|Publication number||US5457659 A|
|Application number||US 08/276,993|
|Publication date||Oct 10, 1995|
|Filing date||Jul 19, 1994|
|Priority date||Jul 19, 1994|
|Also published as||DE19526411A1|
|Publication number||08276993, 276993, US 5457659 A, US 5457659A, US-A-5457659, US5457659 A, US5457659A|
|Original Assignee||Micron Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (4), Referenced by (91), Classifications (13), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates to semiconductor memory devices and more particularly to a DRAM that can be selectively programmed to provide an extended data out (EDO) feature.
Dynamic Random Access Memories (DRAMs) include an array of memory cells contained on a semiconductor integrated circuit chip (ICs). The memory cells are arranged in rows and columns (e.g., 1-Mbit, 4-Mbit, 16-Mbit, 64-Mbit). Each cell stores a bit of information by the presence or absence of an electric charge on a capacitor. In a DRAM, refresh circuitry is provided for "refreshing" the stored charge (i.e., restoring to full charge a capacitor that is partially discharged).
With the latter generations of DRAMs, various device options have been offered by semiconductor manufacturers to the customers who use the DRAMs in their electronic equipment. These device options provide different functional characteristics in a memory device and can be used to improve the performance of a DRAM or its suitability for a particular application.
A large percentage (e.g., over 90%) of DRAMs are sold with a fast page mode function and are termed fast page mode DRAMs. A fast page mode operation in a DRAM allows faster data operations within a row address defined page boundary. In general, this is accomplished by holding the row address (RAS) signals low and strobing in different column addresses (CAS) signals to execute faster memory cycles.
Another performance option in a DRAM is known as extended data out, or sometimes referred to as hyper page mode. A DRAM that includes this feature is termed an EDO DRAM. With an EDO DRAM, blocks of data can be outputted from the DRAM similar in fashion to the Fast-Page Mode DRAM but at a faster cycle rate. This is accomplished because the CAS signal, transitioning high, no longer controls the output buffer thereby providing for pipelined data flow. This allows data to be read and processed faster. In general, an extended output is accomplished by configuring a DRAM, such as a fast page mode DRAM, so that the CAS signal no longer tristates the I/O buffer when CAS goes into precharge.
Two other types of DRAM are known as a write per bit (WPB) DRAM and a static column DRAM. A write per bit (WPB) DRAM is configured with a RAS/WE key and mask register to provide latching mask data if WE is low when RAS transitions from a high to a low which the mask is now able to define which data inputs will be allowed to be passed through on the subsequent CAS transitions (low). A static column DRAM is configured similar to a Fast-Page-Mode DRAM with the exception that the column address buffer does not latch the data at CAS time (CAS going low) thereby eliminating the need for tCAC (i.e., access time from CAS). This provides faster page cycles since the CAS signal is no longer required to release data from the DRAM. A WPB DRAM and a static column DRAM can also be configured to have an extended data output.
These various device options in a DRAM typically utilize the same memory array but require different interface circuitry for addressing, enabling output and refreshing the memory cells within the memory array. The interface circuitry includes logic gates and CMOS transfer devices formed on board the chip to produce a desired circuit arrangement. The desired option is typically implemented during wafer fabrication utilizing appropriate mask sets to construct the required circuitry.
One disadvantage of this approach is inflexibility. The configuration of the chip is set at the time of manufacture and cannot be changed. A manufacturer must therefore fabricate large numbers of different wafers to produce the different types of chips needed to satisfy different markets. This increases product development costs and the time to market for a product. Similarly, customers who use ICs may be required to inventory several different types of chips for use in their products.
Another approach is to include all of the device options in one basic mask set and then derive the desired final configuration of the chip in the assembly operations. As an example, with bond programming, the chip configuration may be selected by either bonding to a pad or leaving the pad open. For achieving the desired circuit configuration, a bonded pad may connect to certain circuitry and an unbonded pad may be taken to a default potential. U.S. Pat. No. 5,303,180 to McAdams describes such a bond programming arrangement. Programmable links such as fuses and laser actuated links are also sometimes used to effect a device option.
These approaches are also somewhat inflexible and cannot always be easily implemented by a customer. What is needed is a method for selecting different performance options in a DRAM that does not require expensive manufacturing or assembly operations.
