<s>
Ball	B-Algorithm
bonding	I-Algorithm
is	O
a	O
type	O
of	O
wire	B-Algorithm
bonding	I-Algorithm
,	O
and	O
is	O
the	O
most	O
common	O
way	O
to	O
make	O
the	O
electrical	O
interconnections	O
between	O
a	O
bare	O
silicon	O
die	O
and	O
the	O
lead	B-Algorithm
frame	I-Algorithm
of	O
the	O
package	O
it	O
is	O
placed	O
in	O
during	O
semiconductor	B-Architecture
device	I-Architecture
fabrication	I-Architecture
.	O
</s>
<s>
If	O
copper	O
wire	O
is	O
used	O
,	O
nitrogen	O
must	O
be	O
used	O
as	O
a	O
cover	O
gas	O
to	O
prevent	O
the	O
copper	O
oxides	O
from	O
forming	O
during	O
the	O
wire	B-Algorithm
bonding	I-Algorithm
process	O
.	O
</s>
<s>
Almost	O
all	O
modern	O
ball	B-Algorithm
bonding	I-Algorithm
processes	O
use	O
a	O
combination	O
of	O
heat	O
,	O
pressure	O
,	O
and	O
ultrasonic	O
energy	O
to	O
make	O
a	O
weld	O
at	O
each	O
end	O
of	O
the	O
wire	O
.	O
</s>
<s>
The	O
machine	O
then	O
pushes	O
down	O
on	O
the	O
capillary	O
and	O
applies	O
ultrasonic	O
energy	O
with	O
an	O
attached	O
transducer	B-Algorithm
.	O
</s>
<s>
(	O
All-aluminum	O
systems	O
in	O
semiconductor	B-Architecture
fabrication	I-Architecture
eliminate	O
the	O
"	O
purple	O
plague	O
"	O
—	O
a	O
brittle	O
gold-aluminum	O
intermetallic	O
compound	O
—	O
sometimes	O
associated	O
with	O
pure	O
gold	O
bonding	O
wire	O
.	O
</s>
<s>
Next	O
the	O
wire	O
is	O
passed	O
out	O
through	O
the	O
capillary	O
and	O
the	O
machine	O
moves	O
over	O
a	O
few	O
millimeters	O
to	O
the	O
location	O
that	O
the	O
chip	O
needs	O
to	O
be	O
wired	O
up	O
to	O
(	O
usually	O
called	O
the	O
leadframe	B-Algorithm
)	O
.	O
</s>
<s>
The	O
machine	O
again	O
descends	O
to	O
the	O
surface	O
,	O
this	O
time	O
without	O
making	O
a	O
ball	O
so	O
that	O
the	O
wire	O
is	O
crushed	O
between	O
the	O
leadframe	B-Algorithm
and	O
the	O
tip	O
of	O
the	O
capillary	O
.	O
</s>
<s>
Stud	O
bumping	O
is	O
used	O
when	O
stacking	O
chips	O
in	O
system	B-Algorithm
in	I-Algorithm
package	I-Algorithm
(	O
SIP	O
)	O
modules	O
.	O
</s>
<s>
Piezoelectric	O
transducers	B-Algorithm
are	O
used	O
to	O
provide	O
ultrasonic	O
energy	O
in	O
the	O
ball	B-Algorithm
bonding	I-Algorithm
process	O
.	O
</s>
<s>
These	O
transducers	B-Algorithm
are	O
known	O
as	O
bolt-clamped	O
transducers	B-Algorithm
or	O
Langevin	O
transducers	B-Algorithm
.	O
</s>
<s>
These	O
transducers	B-Algorithm
operate	O
at	O
their	O
resonant	O
frequency	O
of	O
lateral	O
vibration	O
to	O
introduce	O
lateral	O
ultrasonic	O
excitation	O
to	O
the	O
capillary	O
.	O
</s>
<s>
Along	O
the	O
lateral	O
direction	O
of	O
the	O
transducer	B-Algorithm
,	O
there	O
exists	O
nodal	O
points	O
(	O
large	O
displacement	O
)	O
and	O
antinodal	O
points	O
(	O
no	O
displacement	O
)	O
.	O
</s>
<s>
At	O
the	O
same	O
time	O
,	O
in	O
order	O
to	O
minimize	O
energy	O
loss	O
to	O
the	O
surroundings	O
,	O
the	O
transducer	B-Algorithm
is	O
held	O
at	O
an	O
antinode	O
(	O
no	O
displacement	O
)	O
.At	O
the	O
front	O
end	O
of	O
the	O
transducer	B-Algorithm
a	O
tapered	O
horn	O
is	O
used	O
to	O
magnify	O
the	O
vibration	O
.	O
</s>
