<s>
Adhesive	O
bonding	O
(	O
also	O
referred	O
to	O
as	O
gluing	O
or	O
glue	O
bonding	O
)	O
describes	O
a	O
wafer	B-Algorithm
bonding	I-Algorithm
technique	O
with	O
applying	O
an	O
intermediate	O
layer	O
to	O
connect	O
substrates	O
of	O
different	O
types	O
of	O
materials	O
.	O
</s>
<s>
The	O
structuring	O
of	O
polymers	O
as	O
well	O
as	O
the	O
realization	O
of	O
cavities	O
over	O
movable	O
elements	O
are	O
possible	O
using	O
photolithography	B-Algorithm
or	O
dry	B-Algorithm
etching	I-Algorithm
.	O
</s>
<s>
Ultraviolet	B-Application
(	O
UV	O
)	O
radiation	O
plays	O
a	O
role	O
in	O
numerous	O
surface	O
treatments	O
,	O
including	O
some	O
of	O
the	O
fore	O
mentioned	O
treatments	O
,	O
although	O
it	O
may	O
not	O
be	O
the	O
dominating	O
factor	O
.	O
</s>
<s>
Subsequently	O
,	O
the	O
structuring	O
of	O
the	O
photo-resist	O
using	O
direct	O
UV	B-Application
light	I-Application
exposure	O
is	O
applied	O
but	O
can	O
also	O
be	O
achieved	O
through	O
deep	O
reactive-ion-etching	O
(	O
DRIE	O
)	O
.	O
</s>
