|Publication number||US6475276 B1|
|Application number||US 09/687,205|
|Publication date||Nov 5, 2002|
|Filing date||Oct 13, 2000|
|Priority date||Oct 15, 1999|
|Also published as||US6482262, US6800552, US6821889, US7144809, US7485340, US20020187256, US20030031807, US20050064098, US20070190248|
|Publication number||09687205, 687205, US 6475276 B1, US 6475276B1, US-B1-6475276, US6475276 B1, US6475276B1|
|Inventors||Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio, Pekka Juha Soininen|
|Original Assignee||Asm Microchemistry Oy|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (7), Non-Patent Citations (8), Referenced by (225), Classifications (102), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present application claims the priority benefit under 35 U.S.C. §119(e) to U.S. Provisional Application No. 60/176,948, filed Jan. 18, 2000, and No. 60/159,799 filed Oct. 15, 1999 and under 35 U.S.C. §119(a) to Finnish Application Nos. FI 19992233, filed Oct. 15, 1999, FI19992234 filed Oct. 15, 1999, FI19992235, filed Oct. 15, 1999 and FI20000564 filed Mar. 10, 2000.
1. Field of the Invention
The present invention relates generally to a method of depositing thin films. In particular, the invention concerns a method of growing elemental metal thin films by Atomic Layer Deposition (ALD) using a boron compound as a reducing agent.
2. Description of the Related Art
The integration level of components in integrated circuits is increasing, producing a need for smaller components and interconnects. Design rules are dictating a feature size less than or equal to 0.2 μm. This makes complete film coverage on deep vias difficult to obtain.
Integrated circuits contain interconnects that are conventionally made of aluminum. Today, copper is replacing aluminum because it has lower electrical resistance and better electromigration resistance than aluminum.
Chemical Vapor Deposition (CVD) has been commonly used to produce metal films. In CVD, the source materials are typically fed into a reaction space together, where they react when brought into contact with a hot substrate. Thus, the growth rate of the metal film depends in part upon the concentration of the different source materials in the reaction space. Additionally, the temperature of the substrate affects the rate of deposition. In thermal CVD a single source chemical can be thermally decomposed near the substrate.
Atomic Layer Deposition (ALD) is an advanced alternative to CVD. The ALD method is based on sequential self-saturating surface reactions and has been described in detail in U.S. Pat. Nos. 4,058,430 and 5,711,811. Source chemicals are pulsed into the reaction chamber in an inert carrier gas. The pulses of source chemical can be separated from each other by a purging flow of inert gas. The separation of the source chemicals and the proper choice of source chemicals prevents gas-phase reactions between gaseous reactants and enables self-saturating surface reactions. This allows for film growth without strict temperature control of the substrate or precise dosage control of the reactants. Surplus reactants and byproducts are removed from the chamber, such as by a purging flow of inert gas, before the next reactive chemical pulse is introduced. Undesired gaseous molecules are effectively removed from the reaction chamber by keeping the gas flow speeds high. The purging gas pushes the extra molecules towards the vacuum pump that is used to maintain a suitable pressure in the reaction chamber. Thus, ALD provides for rapid, uniform, controlled film growth.
While ALD has been used to produce both elemental and compound thin films, there are a number of drawbacks to the methods that have been used. Thus, a need exists for improvements in the production of metal thin films.
In one embodiment, the present invention provides a method of growing elemental thin films on a substrate by an atomic layer deposition (ALD) type process. The method comprises introducing vapor phase pulses of at least one elemental source compound and at least one boron source compound into a reaction space that contains a substrate on which the thin film is to be deposited.
The vapor phase pulses are alternately introduced in a cycle. Each cycle comprises introducing an elemental source compound into a reaction space containing a substrate, removing any gaseous compounds from the reaction space, introducing a boron source compound into the reaction space, and removing any gaseous compounds from the reaction space. The elemental source compound preferably reacts with the surface of the substrate producing a surface bound elemental compound. Preferably the boron source compound is capable of reducing the surface bound elemental compound into elemental form.
In the preferred embodiment a metal source compound is used and an elemental metal thin film is grown on the substrate. The metal source compound and boron source compound are fed into the reaction chamber with the aid of an inert carrier gas. An inert gas may also be used to purge the reaction space after each pulse of metal source compound and boron compound.
In one embodiment the boron compound contains at least one carbon atom and the elemental source compound comprises at least one metal selected from the group consisting of Cu, Ag, Au, Pd, Rh and/or Ir. In another embodiment the boron compound contains no carbon atoms and the elemental source compound comprises at least one metal selected from the group consisting of Cu, Ag, Au, Pd, Rh, Ir, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and/or W.
In accordance with one aspect of the invention, an electron conductor is produced by an ALD type process wherein a boron compound is used to reduce a surface bound elemental compound to its elemental state. In accordance with another aspect of the invention, an interconnect is produced in an integrated circuit by depositing a metal thin film by an ALD type process wherein a boron compound is used to reduce a surface bound metal compound to its elemental state. In yet another embodiment a metal seed layer is grown on a substrate by growing an elemental metal thin film on a substrate by an ALD type process wherein a boron compound is used to reduce a surface bound metal compound to its elemental state.
FIG. 1 presents a block diagram of a pulsing sequence for producing elemental films according to a preferred embodiment of the invention.
An “ALD type process” is a process in which deposition of material onto a surface is produced by sequential and alternating self-saturating surface reactions. The principles of ALD are disclosed in U.S. Pat. Nos. 4,058,430 and 5,711,811, the disclosures of which are incorporated herein by reference. “Reaction space” is used to designate the portion(s) a reactor or reaction chamber in which the conditions can be adjusted so that deposition by ALD is possible. “Thin film” is used to designate a film that is grown from elements or compounds that are transported as separate ions, atoms or molecules from the source to the substrate. The thin film may be, for example, an elemental metal thin film. However, one skilled in the art will recognize that the principles and advantages disclosed herein are applicable to elemental thin films other than metal. The inventors have found the processes disclosed herein particularly advantageous for depositing metal layers. The thickness of the film depends on the application and may vary in a wide range. For example, an elemental metal thin film may range from one atomic layer to 1,000 nm in thickness.
“Elemental thin film” means a thin film with constituents having an oxidation state of zero. The elemental thin films disclosed herein comprise elemental metals and metal alloys.
An “elemental source compound” or material is a compound that comprises at least one molecule of the element that is to comprise the desired elemental thin film. In the illustrated embodiments, the elemental source compound is a vapor-phase metal source compound.
A “boron reducing compound” is any boron-containing compound that is capable of reducing an elemental compound to its elemental state.
An “organic boron compound” is a boron-containing compound that comprises at least one carbon atom.
A “surface bound elemental complex” is an adsorbed species upon the substrate that contains the element that is to form the desired thin film, in addition to terminating ligands or tails. The surface bound elemental complex (e.g., chemisorbed metal complex) can be the elemental source compound or a portion thereof.
An “adsorbed metal complex” or “chemisorbed metal complex,” as used herein, denote a compound including both a metal atom and terminating ligand(s) such as halide or organic tails.
