O
the	O
radiating	O
leads	O
internally	O
.	O
</s>
<s>
This	O
is	O
one	O
of	O
the	O
reasons	O
that	O
four-sided	O
and	O
multiple	O
rowed	O
packages	O
,	O
such	O
as	O
PGAs	B-Algorithm
,	O
were	O
introduced	O
(	O
around	O
the	O
early	O
1980s	O
)	O
.	O
</s>
<s>
A	O
large	O
DIP	B-Algorithm
package	O
(	O
such	O
as	O
the	O
DIP64	O
used	O
for	O
the	O
Motorola	B-Device
68000	I-Device
CPU	O
)	O
has	O
long	O
leads	O
inside	O
the	O
package	O
between	O
pins	O
and	O
the	O
die	O
,	O
making	O
such	O
a	O
package	O
unsuitable	O
for	O
high	O
speed	O
devices	O
.	O
</s>
<s>
Some	O
other	O
types	O
of	O
DIP	B-Algorithm
devices	O
are	O
built	O
very	O
differently	O
.	O
</s>
<s>
Others	O
,	O
such	O
as	O
DIP	B-Algorithm
switches	O
,	O
are	O
composed	O
of	O
two	O
(	O
or	O
more	O
)	O
plastic	O
housing	O
parts	O
snapped	O
,	O
welded	O
,	O
or	O
glued	O
together	O
around	O
a	O
set	O
of	O
contacts	O
and	O
tiny	O
mechanical	O
parts	O
,	O
with	O
the	O
leads	O
emerging	O
through	O
molded-in	O
holes	O
or	O
notches	O
in	O
the	O
plastic	O
.	O
</s>
<s>
Several	O
DIP	B-Algorithm
variants	O
for	O
ICs	O
exist	O
,	O
mostly	O
distinguished	O
by	O
packaging	O
material	O
:	O
</s>
<s>
Shrink	O
Plastic	B-Algorithm
Dual	I-Algorithm
In-line	I-Algorithm
Package	I-Algorithm
(	O
SPDIP	B-Algorithm
)	O
A	O
denser	O
version	O
of	O
the	O
PDIP	B-Algorithm
with	O
a	O
0.07	O
in	O
(	O
1.778mm	O
)	O
lead	O
pitch	O
.	O
</s>
<s>
Skinny	O
Dual	B-Algorithm
In-line	I-Algorithm
Package	I-Algorithm
(	O
SDIP	O
or	O
SPDIPFor	O
instance	O
,	O
Microchip	O
:	O
http://www.microchip.com/packaging	O
)	O
Sometimes	O
used	O
to	O
refer	O
to	O
a	O
"	O
narrow	O
"	O
0.300	O
in	O
.	O
</s>
<s>
(	O
or	O
300	O
mil	O
)	O
wide	O
DIP	B-Algorithm
,	O
normally	O
when	O
clarification	O
is	O
needed	O
e.g.	O
</s>
<s>
for	O
DIP	B-Algorithm
with	O
24	O
pins	O
or	O
more	O
,	O
which	O
usually	O
come	O
in	O
"	O
wide	O
"	O
0.600in	O
wide	O
DIP	B-Algorithm
package	O
.	O
</s>
<s>
An	O
example	O
of	O
a	O
typical	O
proper	O
full	O
spec	O
for	O
a	O
"	O
narrow	O
"	O
DIP	B-Algorithm
package	O
would	O
be	O
300mil	O
body	O
width	O
,	O
pin	O
pitch	O
.	O
</s>
<s>
EPROMs	B-General_Concept
were	O
sold	O
in	O
ceramic	O
DIPs	B-Algorithm
manufactured	O
with	O
a	O
circular	O
window	O
of	O
clear	O
quartz	O
over	O
the	O
chip	O
die	O
to	O
allow	O
the	O
part	O
to	O
be	O
erased	O
by	O
ultraviolet	O
light	O
.	O
</s>
<s>
Often	O
,	O
the	O
same	O
chips	O
were	O
also	O
sold	O
in	O
less	O
expensive	O
windowless	O
PDIP	B-Algorithm
or	O
CERDIP	B-Algorithm
packages	O
as	O
one-time	O
programmable	O
(	O
OTP	O
)	O
versions	O
.	O
</s>
<s>
Windowed	O
and	O
windowless	O
packages	O
were	O
also	O
used	O
for	O
microcontrollers	O
,	O
and	O
other	O
devices	O
,	O
containing	O
EPROM	B-General_Concept
memory	O
.	O
</s>
<s>
Windowed	O
CERDIP-packaged	O
