Prasad, MJNV and Chokshi, AH (2010) Superplasticity in electrodeposited nanocrystalline nickel. In: Acta Materialia, 58 (17). pp. 5724-5736.
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Electrodeposited nanocrystalline Ni films were processed with different levels of S, to evaluate the role of S on superplasticity. All the materials exhibited high strain rate superplasticity at a relatively low temperature of 777 K. Microstructural characterization revealed that the S was converted to a Ni3S2 phase which melts at 908 K; no S could be detected at grain boundaries. There was no consistent variation in ductility with S content. Superplasticity was associated with a strain rate sensitivity of similar to 0.8 and an inverse grain size exponent of similar to 1 both of which are unusual observations in superplastic flow of metals. Based on the detailed experiments and analysis, it is concluded that superplasticity in nano-Ni is related to an interface controlled diffusion creep process, and it is not related to the presence of S at grain boundaries or a liquid phase at grain boundaries. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs to Elsevier Science.|
|Keywords:||Nanocrystalline; Nickel; Electrodeposition; Sulfur; Superplasticity|
|Department/Centre:||Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)|
|Date Deposited:||26 Oct 2010 07:27|
|Last Modified:||26 Oct 2010 07:27|
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