According to the present invention, a chemical gaseous deposition process is used to produce metal thin films. Preferably, this process is an ALD type process.
According to a preferred embodiment of the present invention, elemental metal thin films are prepared by an ALD type process. Surface bound or chemisorbed metal complexes are reduced by boron compounds into elemental form. Thus, in one embodiment of the invention, a substrate is first placed in a reaction chamber where it is subjected to alternately repeated surface reactions of at least two vapor-phase reactants. Preferably the substrate is maintained at an elevated temperature. The boron reducing compounds preferably are not incorporated appreciably into the resulting thin film.
In the ALD type process of the preferred embodiment, the conditions in the reaction space are adjusted so that gas-phase reactions are avoided. Reactions are limited to adsorption on the substrate in one phase, and reactions that occur between complex adsorbed on the surface of the substrate and a gaseous reactant in another phase. Thus, the molecules of the boron reducing compound react with the surface bound elemental complex on the surface of the substrate.
In the preferred embodiment, vapor-phase pulses of metal source material and the boron reducing agent are alternately and sequentially fed into the reaction space where they contact the surface of the substrate. Initially, the “surface” of the substrate comprises the actual substrate material. Alternately, the substrate may be pretreated in advance. For example, the substrate may be contacted with a chemical that modifies the surface properties of the substrate. During the growing of the metal thin films, the previous thin film layer forms the surface for any subsequent thin film layer.
The metal source material and boron reducing agent are preferably fed into the reaction chamber in pulses with the aid of an inert carrier gas. In one embodiment, each pulse is followed by an inert gas pulse that purges any unreacted residues or byproducts from the reaction chamber. This allows for the use of highly reactive chemicals and thus low deposition temperatures. The inert gas used in the purging pulse is preferably the same gas used as the carrier gas. The inert gas may comprise an inactive gas, such as nitrogen or a noble gas, such as argon.
According to one embodiment, a mild reducing agent is added to the inert gas purge in order to prevent the possible reoxidation of the substrate surface. The reducing agent is preferably used in a concentration of 0.1% to 10%, more preferably 0.5% to 5% and even more preferably 0.5% to 1% by volume of the inert gas. The agent is selected so that it will not have a detrimental effect on the substrate surface. In one embodiment, hydrogen is used as the mild reducing agent.
Thus, one sequence or “cycle” in the process of depositing metal thin films preferably consists of:
1. Feeding a vapor phase pulse of an elemental source chemical into the reaction space with the help of an inert carrier gas;
2. Purging the reaction space with an inert gas;
3. Feeding a vapor-phase pulse of a boron source chemical into the reaction space with the help of an inert carrier gas; and
4. Purging the reaction space with an inert gas.
The above-described cycle can be repeated to produce metal films of the desired thickness.
The deposition can be carried out at atmospheric pressure. Preferably, the deposition is carried out at a reduced pressure of 0.01 mbar to 20 mbar, more preferably 0.1 mbar to 5 mbar. The substrate temperature is preferably low enough to keep the bonds between metal atoms intact and to prevent thermal decomposition of the gaseous reactants. On the other hand, the substrate temperature is preferably high enough to keep the source materials in the gaseous phase. Condensation of the gaseous reactants is preferably avoided. Further, the temperature is preferably sufficiently high to provide the required activation energy for the surface reaction. The preferred temperature depends upon the specific reactants and pressure. However the temperature of the substrate is preferably between 100° C. and 700° C. and more preferably between 250° C. and 500° C.
The source temperature is preferably set below the substrate temperature. If the partial pressure of the source chemical vapor exceeds the condensation limit at the substrate temperature, condensation may occur and the controlled layer-by-layer growth of the film may be lost.
Under the preferred conditions described above, at least a portion of the metal source reactant will bind to the substrate surface through chemisorption. Maximum coverage is obtained when a single layer of surface bound metal complex is formed. At this point there are no more binding sites available for the metal source compound and adsorption ceases. Thus, the amount of reactant bound to the surface of the substrate will be limited by self-saturation and the maximum increase in thin film thickness is one atomic layer per pulsing sequence. Depending on the size of the surface bound or chemisorbed metal complex, the increase in thin film thickness can be less than one atomic layer per pulsing sequence on average. The pulsing sequence is repeated to produce a thin film of the desired thickness.
The amount of time available for the self-saturating reactions is limited mostly by economic factors, such as a required throughput of product. Very thin films may be made by relatively few pulsing cycles. In some cases this will allow for an increase in the source chemical pulse time and thus allow for the use of source compounds with a lower vapor pressure.
The substrate can be any material known in the art. Examples include silicon, silica, coated silicon, copper metal and nitrides, such as metal nitrides. A typical substrate is a silicon wafer coated with nitrides.
The present method provides an excellent way to grow conformal layers in geometrically challenging applications. For example, elemental metal films may be grown on vias or trenches. According to one embodiment of the present invention, a metal thin film is grown on TiN or TaN or another suitable nitride that forms a nucleating layer to which metals can attach. For example, an elemental metal thin film may be grown over a metal nitride diffusion barrier in a dual damascene structure. Thereafter a film of desired form (e.g. copper film) can be grown by an electrolytic method.
The elemental source materials most typically used to grow elemental thin films are preferably volatile or gaseous compounds of the transition metals of groups 3, 4, 5, 6, 7, 8, 9, 10, 11 and/or 12 (according to the IUPAC system) in the periodic table of the elements. In particular, the elemental metal thin films consist essentially of one or more of W, Cu, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, Pd, Pt, Rh, Ir, Ag and Au.
Since the properties of each elemental compound are different, their suitability for use in the method of the present invention must be individually assessed in light of the other reactants that will be used. The properties of the elemental compounds are known to the skilled artisan and may be found, for example, in N. N. Greenwood and A. Earnshaw, Chemistry of the Elements, 1st Edition, Pergamon Press, 1986. Metal compounds that contain Cu, Ag, Au, Pd, Pt, Rh, Ir, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and/or W can be alternated in ALD type reactions with boron compounds that do not contain carbon. Metal compounds that contain Cu, Ag, Au, Pd, Pt, Rh and/or Ir are preferably used in ALD type reactions with organic boron compounds.
Preferably the metal source compound will be chosen so that the requirements of sufficient vapor pressure, sufficient thermal stability at the substrate temperature and sufficient reactivity are all met. Sufficient vapor pressure means that there must be enough source compound molecules in the gas phase near the substrate surface to enable self-saturating reactions at the surface. Sufficient thermal stability means that the source compound itself must not undergo thermal decomposition to form unwanted impurities in the thin film or condensation that disturbs thin film growth.
Several other factors that may be considered in selecting the metal (or other elemental) source compound include the availability of the compound in a highly pure form and the ease of handling the material.
In addition, for the formation of elemental metal thin films, the vapor pressure of the elemental metal must be low enough under the conditions in the reactor space that the rate of evaporation of the thin film is lower than the rate of formation from the source compound.
