<s>
The	O
computer-on-module	B-Application
for	O
high	O
performance	O
compute	O
(	O
COM-HPC	B-Device
)	O
form	O
factor	O
standard	O
targets	O
high	O
I/O	O
and	O
computer	O
performance	O
levels	O
.	O
</s>
<s>
Each	O
COM-HPC	B-Device
module	O
integrates	O
core	O
CPU	B-Device
and	O
memory	O
functionality	O
and	O
input	O
and	O
output	O
including	O
USB	B-Protocol
up	O
to	O
Gen	O
4	O
,	O
audio	O
(	O
MIPI	O
SoundWire	O
,	O
I2S	O
and	O
DMIC	O
)	O
,	O
graphics	O
,	O
(	O
PCI	O
Express	O
)	O
up	O
to	O
Gen	O
.	O
5	O
,	O
and	O
Ethernet	O
up	O
to	O
25	O
Gbits/s	O
per	O
lane	O
.	O
</s>
<s>
COM-HPC	B-Device
employs	O
a	O
mezzanine-based	O
approach	O
.	O
</s>
<s>
Over	O
time	O
,	O
the	O
COM-HPC	B-Device
mezzanine	O
modules	O
can	O
be	O
upgraded	O
to	O
newer	O
,	O
backwards-compatible	O
versions	O
.	O
</s>
<s>
COM-HPC	B-Device
targets	O
Industrial	O
,	O
Military/Aerospace	O
,	O
Gaming	O
,	O
Medical	O
,	O
Transportation	O
,	O
IoT	O
,	O
and	O
General	O
Computing	O
embedded	O
applications	O
and	O
even	O
scales	O
up	O
to	O
RAM	O
and	O
performance	O
hungry	O
server	O
or	O
edge	O
server	O
applications	O
.	O
</s>
<s>
The	O
COM-HPC	B-Device
specification	O
is	O
hosted	O
by	O
PICMG	O
.	O
</s>
<s>
The	O
COM-HPC	B-Device
hardware	O
specification	O
will	O
be	O
released	O
Jan	O
2021	O
.	O
</s>
