<s>
Alexander	B-Algorithm
Coucoulas	I-Algorithm
is	O
an	O
American	O
inventor	O
,	O
research	O
engineer	O
,	O
and	O
author	O
.	O
</s>
<s>
He	O
was	O
named	O
"	O
father	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
"	O
by	O
George	O
Harman	O
,	O
the	O
world	O
's	O
foremost	O
authority	O
on	O
wire	B-Algorithm
bonding	I-Algorithm
,	O
where	O
he	O
referenced	O
Coucoulas	O
's	O
leading	O
edge	O
publications	O
in	O
his	O
book	O
,	O
Wire	B-Algorithm
Bonding	I-Algorithm
In	O
Microelectronics.Coucoulas	O
,	O
A.	O
,	O
Trans	O
.	O
</s>
<s>
Thermosonic	B-Algorithm
bonding	I-Algorithm
is	O
widely	O
used	O
to	O
electrically	O
connect	O
silicon	O
integrated	O
circuit	O
microprocessor	B-Architecture
chipsT.R.	O
</s>
<s>
Reid	O
,	O
"	O
The	O
Chip	O
:	O
How	O
Two	O
Americans	O
Invented	O
the	O
Microchip	O
and	O
Launched	O
a	O
Revolution	O
"	O
into	O
computers	O
as	O
well	O
as	O
a	O
myriad	O
of	O
other	O
electronic	O
devices	O
that	O
require	O
wire	B-Algorithm
bonding	I-Algorithm
.	O
</s>
<s>
As	O
a	O
result	O
of	O
Coucoulas	O
introducing	O
thermosonic	B-Algorithm
bonding	I-Algorithm
lead	O
wires	O
in	O
the	O
early	O
1960s	O
,	O
its	O
applications	O
and	O
scientific	O
investigations	O
by	O
researchers	O
throughout	O
the	O
world	O
have	O
grown	O
as	O
confirmed	O
by	O
the	O
thousands	O
of	O
Google	O
search-sites	O
.	O
</s>
<s>
The	O
all-important	O
proven	O
reliability	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
,	O
as	O
confirmed	O
by	O
these	O
investigations	O
,	O
has	O
made	O
it	O
the	O
process	O
of	O
choice	O
for	O
connecting	O
these	O
crucially	O
important	O
electronic	O
components	O
.	O
</s>
<s>
And	O
since	O
relatively	O
low	O
bonding	O
parameters	O
were	O
shown	O
to	O
form	O
reliable	O
thermosonic	O
bonds	O
,	O
the	O
integrity	O
of	O
the	O
fragile	O
silicon	O
integrated	O
circuit	O
chip	O
central	O
processor	O
unit	O
or	O
CPU	B-Device
,	O
is	O
assured	O
throughout	O
its	O
intended	O
lifetime	O
use	O
as	O
the	O
"	O
brains	O
"	O
of	O
the	O
computer	O
.	O
</s>
<s>
Bonding	O
With	O
A	O
Compliant	O
Medium	O
Alexander	B-Algorithm
Coucoulas	I-Algorithm
Filed	O
July	O
6	O
,	O
1967	O
.	O
</s>
<s>
In	O
the	O
mid-1960s	O
,	O
Coucoulas	O
reported	O
the	O
first	O
thermosonic	O
wire	B-Algorithm
bonds	I-Algorithm
using	O
a	O
combination	O
of	O
heat	O
,	O
ultrasonic	O
vibrations	O
and	O
pressure	O
which	O
led	O
to	O
his	O
first	O
invention	O
.	O
</s>
<s>
He	O
first	O
set	O
up	O
a	O
commercial	O
ultrasonic	O
wire	B-Algorithm
bonder	I-Algorithm
(	O
capable	O
of	O
transmitting	O
vibratory	O
energy	O
and	O
pressure	O
)	O
in	O
order	O
to	O
investigate	O
the	O
attachment	O
of	O
aluminum	O
wires	O
to	O
tantalum	O
thin	O
films	O
deposited	O
on	O
glass	O
substrates	O
which	O
simulated	O
bonding	O
a	O
lead	O
wire	O
to	O