Preferred metal source materials may be found, for example, among metal halides, preferably fluorides, chlorides, bromides or iodides. They may also be found among metal organic compounds, such as alkylaminos, cyclopentadienyls, dithiocarbamates or betadiketonates of the desired metal.
In one embodiment of the present invention, tungsten metal thin films are grown. In this embodiment, one or more of the following compounds are preferably used:
halides, such as WF6, WCl6, WCl4, and WBr5;
carbonyls, such as W(CO)6 and tricarbonyl(mesitylene)tungsten;
cyclopentadienyls, such as bis(cyclopentadienyl)tungsten dihydride, bis(cyclopentadienyl)tungsten dichloride and bis(cyclopentadienyl)ditungsten hexacarbonyl.
A preferred tungsten source material is WF6. A boron compound that does not contain carbon is preferably used as a reducing agent.
According to another embodiment of the present invention, copper metal thin films are grown. For the metal source material, one or more of the following compounds are preferably used:
halides, such as CuCl, CuBr and CuI;
compounds where copper is coordinated to oxygen, such as bis(2,2,6,6-tetramethyl-3,5-heptanedionato)copper, copper(II) 2 ethylhexanoate, bis(2,4-pentanedionato)copper and their derivatives such as bis(1,1,1-trifluoro-2,4-pentanedionato)copper and bis(ethylacetoacetonato)copper;
compounds where copper is coordinated to sulfur, such as copper(I)-butanethiolate and copper dialkyldithiocarbamates.
A preferred copper source material is CuCl. The suggested reaction equations for the deposition of copper from CuCl and TEB are presented below (R1-R3).
In addition to thin films comprised of a single metal, the present invention contemplates thin films comprising two or more metals. In this way it is possible to achieve a thin film that has the beneficial properties of more than one metal, such as the good conductivity of one metal and the good corrosion resistance of another. For example, thin films that contain both titanium and tungsten provide a barrier layer for preventing the interdiffusion of copper into silicon and dielectrics.
When the elemental source material reacts with the substrate, a covalent bond is formed with the surface bonding groups. The surface bound elemental complex (e.g., chemisorbed metal complex) is surface terminated, such as with halogen or hydrocarbon tails, that are not further reactive with the elemental source material. According to the method of the present invention, the surface bound elemental complex is reduced in a reaction with a gaseous boron compound.
The boron source compound is chosen using the same criteria as for the metal source compound, as described above. In general, the boron source compound may be any volatile, sufficiently thermally stable boron compound that is capable of reducing the surface bound elemental complex. The reducing strengths of boron compounds vary. Thus, for the deposition of metal thin films, it is preferable to use a boron compound that is able to reduce the chemisorbed metal complex to its elemental state. Organic boron compounds are preferably used to reduce metal complexes containing Cu, Ag, Au, Pd, Pt, Rh and/or Ir, while boron compounds that do not contain carbon atoms are preferably used to reduce metal complexes containing Cu, Ag, Au, Pd, Pt, Rh, Ir, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and/or W.
The reaction of different surface bound elemental complexes with the same reducing agent leads to different reaction products. In the preferred embodiment of the present invention, the elemental source compound and boron compound are selected so that the byproducts resulting from the reaction of the surface bound elemental complex and the boron compound are gaseous. The byproducts are preferably removed from the reaction space with inert gas during the purging pulse. In addition, the byproducts preferably do not decompose catalytically or thermally to condensable species. In this way the incorporation of byproducts, such as boride, into the thin films as impurities is avoided.
Selection of the elemental source compound and the boron compound according to the above criteria allows for the progressive growth of thin films by successive reaction sequences without a decrease in the growth rate caused by contamination of reactive sites on the substrate surface. Preferably the growth rate decreases by a maximum of 0.1% per cycle, more preferably by less than 0.01% and even more preferably by less than 0.001% per cycle.
The selection of elemental source compounds and boron reducing compounds can be facilitated with computer programs having a sufficiently extensive thermodynamics database. This enables one skilled in the art to check the reaction equilibrium and predict which reactants have thermodynamically favorable reactions. An example of this type of program is HSC Chemistry, Version 3.02, available from Outokumpu Research Oy of Pori, Finland.
The availability of a vast number of boron compounds makes it possible to choose one with the desired reducing strength while avoiding undesirable byproducts such as boride. In addition, it is possible to use more than one boron compound in the production of a single thin film.
Preferably, one or more of the following boron compounds is used:
Boranes according to formula I or formula II.
n is an integer from 1 to 10, preferably from 2 to 6, and
x is an even integer, preferably 4, 6 or 8.
n is an integer from 1 to 10, preferably form 2 to 6, and
m is an integer different than n, from 1 to 10, preferably from 2 to 6.
Of the above boranes according to formula I, examples include nido-boranes (BnHn+4), arachno-boranes (BnHn+6) and hyph-boranes (BnHn+8). Of the boranes according to formula II, examples include conjuncto-boranes (BnHm). Also, borane complexes such as (CH3CH2)3N—BH3 can be used.
Borane halides, particularly fluorides, bromides and chlorides.
An example of a suitable compound is B2H5Br. Further examples comprise boron halides with a high boron/halide ratio, such as B2F4, B2Cl4 and B2Br4. It is also possible to use borane halide complexes.
Halogenoboranes according to formula III.
X is Cl or Br and
n is 4 or an integer from 8 to 12 when X is Cl, or
n is an integer from 7 to 10 when X is Br.
Carboranes according to formula IV.
n is an integer from 1 to 10, preferably from 2 to 6, and
x is an even integer, preferably 2, 4 or 6.
Examples of carboranes according toformula IV include closo-carboranes (C2BnHn+2), nido-carboranes (C2BnHn+4) and arachno-carboranes (C2BnHn+6).
Amine-borane adducts according to formula V.
R is linear or branched C1 to C10, preferably C1 to C4 alkyl or H, and
X is linear or branched C1 to C10, preferably C1 to C4 alkyl, H or halogen.
Aminoboranes where one or more of the substituents on B is an amino group according to formula VI.
R is linear or branched C1 to C10, preferably C1 to C4 alkyl or substituted or unsubstituted aryl group.
An example of a suitable aminoborane is (CH3)2NB(CH3)2.
Cyclic borazine (—BH—NH—)3 and its volatile derivatives.
Alkyl borons or alkyl boranes, wherein the alkyl is typically linear or branced C1 to C10 alkyl, preferably C2 to C4 alkyl.
In addition to the boron compounds described above, it is contemplated that silicon compounds may serve a similar function in the present invention.
In one embodiment of the present invention, elemental metal thin films are formed. In this case, the thin film is complete once the boron compound reduces the metal to its elemental state.
The following examples illustrate the invention but do not limit the scope of the invention in any way.
Copper chloride is pulsed into an ALD reaction chamber until heated substrate surfaces are saturated with adsorbed CuCl molecules. The substrate temperature is low enough to keep source compounds and bonds within adsorbed complex intact, but high enough to prevent condensation of CuCl. The reaction chamber is then purged with inert nitrogen gas until the surplus CuCl has been removed. TEB is then pulsed into the reaction chamber until surface reactions are complete. Examples of possible reaction equations are presented in R2 to R4. Purging the reaction chamber of any surplus TEB and reaction byproducts with inert gas completes the reaction sequence. The reaction sequence is repeated until a metal film of the desired thickness is produced. The substrate temperature is maintained low enough that the copper-copper bond formed in the adsorption of CuCl to the previous thin film layer remains intact.