Accordingly, it is an object of the present invention to provide a DRAM configured with different performance options that can be enabled using appropriate logic signals. It is another object of the present invention to provide a DRAM such as a fast page mode DRAM, a WPB DRAM or a static column DRAM that can be configured as an EDO DRAM upon the input of appropriate logic signals.
In accordance with the invention, a DRAM that can be configured with an extended data output upon the input of appropriate logic signals is provided. The DRAM includes a CAS before RAS (CBR) detection circuit that controls the data output during a CBR refresh cycle.
The CBR detection circuit is connected to a refresh controller and also to a data out buffer for the DRAM. The operation of the CBR detection circuit is dependent on the state of the output enable (OE) signal during a CBR refresh cycle (e.g., WE-high, CAS-low, RAS-high then low while CAS low). If OE is low, then the CBR detection circuit will trigger a first output mode for the data out buffer (e.g., normal fast page output mode) along with a refresh pulse to the refresh controller. If OE is high then the CBR detection circuit will trigger an extended data output from the data out buffer. The configuring of the EDO option can be either with a persistent or a non persistent refresh. If persistent, once EDO is programmed, the command is no longer required until power is removed. A CBR with OE low will perform a CBR refresh (either as a Fast Page Mode or an EDO DRAM) and the first CBR with OE high will configure the DRAM as an EDO DRAM (but no refresh performed, although an option could be made to allow it to be performed) with all subsequent CBR with OE high commands ignored. If non-persistent, each CBR command would be a refresh command and either define a Fast-Page Mode/Static Column/WPB (OE low) or an EDO Mode (OE high).
The DRAM may be configured as a fast page mode DRAM, a write per bit DRAM or a static column DRAM. In each case data output from the DRAM can be switched to an extended data output mode depending on the state of OE during a CBR refresh cycle.
Other objects, advantages and capabilities of the present invention will become more apparent as the description proceeds.
FIG. 1 is an electrical diagram in block form of a fast page mode DRAM which may use features of the invention according to one embodiment;
FIG. 2 is an electrical diagram in block form of a portion of a prior art fast page mode DRAM illustrating the CBR detection circuit;
FIG. 2A is a timing diagram in which voltage is plotted as a function of time, illustrating the events occurring in the device of FIG. 2 during a CBR refresh cycle;
FIG. 3 is an electrical diagram in block form of a portion of a fast page mode DRAM constructed in accordance with the invention illustrating a CBR detection circuit adapted to trigger an EDO pulse or a fast page pulse depending on the state of OE;
FIG. 3A is a timing diagram in which voltage is plotted as a function of time, illustrating the events occurring in the device of FIG. 3 during a CBR refresh cycle with OE high; and
FIG. 3B is a timing diagram in which voltage is plotted as a function of time, illustrating the events occurring in the device of FIG. 3 during a CBR refresh cycle with OE low.
As used herein the term fast page mode DRAM refers to a dynamic memory device in which input signals are addressed into different columns in a predetermined row of memory cells.
An EDO DRAM refers to a dynamic memory device in which data is outputted without the constraints of the CAS control pin.
A WPB DRAM refers to a dynamic memory device in which the data being transferred may be masked (ignored) as programmed during RAS time.
A static column DRAM refers to a dynamic memory device in which the column address buffer is not latched.
Referring now to FIG. 1, a DRAM 10 which may utilize features of the present invention is shown. The DRAM 10 is in the form of a semiconductor integrated circuit chip constructed as a fast page mode DRAM. The DRAM 10 includes a 4-Mbit memory cell array 11 arranged in a x1 configuration of 2048 rows and columns. Other suitable sizes for a cell array include 1-Mbit, 16M-bit and 64M-bit. In addition, the cell arrays can be arranged in various other configurations (e.g., x2, x4, x8, x16)
The cell array 11 is addressed by row and column address circuitry including a compliment select 12 and a row decoder 13. These components receive row address signals from address pins 14 and row address buffers 15 though a row address bus 16. The address is multiplexed, so a column address is also applied via the address pins 14 and column address buffer 17 to a column decoder 18. The columns of the cell array 11 (i.e., bit lines) are connected to sense amplifiers 19 and to the column decoder 18 which selects some number of bits for input or output during a given write or read cycle. All of the sense amplifiers 19 are activated on every active read or write cycle and on every refresh cycle. Input/output gating is also associated with the sense amplifiers 19. The sense amplifiers 19 and I/O gating are connected to a data-out buffer 21 and to a data-in buffer 22. The data-in buffer 22 is connected to a data-in pin 23. The data-out buffer 21 is connected to a data-out pin 20.
