<s>
Dicing	B-Algorithm
tape	I-Algorithm
is	O
a	O
backing	O
tape	O
used	O
during	O
wafer	B-Algorithm
dicing	I-Algorithm
or	O
some	O
other	O
microelectronic	O
substrate	B-Architecture
separation	O
,	O
the	O
cutting	O
apart	O
of	O
pieces	O
of	O
semiconductor	O
or	O
other	O
material	O
following	O
wafer	B-Architecture
or	O
module	O
microfabrication	O
.	O
</s>
<s>
The	O
tape	O
holds	O
the	O
pieces	O
of	O
the	O
substrate	B-Architecture
,	O
in	O
case	O
of	O
a	O
wafer	B-Architecture
called	O
as	O
die	O
,	O
together	O
during	O
the	O
cutting	O
process	O
,	O
mounting	O
them	O
to	O
a	O
thin	O
metal	O
frame	O
.	O
</s>
<s>
The	O
dies/substrate	O
pieces	O
are	O
removed	O
from	O
the	O
dicing	B-Algorithm
tape	I-Algorithm
later	O
on	O
in	O
the	O
electronics	O
manufacturing	O
process	O
.	O
</s>
<s>
Dicing	B-Algorithm
tape	I-Algorithm
can	O
be	O
made	O
of	O
PVC	O
,	O
polyolefin	O
,	O
or	O
polyethylene	O
backing	O
material	O
with	O
an	O
adhesive	O
to	O
hold	O
the	O
wafer	B-Architecture
or	O
substrate	B-Architecture
in	O
place	O
.	O
</s>
<s>
In	O
some	O
cases	O
dicing	B-Algorithm
tape	I-Algorithm
will	O
have	O
a	O
release	O
liner	O
that	O
will	O
be	O
removed	O
prior	O
to	O
mounting	O
the	O
tape	O
to	O
the	O
backside	O
of	O
the	O
wafers	B-Architecture
,	O
with	O
a	O
variety	O
of	O
adhesive	O
strengths	O
,	O
designed	O
for	O
various	O
wafer/substrate	O
sizes	O
and	O
materials	O
.	O
</s>
<s>
UV	O
tapes	O
are	O
dicing	B-Algorithm
tapes	I-Algorithm
in	O
which	O
the	O
adhesive	O
bond	O
is	O
broken	O
by	O
exposure	O
to	O
UV	O
light	O
after	O
dicing	O
,	O
allowing	O
the	O
adhesive	O
to	O
be	O
stronger	O
during	O
cutting	O
while	O
still	O
allowing	O
clean	O
and	O
easy	O
removal	O
.	O
</s>
<s>
These	O
tapes	O
can	O
also	O
handle	O
heavy	O
substrates	B-Architecture
such	O
as	O
ceramic	O
substrates	B-Architecture
or	O
printed	O
circuit	O
boards	O
(	O
PCBs/PWBs	O
)	O
if	O
needed	O
.	O
</s>