A 50 mm by 50 mm piece of a silicon wafer and a 50 mm by 50 mm glass substrate were loaded into an ALD reactor. The substrates were heated to 350° C. in a flowing nitrogen atmosphere (500 std. cm3/min) with a pressure of about 10 mbar. Nitrogen gas was used as a carrier for the source chemicals and as a purging gas. The carrier and pulsing gas may include a mild reducing agent such as hydrogen gas to avoid the reoxidation of the copper surface. The pulsing cycle consisted of the following steps:
CuCl vapor pulse for 0.3 seconds.
N2 gas purge for 1.0 seconds.
(CH3CH2)3B vapor pulse for 0.1 seconds.
N2 gas purge for 1.0 seconds.
The pulsing cycle was repeated 1000 times. The resulting thin film had a reddish metallic luster and was electrically conductive.
One skilled in the art will recognize that many variations are possible using the disclosed invention. The present invention is not limited to one particular embodiment, and the embodiments disclosed herein do not limit the scope of the invention in any way.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4058430||Nov 25, 1975||Nov 15, 1977||Tuomo Suntola||Method for producing compound thin films|
|US5281274||Feb 4, 1993||Jan 25, 1994||The United States Of America As Represented By The Secretary Of The Navy||Atomic layer epitaxy (ALE) apparatus for growing thin films of elemental semiconductors|
|US5306666 *||Jul 21, 1993||Apr 26, 1994||Nippon Steel Corporation||Process for forming a thin metal film by chemical vapor deposition|
|US5711811 *||Nov 28, 1995||Jan 27, 1998||Mikrokemia Oy||Method and equipment for growing thin films|
|US5916365||Aug 16, 1996||Jun 29, 1999||Sherman; Arthur||Sequential chemical vapor deposition|
|US6099904||Dec 2, 1997||Aug 8, 2000||Applied Materials, Inc.||Low resistivity W using B2 H6 nucleation step|
|EP1167567A1||May 31, 2001||Jan 2, 2002||Applied Materials, Inc.||Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer|
|1||A. Sherman, S. Maihotra, S. M. Rossnagel, "Plasma enhanced atomic layer deposition of Ta for diffusion barrier applications," AVS 46th International Symposium, Paper TF-TuM5 (abstract), (Oct. 26,1999), Seattle, WA.|
|2||J.W. Klaus, S.J. Ferro, and S.M. George, "Atomic Layer Deposition of Tungsten Nitride Films Using Sequential Surface Reactions," Journal of the Electrochemical Society, vol. 147, No. 3, pp. 1175-1181, (2000).|
|3||J.W. Klaus, S.J. Ferro, S.M. George, "Atomic layer deposition of tungsten using sequential surface chemistry with a sacrificial stripping reaction," Thin Solid Films, vol. 360, pp. 145-153, (2000).|
|4||J.W. Klaus, S.J. Ferro, S.M. George, "Atomically controlled growth of tungsten and tungsten nitride using sequential surface reactions," Applied Surface Science, vols. 162-163, pp. 479-491, (2000).|
|5||Marika Juppo, Mikko Ritala and Markku Leskelä, "Deposition of copper films by an alternate supply of CuCl and Zn," J. Vac. Sci. Technol A, vol. 15, No. 4, pp. 2330-2333, (Jul./Aug. 1997).|
|6||Per Martensson and Jan-Otto Carlsson, "Atomic Layer Epitaxy of Copper and Tantalum," Chemical Vapor Deposition, vol. 3, No. 1, pp. 45-50, (1997).|
|7||Per Martensson and Jan-Otto Carlsson, CU(THD)2 As Copper Source in Atomic Layer Epitaxy, Electrochemical Society Proceedings, vol. 97-25, pp. 1529-1536.|
|8||Per Martensson, "Use of atomic layer epitaxy for fabrication of Si/TiN/Cu Structures," J. Vac. Sci. Technol. B, vol. 17, No. 5, pp. 2122-2128, (Sep./Oct. 1999).|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6613656 *||Feb 13, 2001||Sep 2, 2003||Micron Technology, Inc.||Sequential pulse deposition|
|US6638810||Nov 5, 2001||Oct 28, 2003||Applied Materials, Inc.||Tantalum nitride CVD deposition by tantalum oxide densification|
|US6718126||Sep 14, 2001||Apr 6, 2004||Applied Materials, Inc.||Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition|
|US6720027||Apr 8, 2002||Apr 13, 2004||Applied Materials, Inc.||Cyclical deposition of a variable content titanium silicon nitride layer|
|US6753248||Jan 27, 2003||Jun 22, 2004||Applied Materials, Inc.||Post metal barrier/adhesion film|
|US6753271||Aug 15, 2002||Jun 22, 2004||Micron Technology, Inc.||Atomic layer deposition methods|
|US6772072||Jul 22, 2002||Aug 3, 2004||Applied Materials, Inc.||Method and apparatus for monitoring solid precursor delivery|
|US6773507||Aug 7, 2002||Aug 10, 2004||Applied Materials, Inc.||Apparatus and method for fast-cycle atomic layer deposition|
|US6797340||Oct 10, 2002||Sep 28, 2004||Applied Materials, Inc.||Method for depositing refractory metal layers employing sequential deposition techniques|
|US6809026||Dec 18, 2002||Oct 26, 2004||Applied Materials, Inc.||Selective deposition of a barrier layer on a metal film|
|US6821563||Jan 29, 2003||Nov 23, 2004||Applied Materials, Inc.||Gas distribution system for cyclical layer deposition|
|US6821889 *||Jul 30, 2002||Nov 23, 2004||Asm International N.V.||Production of elemental thin films using a boron-containing reducing agent|
|US6821891||Nov 15, 2002||Nov 23, 2004||Applied Materials, Inc.||Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors|
|US6827978||Feb 11, 2002||Dec 7, 2004||Applied Materials, Inc.||Deposition of tungsten films|
|US6831004||Mar 13, 2003||Dec 14, 2004||Applied Materials, Inc.||Formation of boride barrier layers using chemisorption techniques|
|US6833161||Feb 26, 2002||Dec 21, 2004||Applied Materials, Inc.||Cyclical deposition of tungsten nitride for metal oxide gate electrode|
|US6838125||Jul 10, 2002||Jan 4, 2005||Applied Materials, Inc.||Method of film deposition using activated precursor gases|
|US6849545||Jun 20, 2001||Feb 1, 2005||Applied Materials, Inc.||System and method to form a composite film stack utilizing sequential deposition techniques|
|US6858547||Sep 27, 2002||Feb 22, 2005||Applied Materials, Inc.||System and method for forming a gate dielectric|
|US6869876 *||Dec 20, 2002||Mar 22, 2005||Air Products And Chemicals, Inc.||Process for atomic layer deposition of metal films|
|US6890596||Aug 15, 2002||May 10, 2005||Micron Technology, Inc.||Deposition methods|