The multiplexed addresses are accepted from the address pins 14 into the address buffers 15 under control of row and column address strobes RAS and CAS. These logic signals are applied to RAS pin 24 and CAS pin 25. The RAS address strobes are applied to a No. 1 clock generator 26 which generates internal clocks for driving the address buffers 15, the row decoder 13 and the sense amplifiers 19. The No. 1 clock generator 26 is also connected to a No. 2 clock generator 28 that coordinates signals to the data out buffer 21. In addition, the No. 1 clock generator 26 is connected to a refresh controller 29 and a refresh counter 30 that control operation of the refresh cycle. An early write detection circuit 31 along with logic gates 32, 33 and 34 are connected, substantially as shown, to a WE pin 27 for receiving write enable signals and to the CAS pin 25 for receiving column address signals. The EW detection circuit will "lockout" and prevent any READs from occurring if WE transitions low prior to CAS going low. If WE goes low after CAS goes low, both a READ and a WRITE could occur.
The selection of what operation is being performed in an active cycle is controlled by the WE pin 27. If the WE pin 27 is active-low, the cycle is a WRITE cycle and data will be accepted from the input pins 23 and written to the memory array 11 via the sense amplifiers 19. If the WE is inactive-high, the cycle is a READ cycle. During a READ cycle data extracted from the memory array 11 via the sense amplifiers 19 will be driven onto the data output pin 20.
During READ or WRITE cycles, each bit is uniquely addressed through the address pins 14 which are entered 11 bits at a time. RAS is used to latch the first 10 bits and CAS the latter 10 bits. During a WRITE cycle, data at data-in pin 23 is latched by the falling edge of WE or CAS, whichever occurs last. If WE goes low prior to CAS going low, the output at data-out pin 20 remains open (high Z) until the next CAS cycle. If WE goes low after data reaches the data output pins 20, the output is activated and retains the selected cell data as long as CAS remains low (regardless of WE or RAS). This late WE pulse results in a READ-WRITE cycle.
Returning RAS and CAS high terminates a memory cycle and decreases chip current to a reduced standby level. Also the chip is preconditioned for the next cycle during the RAS high time. Memory cell data is retained in its correct state by maintaining power and executing any RAS cycle (READ, WRITE, RAS ONLY, CAS-BEFORE-RAS, or HIDDEN refresh) so that all combinations of RAS addresses are executed at least every 15 ms.
PAGE MODE operations allow faster data operations (READ, WRITE or READ-MODIFY-WRITE) within a row address defined page boundary. The PAGE MODE cycle is always initiated with a row address strobed in by RAS followed by a column address strobed in by CAS. By holding RAS low, CAS may be toggled strobing in different column addresses executing faster memory cycles. Returning RAS high terminates the PAGE MODE operation.
These functions are summarized in the following truth table.
__________________________________________________________________________TRUTH TABLE AddressesFunction RAS CAS WE TF tR tC__________________________________________________________________________Standby H H H GND/NC X X High ImpedanceREAD L L H GND/NC ROW COL Data OutWRITE L L L GND/NC ROW COL Data In(EARLY-WRITE)READ-WRITE L L H→L→H GND/NC ROW COL Valid Data Out, Valid Data InPAGE-MODE L H→L→H H GND/NC ROW COL Valid Data Out,READ Valid Data OutPAGE-MODE L H→L→H L GND/NC ROW COL Valid Data In,WRITE Valid Data InPAGE-MODE L H→L→H H→L→H GND/NC ROW COL Valid Data Out,READ-WRITE Valid Data InRAS ONLY L H H GND/NC ROW n/a High ImpedanceREFRESHHIDDEN L→H→L L H GND/NC ROW COL Valid Data OutREFRESHCAS-BEFORE- H→L L H GND/NC X X High ImpedanceRAS REFRESH__________________________________________________________________________
The cell array 11 employs one-transistor dynamic memory cells wherein data bits are stored on capacitors. Because these capacitors leak, the data must be refreshed periodically (e.g., every 15 milliseconds). Several refresh mechanisms are available in DRAMs currently marketed. Figure A illustrates a conventional CAS before RAS refresh that is accomplished using the CBR detection circuit 35 shown in FIG. 2.