the	O
fragile	O
metallized	O
silicon	O
integrated	O
circuit	O
"	O
chip	O
"	O
.	O
</s>
<s>
Christian	O
HagarHagar	O
,	O
C	O
(	O
2000	O
)	O
Lifetime	O
Estimation	O
of	O
Aluminum	O
Wire	B-Algorithm
Bonds	I-Algorithm
based	O
on	O
Computational	O
Plasticity	O
,	O
PhD	O
thesis	O
and	O
George	O
HarmanHarman	O
,	O
G.	O
,	O
Wire	B-Algorithm
Bonding	I-Algorithm
In	O
Microelectronics	O
,	O
McGraw-Hill	O
,	O
2010	O
stated	O
that	O
in	O
1970	O
Alexander	B-Algorithm
Coucoulas	I-Algorithm
reported	O
additional	O
work	O
in	O
forming	O
thermosonic-type	O
bonds	O
which	O
he	O
initially	O
called	O
hot	O
work	O
ultrasonic	O
bonding	O
.	O
</s>
<s>
As	O
a	O
result	O
of	O
these	O
earliest	O
reported	O
thermosonic	O
wire	B-Algorithm
bonds	I-Algorithm
,	O
G.Harman	O
stated	O
"	O
as	O
such	O
,	O
Alexander	B-Algorithm
Coucoulas	I-Algorithm
is	O
the	O
Father	O
of	O
Thermosonic	B-Algorithm
Bonding	I-Algorithm
"	O
.	O
</s>
<s>
At	O
present	O
,	O
the	O
majority	O
of	O
connections	O
to	O
silicon	O
integrated	O
circuits	O
are	O
made	O
using	O
thermosonic	B-Algorithm
bonding	I-Algorithm
because	O
it	O
employs	O
lower	O
bonding	O
temperatures	O
,	O
forces	O
and	O
dwell	O
times	O
than	O
thermocompression	O
bonding	O
,	O
as	O
well	O
as	O
lower	O
vibratory	O
energy	O
levels	O
than	O
ultrasonic	O
bonding	O
,	O
to	O
form	O
the	O
required	O
bond	O
area	O
.	O
</s>
<s>
As	O
a	O
result	O
of	O
using	O
lower	O
bonding	O
parameters	O
to	O
form	O
the	O
required	O
contact	O
area	O
,	O
Thermosonic	B-Algorithm
Bonding	I-Algorithm
largely	O
eliminates	O
damaging	O
the	O
relatively	O
fragile	O
silicon	O
integrated	O
circuit	O
micro-chip	O
during	O
the	O
bonding	O
cycle	O
.	O
</s>
<s>
The	O
proven	O
reliability	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
has	O
made	O
it	O
the	O
process	O
of	O
choice	O
,	O
since	O
such	O
potential	O
failure	O
modes	O
could	O
be	O
costly	O
whether	O
they	O
occur	O
during	O
the	O
manufacturing	O
stage	O
or	O
detected	O
later	O
,	O
during	O
an	O
operational	O
field-failure	O
of	O
a	O
micro-chip	O
which	O
had	O
been	O
permanently	O
connected	O
inside	O
a	O
computer	O
or	O
a	O
myriad	O
of	O
other	O
electronic	O
devices	O
.	O
</s>
<s>
Burmeister	O
et	O
al.	O
,	O
of	O
Hamburg	O
University	O
,	O
Germany	O
,	O
reported	O
that	O
using	O
solely	O
ultrasonic	O
power	O
to	O
bond	O
gold	O
wires	O
to	O
YBa2Cu3O7	O
microstructures	O
,	O
such	O
as	O
microbridges	O
,	O
Josephson	O
junctions	O
and	O
superconducting	O
interference	O
devices	O
(	O
DC	O
SQUIDS	B-Protocol
)	O
can	O
degrade	O
them	O
.	O
</s>
<s>
The	O
researchers	O
further	O
found	O
that	O
the	O
problem	O
was	O
overcome	O
by	O
using	O
Coucoulas	O
 '	O
thermosonic	B-Algorithm
bonding	I-Algorithm
process	O
where	O
it	O
left	O
the	O
microstructure	O
device	O
intact	O