|US6905541||May 27, 2003||Jun 14, 2005||Applied Materials, Inc.||Method and apparatus of generating PDMAT precursor|
|US6905737||Oct 11, 2002||Jun 14, 2005||Applied Materials, Inc.||Method of delivering activated species for rapid cyclical deposition|
|US6915592||Jul 29, 2002||Jul 12, 2005||Applied Materials, Inc.||Method and apparatus for generating gas to a processing chamber|
|US6936538||Jul 15, 2002||Aug 30, 2005||Applied Materials, Inc.||Method and apparatus for depositing tungsten after surface treatment to improve film characteristics|
|US6939801||Dec 13, 2002||Sep 6, 2005||Applied Materials, Inc.||Selective deposition of a barrier layer on a dielectric material|
|US6939804||Nov 18, 2002||Sep 6, 2005||Applied Materials, Inc.||Formation of composite tungsten films|
|US6955211||Jul 17, 2002||Oct 18, 2005||Applied Materials, Inc.||Method and apparatus for gas temperature control in a semiconductor processing system|
|US6958174 *||Mar 10, 2000||Oct 25, 2005||Regents Of The University Of Colorado||Solid material comprising a thin metal film on its surface and methods for producing the same|
|US6958296||Jul 22, 2003||Oct 25, 2005||Applied Materials, Inc.||CVD TiSiN barrier for copper integration|
|US6967154 *||Aug 26, 2002||Nov 22, 2005||Micron Technology, Inc.||Enhanced atomic layer deposition|
|US6972267||Mar 4, 2003||Dec 6, 2005||Applied Materials, Inc.||Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor|
|US7037574||May 23, 2001||May 2, 2006||Veeco Instruments, Inc.||Atomic layer deposition for fabricating thin films|
|US7041335||May 21, 2003||May 9, 2006||Applied Materials, Inc.||Titanium tantalum nitride silicide layer|
|US7066194||Jul 19, 2002||Jun 27, 2006||Applied Materials, Inc.||Valve design and configuration for fast delivery system|
|US7067439||Sep 19, 2002||Jun 27, 2006||Applied Materials, Inc.||ALD metal oxide deposition process using direct oxidation|
|US7071118||Nov 12, 2003||Jul 4, 2006||Veeco Instruments, Inc.||Method and apparatus for fabricating a conformal thin film on a substrate|
|US7081271||Jul 18, 2002||Jul 25, 2006||Applied Materials, Inc.||Cyclical deposition of refractory metal silicon nitride|
|US7128787||Sep 30, 2004||Oct 31, 2006||Micron Technology, Inc.||Atomic layer deposition method|
|US7144809 *||Nov 16, 2004||Dec 5, 2006||Asm International N.V.||Production of elemental films using a boron-containing reducing agent|
|US7150789||Jul 29, 2002||Dec 19, 2006||Micron Technology, Inc.||Atomic layer deposition methods|
|US7204886||Nov 13, 2003||Apr 17, 2007||Applied Materials, Inc.||Apparatus and method for hybrid chemical processing|
|US7211508||Jun 18, 2004||May 1, 2007||Applied Materials, Inc.||Atomic layer deposition of tantalum based barrier materials|
|US7220451 *||Aug 10, 2004||May 22, 2007||Asm International N.V.||Process for producing metal thin films by ALD|
|US7220673||Aug 2, 2006||May 22, 2007||Applied Materials, Inc.||Method for depositing tungsten-containing layers by vapor deposition techniques|
|US7228873||May 11, 2006||Jun 12, 2007||Applied Materials, Inc.||Valve design and configuration for fast delivery system|
|US7238552||May 17, 2005||Jul 3, 2007||Applied Materials, Inc.||Method and apparatus for depositing tungsten after surface treatment to improve film characteristics|
|US7241686||Feb 19, 2005||Jul 10, 2007||Applied Materials, Inc.||Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA|
|US7244683||Dec 19, 2003||Jul 17, 2007||Applied Materials, Inc.||Integration of ALD/CVD barriers with porous low k materials|
|US7270709||May 2, 2005||Sep 18, 2007||Applied Materials, Inc.||Method and apparatus of generating PDMAT precursor|
|US7271077||Dec 12, 2003||Sep 18, 2007||Micron Technology, Inc.||Deposition methods with time spaced and time abutting precursor pulses|
|US7279432||Apr 15, 2003||Oct 9, 2007||Applied Materials, Inc.||System and method for forming an integrated barrier layer|
|US7279732||May 26, 2004||Oct 9, 2007||Micron Technology, Inc.||Enhanced atomic layer deposition|
|US7303991||Jun 7, 2004||Dec 4, 2007||Micron Technology, Inc.||Atomic layer deposition methods|
|US7304004||Aug 6, 2004||Dec 4, 2007||Applied Materials, Inc.||System and method for forming a gate dielectric|
|US7351628||Aug 30, 2004||Apr 1, 2008||Micron Technology, Inc.||Atomic layer deposition of CMOS gates with variable work functions|
|US7368382||Apr 28, 2006||May 6, 2008||Micron Technology, Inc.||Atomic layer deposition methods|
|US7378354||Apr 28, 2006||May 27, 2008||Micron Technology, Inc.||Atomic layer deposition methods|
|US7384867||Aug 18, 2005||Jun 10, 2008||Applied Materials, Inc.||Formation of composite tungsten films|
|US7396565||Aug 6, 2004||Jul 8, 2008||Applied Materials, Inc.||Multiple precursor cyclical deposition system|
|US7402210||Mar 1, 2007||Jul 22, 2008||Applied Materials, Inc.||Apparatus and method for hybrid chemical processing|
|US7402534||Aug 26, 2005||Jul 22, 2008||Applied Materials, Inc.||Pretreatment processes within a batch ALD reactor|
|US7429402||Dec 10, 2004||Sep 30, 2008||Applied Materials, Inc.||Ruthenium as an underlayer for tungsten film deposition|
|US7465665||May 15, 2007||Dec 16, 2008||Applied Materials, Inc.||Method for depositing tungsten-containing layers by vapor deposition techniques|
|US7485340 *||Dec 5, 2006||Feb 3, 2009||Asm International N.V.||Production of elemental films using a boron-containing reducing agent|
|US7498057||Mar 8, 2005||Mar 3, 2009||Micron Technology, Inc.||Deposition methods|
|US7514358||Sep 21, 2005||Apr 7, 2009||Applied Materials, Inc.||Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor|
|US7521379||Oct 9, 2007||Apr 21, 2009||Applied Materials, Inc.||Deposition and densification process for titanium nitride barrier layers|
|US7531468||Oct 30, 2007||May 12, 2009||Applied Materials, Inc.||System and method for forming a gate dielectric|
|US7547952||May 30, 2006||Jun 16, 2009||Applied Materials, Inc.||Method for hafnium nitride deposition|