The CBR detection circuit 35 is connected to the No. 1 clock generator 26, to the CAS pin 25 and to the refresh controller 29, substantially as shown in FIG. 2. In addition, an output enable OE signal is applied to the data-out buffer 21 through an OE pin 36 to establish when the data-out buffer 21 is allowed to drive the data out pin 20. Only when OE is active-low can the data out pin 20 be driven by the data-out buffer 21.
If CAS falls before RAS this signals a refresh cycle in which the row address for refresh is held in the refresh counter 30. There is no data input or output during this operation, and no address is accepted. The WE signal must be high, signaling a CBR refresh (WE low would initiate a JEDEC test mode operation), when RAS falls for this type of refresh operation (i.e., WE-high, CAS-low, RAS-high then low while CAS low). The OE signal is ignored (i.e., "don't care") in a standard CAS before RAS refresh. There may be only one refresh cycle if RAS and CAS return to the high level, or there may be a continuous sequence of refresh cycles performed if RAS is toggled every 15-milliseconds (max) and CAS is held low.
Referring now to FIG. 3, a DRAM constructed in accordance with the invention is shown. In accordance with the invention, the CBR detection circuit 35A of a DRAM is constructed such that the data-out buffer 21A is triggered with an EDO pulse 38 or a fast page pulse 39. The state of the OE pin 36 (high or low) in effect controls the mode of the data out (fast page or EDO).
The fast page pulse 39 is triggered only when OE is high (and EDO has not been invoked for the first time in the persistent version). At the same time a CBR refresh pulse 40 is triggered. With OE low the CBR refresh pulse is not triggered but the EDO pulse is triggered in the persistent version. The non-persistent version would also generate the refresh command. In both cases, the CAS before RAS refresh is as previously described (i.e., WE-high, CAS-low, RAS-high then low while CAS low).
FIG. 3A illustrates the timing and state of RAS, CAS and WE for simultaneously triggering a CBR refresh pulse and a fast page pulse.
FIG. 3B illustrates the timing and state of RAS, CAS and WE for triggering an EDO pulse instead of a CBR refresh pulse.
In FIGS. 3A and 3B:
VIH is input high (Logic 1) voltage
VIL is input low (Logic 0) voltage
tRP is RAS precharge time
tRAS is RAS pulse width
tRPC is RAS to CAS precharge time
tCPN is CAS precharge time
tCSR is CAS set up time
tCHR is CAS hold time
tWRP is WE setup time
tWRH is WE hold time
Logic signals thus control the operation of the CBR detection circuit 35A to provide an EDO pulse 38 or a fast page pulse 39.
Thus the invention can be used to provide a DRAM that can be operated in one mode (e.g., fast page mode) and also operated as an EDO DRAM with the input of proper logic signals. Although the invention has been described in an illustrative embodiment for a fast page mode DRAM, the same principles can be used to construct a WPB DRAM or a static column DRAM to be configurable as an EDO DRAM.
Thus the invention has been described with reference to certain preferred embodiments, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5262998 *||Aug 14, 1991||Nov 16, 1993||Micron Technology, Inc.||Dynamic random access memory with operational sleep mode|
|US5303180 *||Aug 29, 1991||Apr 12, 1994||Texas Instruments Incorporated||Pin programmable dram that allows customer to program option desired|
|US5327387 *||Nov 5, 1992||Jul 5, 1994||Fujitsu Limited||Dynamic random access memory having an improved operational stability|
|US5349566 *||May 19, 1993||Sep 20, 1994||Micron Semiconductor, Inc.||Memory device with pulse circuit for timing data output, and method for outputting data|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5532961 *||Nov 22, 1994||Jul 2, 1996||Mitsubishi Denki Kabushiki Kaisha||Semiconductor memory device having extended data out function|
