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Solid State Technology
Scaling to 5nm: A plethora of paths
Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.
Wafer-level packaging of ICs for mobile systems of the future
The most functionality at the least cost is the promise of wafer-level packaging (WLP) when dealing with complex integrated circuits (IC) with a high number of input/output connections to the outside world.
450mm transition toward sustainability: Facility and infrastructure requirements
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.
Scouting report for materials at end of the road: 2013 ITRS
The IC fabrication industry is approaching the end of the road for device miniaturization, with both atomic and economic limits looming on the horizon.
Subatmospheric gas storage and delivery: Past, present and future
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.
HVM production and challenges of UHP PDMAT for ALD-TaN
For sub-22nm device generations, device manufacturers are likely to adopt PDMAT precursor for ALD-TaN barrier films for copper interconnect structures.
Flexible glass firms branch into new applications
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.
Noise cancellation: The new failure and yield analysis superpower
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.
Applied Materials introduces the biggest materials change to interconnect technology in 15 years
Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
Google Glass is far more than the sum of its parts, IHS Teardown reveals
Teardown analysis is a useful tool for understanding the component and manufacturing cost of electronics devices - but it doesn’t always tell the whole story of the value of a product.
SEMATECH achieves breakthrough defect reduction in EUV mask blanks
SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from the multi-layer deposition of mask blanks used for extreme ultraviolet (EUV) lithography, pushing the technology another significant step toward readiness for high-volume manufacturing (HVM).
SRC and UC Berkeley pursue more cost-effective approach to 3D chip integration
University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.
Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015
After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).
Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology
Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST\\\\\\\'s 28nm FD-SOI technology for SoC design.
The next big thing: IoT
The semiconductor industry has greatly benefited from the push to mobile technology, but what’s next?
SEMI's 3DIC standards activities
I have said many times that it will be impossible for a complicated technology like 3DIC to ever become commercial without standardization.
Challenges of EUVL HVM
Most of the papers at this year’s EUVL Conference during SPIE’s 2014 Advanced Lithography program focused on topics relating to EUVL’s entrance into high volume manufacturing (HVM).
The sustainable manufacturing imperative
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.