EPROMs	B-General_Concept
were	O
used	O
for	O
the	O
BIOS	B-Operating_System
ROM	I-Operating_System
of	O
many	O
early	O
IBM	O
PC	O
clones	O
with	O
an	O
adhesive	O
label	O
covering	O
the	O
window	O
to	O
prevent	O
inadvertent	O
erasure	O
through	O
exposure	O
to	O
ambient	O
light	O
.	O
</s>
<s>
Molded	O
plastic	O
DIPs	B-Algorithm
are	O
much	O
lower	O
in	O
cost	O
than	O
ceramic	O
packages	O
;	O
one	O
1979	O
study	O
showed	O
that	O
a	O
plastic	O
14	O
pin	O
DIP	B-Algorithm
cost	O
around	O
US	O
$0.063	O
and	O
a	O
ceramic	O
package	O
cost	O
US	O
$0.82	O
.	O
</s>
<s>
It	O
is	O
not	O
as	O
popular	O
as	O
the	O
DIP	B-Algorithm
,	O
but	O
has	O
been	O
used	O
for	O
packaging	O
RAM	B-Architecture
chips	I-Architecture
and	O
multiple	O
resistors	O
with	O
a	O
common	O
pin	O
.	O
</s>
<s>
As	O
compared	O
to	O
DIPs	B-Algorithm
with	O
a	O
typical	O
maximum	O
pin	O
count	O
of	O
64	O
,	O
SIPs	O
have	O
a	O
typical	O
maximum	O
pin	O
count	O
of	O
24	O
with	O
lower	O
package	O
costs	O
.	O
</s>
<s>
One	O
variant	O
of	O
the	O
single	O
in-line	O
package	O
uses	O
part	O
of	O
the	O
lead	B-Algorithm
frame	I-Algorithm
for	O
a	O
heat	O
sink	O
tab	O
.	O
</s>
<s>
This	O
multi-leaded	B-Algorithm
power	I-Algorithm
package	I-Algorithm
is	O
useful	O
for	O
such	O
applications	O
as	O
audio	O
power	O
amplifiers	O
,	O
for	O
example	O
.	O
</s>
<s>
The	O
QIP	O
,	O
sometimes	O
called	O
a	O
QIL	B-Algorithm
package	O
,	O
has	O
the	O
same	O
dimensions	O
as	O
a	O
DIL	B-Algorithm
package	I-Algorithm
,	O
but	O
the	O
leads	O
on	O
each	O
side	O
are	O
bent	O
into	O
an	O
alternating	O
zigzag	O
configuration	O
so	O
as	O
to	O
fit	O
four	O
lines	O
of	O
solder	O
pads	O
(	O
instead	O
of	O
two	O
with	O
a	O
DIL	O
)	O
.	O
</s>
<s>
The	O
QIL	B-Algorithm
design	O
increased	O
the	O
spacing	O
between	O
solder	O
pads	O
without	O
increasing	O
package	O
size	O
,	O
for	O
two	O
reasons	O
:	O
</s>
<s>
This	O
may	O
seem	O
odd	O
today	O
,	O
given	O
the	O
far	O
closer	O
solder	O
pad	O
spacing	O
in	O
use	O
now	O
,	O
but	O
in	O
the	O
1970s	O
,	O
the	O
heyday	O
of	O
the	O
QIL	B-Algorithm
,	O
bridging	O
of	O
neighbouring	O
solder	O
pads	O
on	O
DIL	O
chips	O
was	O
an	O
issue	O
at	O
times	O
,	O
</s>
<s>
QIL	B-Algorithm
also	O
increased	O
the	O
possibility	O
of	O
running	O
a	O
copper	O
track	O
between	O
2	O
solder	O
pads	O
.	O
</s>
<s>
Commonly	O
found	O
DIP	B-Algorithm
packages	O
that	O
conform	O
to	O
JEDEC	O
standards	O
use	O
an	O
inter-lead	O
spacing	O
(	O
lead	O
pitch	O
)	O
of	O
(	O
JEDEC	O
MS-001BA	O
)	O
.	O
</s>
<s>
To	O
have	O
an	O
even	O
number	O
of	O
leads	O
some	O
DIPs	B-Algorithm
have	O
unused	O
not	O
connected	O
(	O
NC	O
)	O
leads	O
to	O
the	O
internal	O
chip	O
,	O
or	O
are	O
duplicated	O
,	O
e.g.	O
</s>
<s>
Some	O
microprocessors	O
,	O
such	O
as	O
the	O
Motorola	B-Device