|US5546344 *||Jun 6, 1995||Aug 13, 1996||Cirrus Logic, Inc.||Extended data output DRAM interface|
|US5604714 *||Nov 30, 1995||Feb 18, 1997||Micron Technology, Inc.||DRAM having multiple column address strobe operation|
|US5604880 *||May 7, 1996||Feb 18, 1997||Intel Corporation||Computer system with a memory identification scheme|
|US5610864 *||Feb 10, 1995||Mar 11, 1997||Micron Technology, Inc.||Burst EDO memory device with maximized write cycle timing|
|US5617362 *||Apr 9, 1996||Apr 1, 1997||Mitsubishi Denki Kabushiki Kaisha||Semiconductor memory device having extended data out function|
|US5640364 *||Dec 6, 1995||Jun 17, 1997||Micron Technology, Inc.||Self-enabling pulse trapping circuit|
|US5644549 *||Mar 21, 1996||Jul 1, 1997||Act Corporation||Apparatus for accessing an extended data output dynamic random access memory|
|US5663658 *||Apr 12, 1996||Sep 2, 1997||Micron Technology, Inc.||Low current redundancy fuse assembly|
|US5668760 *||Apr 23, 1996||Sep 16, 1997||Intel Corporation||Nonvolatile memory with a write protection circuit|
|US5668773 *||Nov 2, 1995||Sep 16, 1997||Micron Technology, Inc.||Synchronous burst extended data out DRAM|
|US5675549 *||Jun 1, 1995||Oct 7, 1997||Micron Technology, Inc.||Burst EDO memory device address counter|
|US5682354 *||Nov 6, 1995||Oct 28, 1997||Micron Technology, Inc.||CAS recognition in burst extended data out DRAM|
|US5696732 *||Nov 21, 1996||Dec 9, 1997||Micron Technology, Inc.||Burst EDO memory device|
|US5703813 *||Nov 14, 1996||Dec 30, 1997||Micron Technology, Inc.||DRAM having multiple column address strobe operation|
|US5706247 *||Nov 21, 1996||Jan 6, 1998||Micron Technology, Inc.||Self-enabling pulse-trapping circuit|
|US5715206 *||Aug 22, 1996||Feb 3, 1998||Samsung Electronics Co., Ltd.||Dynamic random access memory having sequential word line refresh|
|US5717639 *||Jan 13, 1997||Feb 10, 1998||Micron Technology, Inc.||Memory device having circuitry for initializing and reprogramming a control operation feature|
|US5717654 *||Feb 10, 1997||Feb 10, 1998||Micron Technology, Inc.||Burst EDO memory device with maximized write cycle timing|
|US5721859 *||Nov 7, 1995||Feb 24, 1998||Micron Technology, Inc.||Counter control circuit in a burst memory|
|US5729503 *||Jul 24, 1995||Mar 17, 1998||Micron Technology, Inc.||Address transition detection on a synchronous design|
|US5729504 *||Dec 14, 1995||Mar 17, 1998||Micron Technology, Inc.||Continuous burst edo memory device|
|US5737276 *||Sep 11, 1996||Apr 7, 1998||Samsung Electronics Co., Ltd.||Memory device with fast extended data out (EDO) mode and methods of operation therefor|
|US5749086 *||Feb 29, 1996||May 5, 1998||Micron Technology, Inc.||Simplified clocked DRAM with a fast command input|
|US5761136 *||Dec 19, 1996||Jun 2, 1998||Lg Semicon Co., Ltd.||Circuit for generating a column switch enable signal of a memory|
|US5802010 *||Jun 10, 1996||Sep 1, 1998||Micron Technology, Inc.||Burst EDO memory device|
|US5802550 *||Jan 17, 1996||Sep 1, 1998||Apple Computer, Inc.||Processor having an adaptable mode of interfacing with a peripheral storage device|
|US5812488 *||Mar 5, 1997||Sep 22, 1998||Micron Technology, Inc.||Synchronous burst extended data out dram|
|US5831931 *||Jul 9, 1997||Nov 3, 1998||Micron Technology, Inc.||Address strobe recognition in a memory device|
|US5831932 *||Aug 19, 1997||Nov 3, 1998||Micron Technology, Inc.||Self-enabling pulse-trapping circuit|
|US5850368 *||Sep 2, 1997||Dec 15, 1998||Micron Technology, Inc.||Burst EDO memory address counter|
|US5898856 *||Sep 15, 1995||Apr 27, 1999||Intel Corporation||Method and apparatus for automatically detecting a selected cache type|
|US5945840 *||Jun 20, 1997||Aug 31, 1999||Micron Technology, Inc.||Low current redundancy anti-fuse assembly|
|US5946265 *||Jul 11, 1997||Aug 31, 1999||Micron Technology, Inc.||Continuous burst EDO memory device|