|US7585762||Sep 25, 2007||Sep 8, 2009||Applied Materials, Inc.||Vapor deposition processes for tantalum carbide nitride materials|
|US7591907||Jul 11, 2008||Sep 22, 2009||Applied Materials, Inc.||Apparatus for hybrid chemical processing|
|US7597758||Aug 31, 2007||Oct 6, 2009||Applied Materials, Inc.||Chemical precursor ampoule for vapor deposition processes|
|US7605083 *||May 28, 2008||Oct 20, 2009||Applied Materials, Inc.||Formation of composite tungsten films|
|US7611751 *||Nov 1, 2006||Nov 3, 2009||Asm America, Inc.||Vapor deposition of metal carbide films|
|US7655564||Dec 12, 2007||Feb 2, 2010||Asm Japan, K.K.||Method for forming Ta-Ru liner layer for Cu wiring|
|US7659158||Feb 9, 2010||Applied Materials, Inc.||Atomic layer deposition processes for non-volatile memory devices|
|US7666773||Feb 23, 2010||Asm International N.V.||Selective deposition of noble metal thin films|
|US7670945||Dec 29, 2008||Mar 2, 2010||Applied Materials, Inc.||In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application|
|US7674715||Dec 16, 2008||Mar 9, 2010||Applied Materials, Inc.||Method for forming tungsten materials during vapor deposition processes|
|US7678194||Nov 28, 2006||Mar 16, 2010||Applied Materials, Inc.||Method for providing gas to a processing chamber|
|US7678298||Mar 16, 2010||Applied Materials, Inc.||Tantalum carbide nitride materials by vapor deposition processes|
|US7682946||Mar 23, 2010||Applied Materials, Inc.||Apparatus and process for plasma-enhanced atomic layer deposition|
|US7682984||Mar 23, 2010||Applied Materials, Inc.||Interferometer endpoint monitoring device|
|US7691742||Feb 4, 2009||Apr 6, 2010||Applied Materials, Inc.||Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA|
|US7695563||Jan 8, 2007||Apr 13, 2010||Applied Materials, Inc.||Pulsed deposition process for tungsten nucleation|
|US7709385||Dec 16, 2008||May 4, 2010||Applied Materials, Inc.||Method for depositing tungsten-containing layers by vapor deposition techniques|
|US7709402||Feb 16, 2006||May 4, 2010||Micron Technology, Inc.||Conductive layers for hafnium silicon oxynitride films|
|US7713874||May 2, 2007||May 11, 2010||Asm America, Inc.||Periodic plasma annealing in an ALD-type process|
|US7732325||Jan 5, 2009||Jun 8, 2010||Applied Materials, Inc.||Plasma-enhanced cyclic layer deposition process for barrier layers|
|US7732327||Sep 26, 2008||Jun 8, 2010||Applied Materials, Inc.||Vapor deposition of tungsten materials|
|US7745329||Jun 29, 2010||Applied Materials, Inc.||Tungsten nitride atomic layer deposition processes|
|US7745333||Jun 29, 2010||Applied Materials, Inc.||Methods for depositing tungsten layers employing atomic layer deposition techniques|
|US7749815||Jun 26, 2007||Jul 6, 2010||Applied Materials, Inc.||Methods for depositing tungsten after surface treatment|
|US7775508||Aug 17, 2010||Applied Materials, Inc.||Ampoule for liquid draw and vapor draw with a continuous level sensor|
|US7779784||Aug 24, 2010||Applied Materials, Inc.||Apparatus and method for plasma assisted deposition|
|US7780785||Oct 25, 2002||Aug 24, 2010||Applied Materials, Inc.||Gas delivery apparatus for atomic layer deposition|
|US7780788||Aug 24, 2010||Applied Materials, Inc.||Gas delivery apparatus for atomic layer deposition|
|US7794544||Sep 14, 2010||Applied Materials, Inc.||Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system|
|US7798096||Sep 21, 2010||Applied Materials, Inc.||Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool|
|US7799674||May 29, 2008||Sep 21, 2010||Asm Japan K.K.||Ruthenium alloy film for copper interconnects|
|US7816278||Oct 19, 2010||Tokyo Electron Limited||In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition|
|US7824743||Sep 28, 2007||Nov 2, 2010||Applied Materials, Inc.||Deposition processes for titanium nitride barrier and aluminum|
|US7838441||Nov 23, 2010||Applied Materials, Inc.||Deposition and densification process for titanium nitride barrier layers|
|US7846499 *||Dec 7, 2010||Asm International N.V.||Method of pulsing vapor precursors in an ALD reactor|
|US7846840||Dec 22, 2009||Dec 7, 2010||Applied Materials, Inc.||Method for forming tungsten materials during vapor deposition processes|
|US7850779||Dec 14, 2010||Applied Materisals, Inc.||Apparatus and process for plasma-enhanced atomic layer deposition|
|US7867896||Apr 2, 2009||Jan 11, 2011||Applied Materials, Inc.||Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor|
|US7867914||Jan 11, 2011||Applied Materials, Inc.||System and method for forming an integrated barrier layer|
|US7871678||Jan 18, 2011||Novellus Systems, Inc.||Method of increasing the reactivity of a precursor in a cyclic deposition process|
|US7872291||Jan 18, 2011||Round Rock Research, Llc||Enhanced atomic layer deposition|
|US7892602||Feb 22, 2011||Applied Materials, Inc.||Cyclical deposition of refractory metal silicon nitride|
|US7897215 *||Jun 18, 2003||Mar 1, 2011||Novellus Systems, Inc.||Sequential UV induced chemical vapor deposition|
|US7910177||Jul 31, 2006||Mar 22, 2011||Mosaid Technologies Incorporated||Sequential pulse deposition|
|US7923070 *||Apr 12, 2011||Micron Technology, Inc.||Atomic layer deposition method of forming conductive metal nitride-comprising layers|
|US7955979||Jun 7, 2011||Asm International N.V.||Method of growing electrical conductors|
|US7964505||May 15, 2008||Jun 21, 2011||Applied Materials, Inc.||Atomic layer deposition of tungsten materials|
|US7972978||Jun 27, 2008||Jul 5, 2011||Applied Materials, Inc.||Pretreatment processes within a batch ALD reactor|
|US7985669||Dec 30, 2009||Jul 26, 2011||Asm International N.V.||Selective deposition of noble metal thin films|
|US8025922||Sep 27, 2011||Asm International N.V.||Enhanced deposition of noble metals|
|US8043907||Oct 25, 2011||Applied Materials, Inc.||Atomic layer deposition processes for non-volatile memory devices|
|US8053372||Nov 8, 2011||Novellus Systems, Inc.||Method of reducing plasma stabilization time in a cyclic deposition process|
|US8067794||May 3, 2010||Nov 29, 2011||Micron Technology, Inc.||Conductive layers for hafnium silicon oxynitride films|
