hot melt glue
A hot melt application system is formed when the Xmelt hot melt units are used in conjunction with heated hoses and guns. The Xmelt systems come with a double-action electronic piston pump but a gear pump can be included if needed.
These devices have micro processing regulators that serve up to 14 heating cirucits with a PID-conduct mechanism. They can change granules into liquid glue and then pump it through the heated hoses to the guns. The liquid glue is then placed on the packaging surfaces at its ideal temperature.
These machines allow operators to centrally manage their hot melt systems.