<s>
In	O
electronics	O
,	O
a	O
chip	B-Algorithm
carrier	I-Algorithm
is	O
one	O
of	O
several	O
kinds	O
of	O
surface-mount	O
technology	O
packages	B-Algorithm
for	O
integrated	O
circuits	O
(	O
commonly	O
called	O
"	O
chips	O
"	O
)	O
.	O
</s>
<s>
Chip	B-Algorithm
carriers	I-Algorithm
may	O
have	O
either	O
J-shaped	O
metal	O
leads	O
for	O
connections	O
by	O
solder	O
or	O
by	O
a	O
socket	O
,	O
or	O
may	O
be	O
lead-less	O
with	O
metal	O
pads	O
for	O
connections	O
.	O
</s>
<s>
If	O
the	O
leads	O
extend	O
beyond	O
the	O
package	O
,	O
the	O
preferred	O
description	O
is	O
"	O
flat	B-Algorithm
pack	I-Algorithm
"	O
.	O
</s>
<s>
Chip	B-Algorithm
carriers	I-Algorithm
can	O
be	O
smaller	O
than	O
dual	B-Algorithm
in-line	I-Algorithm
packages	I-Algorithm
and	O
since	O
they	O
use	O
all	O
four	O
edges	O
of	O
the	O
package	O
they	O
can	O
have	O
a	O
larger	O
pin	O
count	O
.	O
</s>
<s>
Chip	B-Algorithm
carriers	I-Algorithm
may	O
be	O
made	O
of	O
ceramic	O
or	O
plastic	O
.	O
</s>
<s>
Some	O
forms	O
of	O
chip	B-Algorithm
carrier	I-Algorithm
package	O
are	O
standardized	O
in	O
dimensions	O
and	O
registered	O
with	O
trade	O
industry	O
associations	O
such	O
as	O
JEDEC	O
.	O
</s>
<s>
Sometimes	O
the	O
term	O
"	O
chip	B-Algorithm
carrier	I-Algorithm
"	O
is	O
used	O
to	O
refer	O
generically	O
to	O
any	O
package	O
for	O
an	O
integrated	O
circuit	O
.	O
</s>
<s>
Leadless	O
chip	B-Algorithm
carrier	I-Algorithm
(	O
LLCC	O
)	O
:	O
Leadless	O
chip	B-Algorithm
carrier	I-Algorithm
,	O
contacts	O
are	O
recessed	O
vertically	O
.	O
</s>
<s>
It	O
is	O
a	O
reduced	O
cost	O
evolution	O
of	O
the	O
ceramic	O
leadless	O
chip	B-Algorithm
carrier	I-Algorithm
(	O
CLCC	O
)	O
.	O
</s>
<s>
The	O
JEDEC	O
trade	O
group	O
started	O
a	O
task	O
force	O
in	O
1981	O
to	O
categorize	O
PLCCs	O
,	O
with	O
the	O
MO-047	O
standard	O
released	O
in	O
1984	O
for	O
square	O
packages	B-Algorithm
and	O
the	O
MO-052	O
standard	O
released	O
in	O
1985	O
for	O
rectangular	O
packages	B-Algorithm
.	O
</s>
<s>
PLCC	O
packages	B-Algorithm
can	O
be	O
square	O
or	O
rectangular	O
.	O
</s>
<s>
The	O
PLCC	O
is	O
preferred	O
over	O
DIP	B-Algorithm
style	O
chip	B-Algorithm
carriers	I-Algorithm
when	O
lead	O
counts	O
exceed	O
40	O
pins	O
due	O
to	O
the	O
PLCC	O
's	O
more	O
efficient	O
use	O
of	O
board	O
surface	O
area	O
.	O
</s>
<s>
PLCC	O
sockets	O
may	O
in	O
turn	O
be	O
surface	O
mounted	O
,	O
or	O
use	O
through-hole	B-Algorithm
technology	I-Algorithm
.	O
</s>
<s>
Using	O
a	O
PLCC	O
socket	O
may	O
be	O
necessary	O
in	O
situations	O
where	O
the	O
device	O
requires	O
stand-alone	O
programming	O
,	O
such	O
as	O
some	O
flash	B-Device
memory	I-Device
devices	O
.	O
</s>
<s>
Some	O
through-hole	B-Algorithm
sockets	O
are	O
designed	O
for	O
prototyping	O
with	O
wire	O
wrapping	O
.	O
</s>
<s>
A	O
leadless	O
chip	B-Algorithm
carrier	I-Algorithm
(	O
LCC	O
)	O
has	O
no	O
"	O
leads	O
"	O
,	O
but	O
instead	O
has	O
rounded	O
pins	O
through	O
the	O
edges	O
of	O
the	O
ceramic	O
or	O
molded	O
plastic	O
package	O
.	O
</s>