|US8071167||Dec 6, 2011||Applied Materials, Inc.||Surface pre-treatment for enhancement of nucleation of high dielectric constant materials|
|US8084104||Dec 27, 2011||Asm Japan K.K.||Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition|
|US8092695||Oct 29, 2007||Jan 10, 2012||Applied Materials, Inc.||Endpoint detection for photomask etching|
|US8110489||Apr 11, 2007||Feb 7, 2012||Applied Materials, Inc.||Process for forming cobalt-containing materials|
|US8119210||May 21, 2004||Feb 21, 2012||Applied Materials, Inc.||Formation of a silicon oxynitride layer on a high-k dielectric material|
|US8133555||Oct 14, 2008||Mar 13, 2012||Asm Japan K.K.||Method for forming metal film by ALD using beta-diketone metal complex|
|US8146896||Oct 31, 2008||Apr 3, 2012||Applied Materials, Inc.||Chemical precursor ampoule for vapor deposition processes|
|US8158526||Apr 17, 2012||Applied Materials, Inc.||Endpoint detection for photomask etching|
|US8187970||May 29, 2012||Applied Materials, Inc.||Process for forming cobalt and cobalt silicide materials in tungsten contact applications|
|US8273408||Sep 25, 2012||Asm Genitech Korea Ltd.||Methods of depositing a ruthenium film|
|US8282992||Oct 26, 2007||Oct 9, 2012||Applied Materials, Inc.||Methods for atomic layer deposition of hafnium-containing high-K dielectric materials|
|US8293328||Sep 7, 2006||Oct 23, 2012||Applied Materials, Inc.||Enhanced copper growth with ultrathin barrier layer for high performance interconnects|
|US8318266||Sep 7, 2006||Nov 27, 2012||Applied Materials, Inc.||Enhanced copper growth with ultrathin barrier layer for high performance interconnects|
|US8323754||Dec 4, 2012||Applied Materials, Inc.||Stabilization of high-k dielectric materials|
|US8329569||Dec 11, 2012||Asm America, Inc.||Deposition of ruthenium or ruthenium dioxide|
|US8343279||May 12, 2005||Jan 1, 2013||Applied Materials, Inc.||Apparatuses for atomic layer deposition|
|US8362576||Jan 14, 2011||Jan 29, 2013||Round Rock Research, Llc||Transistor with reduced depletion field width|
|US8383525||Apr 25, 2008||Feb 26, 2013||Asm America, Inc.||Plasma-enhanced deposition process for forming a metal oxide thin film and related structures|
|US8491967||Sep 8, 2008||Jul 23, 2013||Applied Materials, Inc.||In-situ chamber treatment and deposition process|
|US8501275||Sep 21, 2011||Aug 6, 2013||Asm International N.V.||Enhanced deposition of noble metals|
|US8536058||Jun 3, 2011||Sep 17, 2013||Asm International N.V.||Method of growing electrical conductors|
|US8563424||Apr 26, 2012||Oct 22, 2013||Applied Materials, Inc.||Process for forming cobalt and cobalt silicide materials in tungsten contact applications|
|US8633110||Nov 14, 2011||Jan 21, 2014||Micron Technology, Inc.||Titanium nitride films|
|US8668776||Jun 10, 2010||Mar 11, 2014||Applied Materials, Inc.||Gas delivery apparatus and method for atomic layer deposition|
|US8747964||Sep 23, 2011||Jun 10, 2014||Novellus Systems, Inc.||Ion-induced atomic layer deposition of tantalum|
|US8785312||Nov 28, 2011||Jul 22, 2014||Micron Technology, Inc.||Conductive layers for hafnium silicon oxynitride|
|US8795771 *||Oct 27, 2006||Aug 5, 2014||Sean T. Barry||ALD of metal-containing films using cyclopentadienyl compounds|
|US8816447||Jan 28, 2013||Aug 26, 2014||Round Rock Research, Llc||Transistor with reduced depletion field width|
|US8841182||Mar 14, 2013||Sep 23, 2014||Asm Ip Holding B.V.||Silane and borane treatments for titanium carbide films|
|US8846550||Mar 14, 2013||Sep 30, 2014||Asm Ip Holding B.V.||Silane or borane treatment of metal thin films|
|US8927403||Jul 21, 2011||Jan 6, 2015||Asm International N.V.||Selective deposition of noble metal thin films|
|US8993055||Oct 27, 2006||Mar 31, 2015||Asm International N.V.||Enhanced thin film deposition|
|US9012334 *||Feb 14, 2012||Apr 21, 2015||Applied Materials, Inc.||Formation of a tantalum-nitride layer|
|US9032906||Oct 16, 2007||May 19, 2015||Applied Materials, Inc.||Apparatus and process for plasma-enhanced atomic layer deposition|
|US9051641||Aug 29, 2008||Jun 9, 2015||Applied Materials, Inc.||Cobalt deposition on barrier surfaces|
|US9111749||Jun 10, 2014||Aug 18, 2015||Asm Ip Holdings B.V.||Silane or borane treatment of metal thin films|
|US9129897||Apr 20, 2012||Sep 8, 2015||Asm International N.V.||Metal silicide, metal germanide, methods for making the same|
|US9157149 *||Jun 28, 2013||Oct 13, 2015||Wayne State University||Bis(trimethylsilyl) six-membered ring systems and related compounds as reducing agents for forming layers on a substrate|
|US9209074||May 20, 2015||Dec 8, 2015||Applied Materials, Inc.||Cobalt deposition on barrier surfaces|
|US9236247||Aug 18, 2014||Jan 12, 2016||Asm Ip Holding B.V.||Silane and borane treatments for titanium carbide films|
|US9249505 *||Jun 27, 2014||Feb 2, 2016||Wayne State University||Bis(trimethylsilyl) six-membered ring systems and related compounds as reducing agents for forming layers on a substrate|
|US9255327||Aug 23, 2011||Feb 9, 2016||Wayne State University||Thermally stable volatile precursors|
|US9255329||Jul 28, 2009||Feb 9, 2016||Novellus Systems, Inc.||Modulated ion-induced atomic layer deposition (MII-ALD)|
|US9273391||Jun 20, 2014||Mar 1, 2016||Asm Ip Holding B.V.||ALD of zirconium-containing films using cyclopentadienyl compounds|
|US20020187256 *||Jul 30, 2002||Dec 12, 2002||Kai-Erik Elers||Method of producing elemental thin films|
|US20020197863 *||Jun 20, 2001||Dec 26, 2002||Mak Alfred W.||System and method to form a composite film stack utilizing sequential deposition techniques|
|US20030003635 *||May 23, 2001||Jan 2, 2003||Paranjpe Ajit P.||Atomic layer deposition for fabricating thin films|
|US20030064153 *||Feb 22, 2002||Apr 3, 2003||Rajendra Solanki||Method of depositing a metallic film on a substrate|
|US20030104126 *||Oct 10, 2002||Jun 5, 2003||Hongbin Fang||Method for depositing refractory metal layers employing sequential deposition techniques|
|US20030129308 *||Nov 15, 2002||Jul 10, 2003||Applied Materials, Inc.||Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors|