|US5963504 *||Dec 19, 1997||Oct 5, 1999||Micron Technology, Inc.||Address transition detection in a synchronous design|
|US5966724 *||Jan 11, 1996||Oct 12, 1999||Micron Technology, Inc.||Synchronous memory device with dual page and burst mode operations|
|US6034919 *||Dec 31, 1996||Mar 7, 2000||Compaq Computer Corporation||Method and apparatus for using extended-data output memory devices in a system designed for fast page mode memory devices|
|US6067258 *||Dec 3, 1998||May 23, 2000||Lg Semicon Co., Ltd.||Operation mode determining circuit for semiconductor memory device|
|US6112284 *||Dec 30, 1994||Aug 29, 2000||Intel Corporation||Method and apparatus for latching data from a memory resource at a datapath unit|
|US6378089||Aug 26, 1998||Apr 23, 2002||Micron Technology, Inc.||Internal guardband for semiconductor testing|
|US6381180||Feb 26, 1998||Apr 30, 2002||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US6401186||Jul 3, 1996||Jun 4, 2002||Micron Technology, Inc.||Continuous burst memory which anticipates a next requested start address|
|US6414898 *||Jan 16, 2001||Jul 2, 2002||Taiwan Semiconductor Manufacturing Company||Method to reduce peak current for RAS cycle sensing in DRAM using non-multiplexed row and column addresses to avoid damage to battery|
|US6418547||Feb 26, 1998||Jul 9, 2002||Micron Technology, Inc.||Internal guardband for semiconductor testing|
|US6505282 *||Mar 19, 1997||Jan 7, 2003||Intel Corporation||Method and apparatus for determining memory types of a multi-type memory subsystem where memory of the different types are accessed using column control signals with different timing characteristics|
|US6525971||Jul 27, 1999||Feb 25, 2003||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US6535956||Nov 23, 1998||Mar 18, 2003||Intel Corporation||Method and apparatus for automatically detecting whether a board level cache is implemented with Mcache|
|US6567904 *||Dec 29, 1995||May 20, 2003||Intel Corporation||Method and apparatus for automatically detecting whether a memory unit location is unpopulated or populated with synchronous or asynchronous memory devices|
|US6578165||Aug 30, 2001||Jun 10, 2003||Micron Technology, Inc.||Internal guardband for semiconductor testing|
|US6601156||Apr 8, 2002||Jul 29, 2003||Micron Technology, Inc.||Continuous interleave burst access|
|US6615325||Dec 3, 1997||Sep 2, 2003||Micron Technology, Inc.||Method for switching between modes of operation|
|US6725349 *||Mar 13, 2003||Apr 20, 2004||Intel Corporation||Method and apparatus for controlling of a memory subsystem installed with standard page mode memory and an extended data out memory|
|US6728142||Aug 29, 2002||Apr 27, 2004||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US6804760||Jun 1, 1995||Oct 12, 2004||Micron Technology, Inc.||Method for determining a type of memory present in a system|
|US6819599||Aug 1, 2002||Nov 16, 2004||Micron Technology, Inc.||Programmable DQS preamble|
|US6914830||Aug 29, 2002||Jul 5, 2005||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US6967348||Jun 20, 2002||Nov 22, 2005||Micron Technology, Inc.||Signal sharing circuit with microelectric die isolation features|
|US6981126||Jul 8, 2003||Dec 27, 2005||Micron Technology, Inc.||Continuous interleave burst access|
|US7026646||Jun 20, 2002||Apr 11, 2006||Micron Technology, Inc.||Isolation circuit|
|US7043617||Feb 22, 2000||May 9, 2006||Micron Technology, Inc.||System supporting multiple memory modes including a burst extended data out mode|
|US7075857||Aug 29, 2002||Jul 11, 2006||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US7088625||Sep 22, 2004||Aug 8, 2006||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US7103742||Dec 3, 1997||Sep 5, 2006||Micron Technology, Inc.||Burst/pipelined edo memory device|
|US7124256||Dec 3, 1997||Oct 17, 2006||Micron Technology, Inc.||Memory device for burst or pipelined operation with mode selection circuitry|
