<s>
Bumpless	B-Device
Build-up	I-Device
Layer	I-Device
or	O
BBUL	B-Device
is	O
a	O
processor	B-General_Concept
packaging	O
technology	O
developed	O
by	O
Intel	O
.	O
</s>
<s>
It	O
is	O
bumpless	O
,	O
because	O
it	O
does	O
not	O
use	O
the	O
usual	O
tiny	O
solder	O
bumps	O
to	O
attach	O
the	O
silicon	O
die	O
to	O
the	O
processor	B-General_Concept
package	O
wires	O
.	O
</s>
<s>
The	O
BBUL	B-Device
is	O
not	O
needed	O
yet	O
because	O
there	O
is	O
no	O
longer	O
the	O
clock-frequency	O
competition	O
.	O
</s>
<s>
C4	B-Device
bumps	O
were	O
reaching	O
their	O
limits	O
.	O
</s>
