<s>
In	O
electronics	O
,	O
a	O
cross	B-Algorithm
section	I-Algorithm
,	O
cross-section	O
,	O
or	O
microsection	O
,	O
is	O
a	O
prepared	O
electronics	O
sample	O
that	O
allows	O
analysis	O
at	O
a	O
plane	O
that	O
cuts	O
through	O
the	O
sample	O
.	O
</s>
<s>
The	O
features	O
of	O
interest	O
to	O
be	O
analyzed	O
in	O
cross	B-Algorithm
section	I-Algorithm
can	O
be	O
nanometer-scale	O
metal	O
and	O
dielectric	O
layers	O
in	O
semiconductors	O
up	O
to	O
macroscopic	O
features	O
such	O
as	O
the	O
amount	O
of	O
solder	O
that	O
has	O
filled	O
into	O
a	O
large	O
,	O
0.125in	O
(	O
3.18mm	O
)	O
diameter	O
plated	B-Algorithm
through	I-Algorithm
hole	I-Algorithm
.	O
</s>
<s>
Cross	B-Algorithm
sections	I-Algorithm
can	O
be	O
prepared	O
by	O
several	O
methods	O
typically	O
chosen	O
based	O
on	O
the	O
scale	O
of	O
the	O
feature	O
of	O
interest	O
because	O
the	O
technique	O
affects	O
the	O
smoothness	O
of	O
the	O
final	O
polish	O
.	O
</s>
<s>
However	O
,	O
cross	B-Algorithm
sections	I-Algorithm
of	O
some	O
samples	O
can	O
be	O
prepared	O
with	O
no	O
encapsulation	O
.	O
</s>
<s>
Some	O
equipment	O
allows	O
for	O
preparation	O
of	O
cross	B-Algorithm
sections	I-Algorithm
by	O
direct	O
cutting	O
or	O
milling	O
.	O
</s>
<s>
Manufacturers	O
of	O
substrates	O
used	O
in	O
electronics	O
prepare	O
cross	B-Algorithm
sections	I-Algorithm
of	O
a	O
final	O
product	O
for	O
quality	O
assurance	O
.	O
</s>
<s>
In	O
cross	B-Algorithm
section	I-Algorithm
,	O
the	O
quality	O
of	O
drill	O
holes	O
can	O
be	O
assessed	O
and	O
the	O
plating	O
quality	O
and	O
thickness	O
in	O
vias	O
can	O
be	O
measured	O
.	O
</s>
<s>
Viewing	O
the	O
internal	O
structures	O
of	O
electronic	O
components	O
by	O
cross	B-Algorithm
section	I-Algorithm
can	O
reveal	O
problems	O
with	O
manufacturing	O
and	O
material	O
quality	O
.	O
</s>
<s>
In	O
integrated	O
circuits	O
,	O
a	O
cross	B-Algorithm
section	I-Algorithm
can	O
reveal	O
the	O
die	O
,	O
and	O
its	O
active	O
layers	O
,	O
the	O
die	O
paddle	O
,	O
and	O
1st	O
level	O
interconnect	O
(	O
wire	O
bonds	O
or	O
solder	O
bumps	O
)	O
.	O
</s>
<s>
Cross	B-Algorithm
sections	I-Algorithm
of	O
component	O
solder	O
joints	O
are	O
commonly	O
prepared	O
to	O
assess	O
the	O
quality	O
and	O
extent	O
of	O
the	O
metallurgical	O
bond	O
.	O
</s>
<s>
Solder	O
joint	O
cross	B-Algorithm
sections	I-Algorithm
are	O
also	O
commonly	O
prepared	O
during	O
failure	O
analysis	O
to	O
see	O
cracks	O
in	O
the	O
solder	O
.	O
</s>
<s>
Analysis	O
of	O
polished	O
cross	B-Algorithm
sections	I-Algorithm
can	O
be	O
performed	O
with	O
a	O
variety	O
of	O
techniques	O
.	O
</s>
