Coventor/Kyocera package libraries contain software models of MEMS-compatible, open-tool hermetic ceramic packages. They target RF, inertial, and infrared MEMS applications, and include elements such as package mask, process descriptions, material property data, and 3-D detailed models. The libraries initially enable users to couple MEMS devices and standard packages for analysis of thermomechanical effects, low- and high-frequency-coupled RLC effects, as well as failure modes and design. The standard package library contains models that include SMD, side braze, pin grid array, Cerdip, and leadless chip carrier. Coventor Inc., Cary, N.C., www.coventor.com.
Wave Solder Flux
3592-35 wave solder flux is a no-clean, halide-free material that provides enhanced heat stability for the higher temperatures required in lead-free wave soldering processes. It is a solvent-based formulation designed to provide a wide process window and superior hole fill and solderability on all board finishes with minimized solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys. Indium Corp. of America, Clinton, N.Y., www.indium.com.
Servo Motion Controllers
NanoC modular, multi-axis servo motion controllers are used for nanometric position control. With a high-performance, multiprocessor architecture, they offer a fully integrated drive system with high-speed motion control, velocity ripple control, nanometric stability, and position control, along with real-time operation and safety functions. They use high-bandwidth control loops up to 50 KHz, as well as advanced motion control tools and FFT/Bode analysis. Schneeberger Inc., Bedford, Mass., www.schneeberger.com.
Leak Test Instrument
Sentinel M24 leak test instrument provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display, and an enhanced operator interface. It reduces part fill and exhaust times by 80%, and functions in single- or multiple-station configurations. It also provides auto calibration and corrects for temperature changes, and features a modular design and tooling control functions. The instrument enclosure is compact in size, measuring 16” × 14” × 8”. It can communicate directly to factory or other networks by linking through Ethernet or RS232 and RS485 ports. Cincinnati Test Systems Inc., Cleves, Ohio, www.cincinnati-test.com.
GT4000 timing analyzer provides a high-speed serial (HSS) interface jitter analysis solution for automated test equipment (ATE), and it lowers the overall production test cost of HSS interfaces, such as PCI Express and Serial ATA by providing total jitter decomposition and an asynchronous pattern verification on up to 32 differential channels (8 in parallel). The continuous timestamping of the direct edge timing measurements enables analysis, as well as one-shot PLL lock time and spread spectrum modulation verification. Guidetech, Sunnyvale, Calif., www.guidetech.com.
ENSEMBLE ARC advanced bottom anti-reflective coatings (BARCs) target 248- and 193-nm lithography applications for ICs, exhibiting planarization, gap-fill, and optical characteristics, and are compatible with all photoresist chemistries and standard lithographic spin-track tool platforms. The films are designed for both front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL) applications. The 193-nm solutions for FEOL and BEOL applications currently are being evaluated, with 248-nm formulations following later this year. The Dow Chemical Co., Midland, Mich., www.dow.com.
Gold Bonding Wire
Radix gold bonding wire is engineered for higher intermetallic stability for improved reliability in demanding wirebonding applications. It shows reliability on a wide range of aluminum bond pad compositions and thicknesses. It is available in a range of diameters, including wire sizes typically used in high-power applications, and it lowers hardness on free-air balls (FAB), allowing for bonding on sensitive device structures, such as low-k dielectrics and over-active circuitry. Kulicke & Soffa Industries Inc., Willow Grove, Pa., www. kns.com.
Hysol GR 725-AG molding compound is designed for high-temperature SO packages and surface-mount discrete packages operating at high temperatures where good electrical stability is required. It is being used in Power SO packages with continuous-use temperatures up to 200°C, meets JEDEC Level I, 260°C reflow profile precondition requirements, and incorporates patented green (non-antimony/non-bromine/non-phosphorous) flame-retardant technology. It also demonstrates adhesion to nickel/palladium/gold and copper/silver lead frames. Henkel, Industry, Calif., www.henkel. com.
EMI-shielded sockets prevent electromagnetic interference (EMI) from impacting signal clarity, timing, and integrity. Made of stainless steel with integrated beryllium copper contacts, the shield interfaces to the earth ground layer of the test board to block electromagnetic influxes, fully drawing EMI energy away from the testing environment and protecting the device under test. The shield creates a barrier around the socket that protects the device from interference generated by outside sources. The shield is made of non-oxidizing materials, allowing for testing in high humidity and/or corrosive test applications. WELLS-CTI, Phoenix, Ariz., www.wellscti.com.
Flip Chip ICs
LX7205 and LX7206 flip chip ICs are designed to filter electromagnetic interference and protect electrostatic discharge damage in portable electronic applications, particularly earpiece speaker ports. The LX7206 version also filters microphone ports. Bi-directional protection from both positive and negative electrostatic discharge voltages is integrated into both versions. Other features include a transient voltage suppression operating voltage of only 5.0 V, and low leakage current specifications. Microsemi Corp., Irvine, Calif., www.microsemi.com.
Smart power switch technology offers a multichip solution based on power discrete technology, control IC technology, and packaging. Benefits include enhanced system interface, increased device and system protection, control for power and current sensing, and reduced system power dissipation. It improves resistive load controls, interior heating and cooling fans, solenoid and ignition coil, and smart switch-on-plug designs. Offering isolation between power and control silicon, it improves product ruggedness and reliability, particularly in harsh electrical environments. Fairchild Semiconductor, South Portland, Maine, www.fairchildsemi.com.
CN-1531, a reworkable underfill encapsulant, is designed for CSP and BGA encapsulation, having a Tg of 110°C for more severe thermal cycle requirements. Removal of defective CSPs and BGAs is accomplished by heating the component and the underfill encapsulant to 220°C, and residues are scraped or brushed off. It has a viscosity of 5,000 cps at room temperature, facilitating dispensing, and is capable of flowing at 18 mm with a single-side dispense in 15 sec. It self-fillets, eliminating the need for seal passes, and can be cured in an in-line oven in 5 min. at 165°C. Zymet Inc., East Hanover, N.J., www.zymet.com.
AlSiC is a metal-matrix composite that provides high-performance lids, or heat spreaders, and enables a tailored coefficient of thermal expansion, making it compatible with many electronic devices and assemblies. It can be tuned for specific applications by modifying the Al-metal/SiC-particulate ratio. It features a high thermal conductivity, resulting in efficient thermal dissipation and preventing the bowing and flexing of packaging and substrate material that leads to failure. CPS Corp., Chartley, Mass., www.alsic.com.