|US7210020||Nov 2, 2005||Apr 24, 2007||Micron Technology, Inc.||Continuous interleave burst access|
|US7299203 *||Apr 19, 2001||Nov 20, 2007||Xilinx, Inc.||Method for storing and shipping programmable ASSP devices|
|US7330382||Aug 30, 2004||Feb 12, 2008||Micron Technology, Inc.||Programmable DQS preamble|
|US7349269||Aug 31, 2005||Mar 25, 2008||Micron Technology, Inc.||Programmable DQS preamble|
|US7378290||Aug 30, 2004||May 27, 2008||Micron Technology, Inc.||Isolation circuit|
|US7397711||May 18, 2006||Jul 8, 2008||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US7550762||Jan 24, 2006||Jun 23, 2009||Micron Technology, Inc.||Isolation circuit|
|US7646654||Jun 23, 2008||Jan 12, 2010||Micron Technology, Inc.||Distributed write data drivers for burst access memories|
|US7681005||May 20, 1996||Mar 16, 2010||Micron Technology, Inc.||Asynchronously-accessible memory device with mode selection circuitry for burst or pipelined operation|
|US7681006||Dec 3, 1997||Mar 16, 2010||Micron Technology, Inc.||Asynchronously-accessible memory device with mode selection circuitry for burst or pipelined operation|
|US7952169||May 19, 2009||May 31, 2011||Micron Technology, Inc.||Isolation circuit|
|US8107304||Jan 31, 2012||Round Rock Research, Llc||Distributed write data drivers for burst access memories|
|US8213244||Oct 18, 2011||Jul 3, 2012||Round Rock Research, Llc||Distributed write data drivers for burst access memories|
|US8501563||Sep 13, 2012||Aug 6, 2013||Micron Technology, Inc.||Devices with nanocrystals and methods of formation|
|US8921914||Aug 5, 2013||Dec 30, 2014||Micron Technology, Inc.||Devices with nanocrystals and methods of formation|
|US20030177303 *||Mar 13, 2003||Sep 18, 2003||Intel Corporation||Method and apparatus for controlling of a memory subsystem installed with standard page mode memory and an extended data out memory|
|US20030234393 *||Jun 20, 2002||Dec 25, 2003||Micron Technology, Inc.||Isolation circuit|
|US20030235929 *||Jun 20, 2002||Dec 25, 2003||Micron Technology, Inc.||Signal sharing circuit with microelectronic die isolation features|
|US20050024972 *||Aug 30, 2004||Feb 3, 2005||Micron Technology, Inc.||Programmable DQS preamble|
|US20050026315 *||Aug 30, 2004||Feb 3, 2005||Micron Technology, Inc.||Isolation circuit|
|US20060007760 *||Aug 31, 2005||Jan 12, 2006||Micron Technology, Inc.||Programmable DQS preamble|
|US20060131577 *||Jan 24, 2006||Jun 22, 2006||Micron Technology, Inc.||Isolation circuit|
|US20060248293 *||Jul 10, 2006||Nov 2, 2006||Micron Technology, Inc.||Asynchronously-accessible memory devices and access methods|
|US20060253665 *||Jul 11, 2006||Nov 9, 2006||Micron Technology, Inc.||Memory devices and access methods|
|US20090224242 *||May 19, 2009||Sep 10, 2009||Micron Technology, Inc.||Isolation circuit|
|EP0851425A2 *||Dec 31, 1997||Jul 1, 1998||Compaq Computer Corporation||Method and apparatus for using EDO memory devices in a memory system designed for FPM memory devices|
|WO1996021226A1 *||Dec 28, 1995||Jul 11, 1996||Intel Corporation||An apparatus and method for increasing the burst rate of edo drams in a computer system|
|U.S. Classification||365/222, 365/191, 365/238.5, 365/230.03, 365/189.05, 365/193|
|International Classification||G11C7/10, G11C11/401, G11C11/406|
|Cooperative Classification||G11C7/1024, G11C11/406|
|European Classification||G11C11/406, G11C7/10M2A2|
|Oct 21, 1994||AS||Assignment|
Owner name: MICRON SEMICONDUCTOR, INC., IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SCHAEFER, SCOTT;REEL/FRAME:007167/0034
Effective date: 19940715
|Jul 31, 1995||AS||Assignment|
Owner name: MICRON TECHNOLOGY, INC., IDAHO
Free format text: MERGER;ASSIGNOR:MICRON SEMICONDUCTOR, INC.;REEL/FRAME:007572/0502
Effective date: 19941104
|Mar 29, 1999||FPAY||Fee payment|
Year of fee payment: 4
|Mar 17, 2003||FPAY||Fee payment|
Year of fee payment: 8
|Mar 16, 2007||FPAY||Fee payment|
Year of fee payment: 12