68000	I-Device
and	O
Zilog	B-Device
Z180	I-Device
,	O
used	O
lead	O
counts	O
as	O
high	O
as	O
64	O
;	O
this	O
is	O
typically	O
the	O
maximum	O
number	O
of	O
leads	O
for	O
a	O
DIP	B-Algorithm
package	O
.	O
</s>
<s>
For	O
example	O
,	O
for	O
a	O
14-lead	O
DIP	B-Algorithm
,	O
with	O
the	O
notch	O
at	O
the	O
top	O
,	O
the	O
left	O
leads	O
are	O
numbered	O
from	O
1	O
to	O
7	O
(	O
top	O
to	O
bottom	O
)	O
and	O
the	O
right	O
row	O
of	O
leads	O
are	O
numbered	O
8	O
to	O
14	O
(	O
bottom	O
to	O
top	O
)	O
.	O
</s>
<s>
Some	O
DIP	B-Algorithm
devices	O
,	O
such	O
as	O
segmented	O
LED	O
displays	O
,	O
relays	O
,	O
or	O
those	O
that	O
replace	O
leads	O
with	O
a	O
heat	O
sink	O
fin	O
,	O
skip	O
some	O
leads	O
;	O
the	O
remaining	O
leads	O
are	O
numbered	O
as	O
if	O
all	O
positions	O
had	O
leads	O
.	O
</s>
<s>
The	O
SOIC	B-Algorithm
(	O
Small	B-Algorithm
Outline	I-Algorithm
IC	I-Algorithm
)	O
,	O
a	O
surface-mount	O
package	O
which	O
is	O
currently	O
very	O
popular	O
,	O
particularly	O
in	O
consumer	O
electronics	O
and	O
personal	O
computers	O
,	O
is	O
essentially	O
a	O
shrunk	O
version	O
of	O
the	O
standard	O
IC	O
PDIP	B-Algorithm
,	O
the	O
fundamental	O
difference	O
which	O
makes	O
it	O
an	O
SMT	O
device	O
being	O
a	O
second	O
bend	O
in	O
the	O
leads	O
to	O
flatten	O
them	O
parallel	O
to	O
the	O
bottom	O
plane	O
of	O
the	O
plastic	O
housing	O
.	O
</s>
<s>
The	O
SOJ	O
(	O
Small	O
Outline	O
J-lead	O
)	O
and	O
other	O
SMT	O
packages	O
with	O
"	O
SOP	O
"	O
(	O
for	O
"	O
Small	O
Outline	O
Package	O
"	O
)	O
in	O
their	O
names	O
can	O
be	O
considered	O
further	O
relatives	O
of	O
the	O
DIP	B-Algorithm
,	O
their	O
original	O
ancestor	O
.	O
</s>
<s>
SOIC	B-Algorithm
packages	O
tend	O
to	O
have	O
half	O
the	O
pitch	O
of	O
DIP	B-Algorithm
,	O
and	O
SOP	O
are	O
half	O
that	O
,	O
a	O
fourth	O
of	O
DIP	B-Algorithm
.	O
</s>
<s>
Pin	B-Algorithm
grid	I-Algorithm
array	I-Algorithm
(	O
PGA	O
)	O
packages	O
may	O
be	O
considered	O
to	O
have	O
evolved	O
from	O
the	O
DIP	B-Algorithm
.	O
</s>
<s>
PGAs	B-Algorithm
with	O
the	O
same	O
pin	O
centers	O
as	O
most	O
DIPs	B-Algorithm
were	O
popular	O
for	O
microprocessors	O
from	O
the	O
early	O
to	O
mid-1980s	O
through	O
the	O
1990s	O
.	O
</s>
<s>
Owners	O
of	O
personal	O
computers	O
containing	O
Intel	B-General_Concept
80286	I-General_Concept
through	O
P5	B-General_Concept
Pentium	B-Device
processors	I-Device
may	O
be	O
most	O
familiar	O
with	O
these	O
PGA	O
packages	O
,	O
which	O
were	O
often	O
inserted	O
into	O
ZIF	B-General_Concept
sockets	I-General_Concept
on	O
motherboards	B-Device
.	O
</s>
<s>
The	O
similarity	O
is	O
such	O
that	O
a	O
PGA	O
socket	O
may	O
be	O
physically	O
compatible	O
with	O
some	O
DIP	B-Algorithm
devices	O
,	O
though	O
the	O
converse	O
is	O
rarely	O
true	O
.	O
</s>