so	O
they	O
could	O
be	O
employed	O
.	O
</s>
<s>
The	O
majority	O
of	O
connections	O
to	O
the	O
silicon	O
integrated	O
circuit	O
chip	O
are	O
made	O
using	O
thermosonic	O
bondingHarman	O
,	O
G.	O
,	O
Wire	B-Algorithm
Bonding	I-Algorithm
In	O
Microelectronics	O
,	O
McGraw-Hill	O
,	O
Ch	O
.	O
</s>
<s>
Therefore	O
,	O
the	O
use	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
eliminates	O
damaging	O
the	O
relatively	O
fragile	O
silicon	O
integrated	O
circuit	O
chip	O
during	O
the	O
bonding	O
cycle	O
.	O
</s>
<s>
The	O
proven	O
reliability	O
of	O
thermosonic	B-Algorithm
bonding	I-Algorithm
has	O
made	O
it	O
the	O
process	O
of	O
choice	O
,	O
since	O
such	O
potential	O
failure	O
modes	O
could	O
be	O
costly	O
whether	O
they	O
occur	O
during	O
the	O
manufacturing	O
stage	O
or	O
detected	O
later	O
,	O
during	O
an	O
operational	O
field-failure	O
of	O
a	O
chip	O
which	O
had	O
been	O
connected	O
inside	O
a	O
computer	O
or	O
a	O
myriad	O
of	O
other	O
microelectronic	O
devices	O
.	O
</s>
<s>
Thermosonic	B-Algorithm
bonding	I-Algorithm
is	O
also	O
used	O
in	O
the	O
flip	B-Device
chip	I-Device
process	O
which	O
is	O
an	O
alternate	O
method	O
of	O
electrically	O
connecting	O
silicon	O
integrated	O
circuits	O
.	O
</s>
<s>
Josephson	O
effect	O
and	O
superconducting	O
interference	O
(	O
DC	O
SQUID	B-Protocol
)	O
devices	O
use	O
the	O
thermosonic	B-Algorithm
bonding	I-Algorithm
process	O
as	O
well	O
.	O
</s>
<s>
In	O
this	O
case	O
,	O
other	O
bonding	O
methods	O
would	O
degrade	O
or	O
even	O
destroy	O
YBaCuO7	O
microstructures	O
,	O
such	O
as	O
microbridges	O
,	O
Josephson	O
junctions	O
and	O
superconducting	O
interference	O
devices	O
(	O
DC	O
SQUID	B-Protocol
)	O
.	O
</s>
<s>
When	O
electrically	O
connecting	O
light-emitting	O
diodes	O
with	O
thermosonic	B-Algorithm
bonding	I-Algorithm
techniques	O
,	O
an	O
improved	O
performance	O
of	O
the	O
device	O
has	O
been	O
shown.Seck-Hoe	O
Wong	O
et	O
al	O
.	O
</s>
<s>
(	O
2006	O
)	O
"	O
Packaging	O
Of	O
Power	O
LEDs	O
Using	O
Thermosonic	B-Algorithm
Bonding	I-Algorithm
Of	O
Au-Au	O
Interconnects	O
"	O
,	O
Surface	O
Mount	O
Technology	O
Association	O
International	O
Conference	O
.	O
</s>
<s>
Bonding	O
With	O
A	O
Compliant	O
Medium	O
Alexander	B-Algorithm
Coucoulas	I-Algorithm
Filed	O
July	O
6	O
,	O
1967	O
.	O
</s>
<s>
Image	O
of	O
US	O
PATENT	O
3,533,155	O
which	O
was	O
a	O
means	O
of	O
solid-state	O
bonding	O
the	O
extended	O
electroformed	O
leads	O
of	O
a	O
"	B-Algorithm
beam	I-Algorithm
leaded	I-Algorithm
chip	I-Algorithm
"	I-Algorithm
to	O
the	O
outside	O
world	O
.	O
</s>
<s>
The	O
compliant	O
tape	O
overcame	O
the	O
thickness	O
variations	O
of	O
the	O
beam	B-Algorithm
leads	I-Algorithm
and	O
also	O
acted	O
as	O
a	O
chip	O
carrier	O
to	O
the	O
bonding	O
site	O
.	O
</s>