|US20030224578 *||Dec 13, 2002||Dec 4, 2003||Hua Chung||Selective deposition of a barrier layer on a dielectric material|
|US20030232497 *||Apr 15, 2003||Dec 18, 2003||Ming Xi||System and method for forming an integrated barrier layer|
|US20030232506 *||Sep 27, 2002||Dec 18, 2003||Applied Materials, Inc.||System and method for forming a gate dielectric|
|US20030232511 *||Sep 19, 2002||Dec 18, 2003||Applied Materials, Inc.||ALD metal oxide deposition process using direct oxidation|
|US20040009665 *||May 19, 2003||Jan 15, 2004||Applied Materials, Inc.||Deposition of copper films|
|US20040013803 *||Dec 16, 2002||Jan 22, 2004||Applied Materials, Inc.||Formation of titanium nitride films using a cyclical deposition process|
|US20040014315 *||Nov 18, 2002||Jan 22, 2004||Applied Materials, Inc.||Formation of composite tungsten films|
|US20040014320 *||May 27, 2003||Jan 22, 2004||Applied Materials, Inc.||Method and apparatus of generating PDMAT precursor|
|US20040015300 *||Jul 22, 2002||Jan 22, 2004||Seshadri Ganguli||Method and apparatus for monitoring solid precursor delivery|
|US20040016394 *||Jul 29, 2002||Jan 29, 2004||Castovillo Paul J.||Atomic layer deposition methods|
|US20040033310 *||Aug 15, 2002||Feb 19, 2004||Demetrius Sarigiannis||Deposition methods|
|US20040036129 *||Aug 22, 2002||Feb 26, 2004||Micron Technology, Inc.||Atomic layer deposition of CMOS gates with variable work functions|
|US20040038525 *||Aug 26, 2002||Feb 26, 2004||Shuang Meng||Enhanced atomic layer deposition|
|US20040126954 *||Dec 12, 2003||Jul 1, 2004||Eugene Marsh||Deposition methods with time spaced and time abutting precursor pulses|
|US20040194691 *||Jul 16, 2002||Oct 7, 2004||George Steven M||Method of depositing an inorganic film on an organic polymer|
|US20040217410 *||May 26, 2004||Nov 4, 2004||Micron Technology, Inc.||Enhanced atomic layer deposition|
|US20040224527 *||Jun 7, 2004||Nov 11, 2004||Micron Technology, Inc.||Atomic layer deposition methods|
|US20050020060 *||Aug 10, 2004||Jan 27, 2005||Titta Aaltonen||Process for producing metal thin films by ALD|
|US20050032342 *||Aug 30, 2004||Feb 10, 2005||Micron Technology, Inc.||Atomic layer deposition of CMOS gates with variable work functions|
|US20050039674 *||Sep 30, 2004||Feb 24, 2005||Castovillo Paul J.||Atomic layer deposition method|
|US20050056219 *||Sep 16, 2003||Mar 17, 2005||Tokyo Electron Limited||Formation of a metal-containing film by sequential gas exposure in a batch type processing system|
|US20050064098 *||Nov 16, 2004||Mar 24, 2005||Kai-Erik Elers||Production of elemental films using a boron-containing reducing agent|
|US20050084610 *||Aug 13, 2003||Apr 21, 2005||Selitser Simon I.||Atmospheric pressure molecular layer CVD|
|US20050100669 *||Nov 12, 2003||May 12, 2005||Veeco Instruments, Inc.||Method and apparatus for fabricating a conformal thin film on a substrate|
|US20050147751 *||Mar 8, 2005||Jul 7, 2005||Demetrius Sarigiannis||Deposition methods|
|US20050166843 *||Feb 3, 2005||Aug 4, 2005||Veeco Instruments, Inc.||Apparatus for fabricating a conformal thin film on a substrate|
|US20060093848 *||Oct 15, 2003||May 4, 2006||Senkevich John J||Atomic layer deposition of noble metals|
|US20060147626 *||Dec 30, 2004||Jul 6, 2006||Blomberg Tom E||Method of pulsing vapor precursors in an ALD reactor|
|US20060205227 *||Apr 28, 2006||Sep 14, 2006||Demetrius Sarigiannis||Atomic layer deposition methods|
|US20060216548 *||Mar 22, 2005||Sep 28, 2006||Ming Mao||Nanolaminate thin films and method for forming the same using atomic layer deposition|
|US20060263523 *||Jul 31, 2006||Nov 23, 2006||Kraus Brenda D||Atomic layer deposition methods of forming conductive metal nitride-comprising layers|
|US20060265100 *||Jul 31, 2006||Nov 23, 2006||Micron Technology, Inc.||Sequential pulse deposition|
|US20060272577 *||Jun 3, 2005||Dec 7, 2006||Ming Mao||Method and apparatus for decreasing deposition time of a thin film|
|US20070190248 *||Dec 5, 2006||Aug 16, 2007||Kai-Erik Elers||Production of elemental films using a boron-containing reducing agent|
|US20070218688 *||May 15, 2007||Sep 20, 2007||Ming Xi||Method for depositing tungsten-containing layers by vapor deposition techniques|
|US20080102204 *||Nov 1, 2006||May 1, 2008||Kai-Erik Elers||Vapor deposition of metal carbide films|
|US20080102205 *||Oct 27, 2006||May 1, 2008||Barry Sean T||ALD of metal-containing films using cyclopentadienyl compounds|
|US20080227291 *||May 28, 2008||Sep 18, 2008||Lai Ken K||Formation of composite tungsten films|
|US20080241386 *||May 5, 2008||Oct 2, 2008||Micron Technology, Inc.||Atomic Layer Deposition Methods|
|US20080251828 *||Sep 17, 2007||Oct 16, 2008||Micron Technology, Inc.||Enhanced atomic layer deposition|
|US20080274617 *||May 2, 2007||Nov 6, 2008||Asm America, Inc.||Periodic plasma annealing in an ald-type process|
|US20080299322 *||Jul 29, 2005||Dec 4, 2008||Bradley Alexander Zak||Copper (I) Complexes for Deposition of Copper Films by Atomic Layer Deposition|
|US20090246971 *||Mar 28, 2008||Oct 1, 2009||Tokyo Electron Limited||In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition|
|US20100055342 *||Jul 28, 2009||Mar 4, 2010||Novellus Systems, Inc.||Modulated ion-induced atomic layer deposition (mii-ald)|
|US20100136313 *||Dec 1, 2008||Jun 3, 2010||Asm Japan K.K.||Process for forming high resistivity thin metallic film|
|US20110212628 *||Sep 1, 2011||Weimin Li||Sequential pulse deposition|
|US20120178256 *||Feb 14, 2012||Jul 12, 2012||Seutter Sean M||Formation of a tantalum-nitride layer|
|US20150004314 *||Jun 27, 2014||Jan 1, 2015||Wayne State University||Bis(trimethylsilyl) six-membered ring systems and related compounds as reducing agents for forming layers on a substrate|
|US20150004315 *||Jun 28, 2013||Jan 1, 2015||Wayne State University||Bis(Trimethylsilyl) Six-Membered Ring Systems And Related Compounds As Reducing Agents For Forming Layers On A Substrate|
|US20150132212 *||Nov 13, 2013||May 14, 2015||Asm Ip Holding B.V.||Method for forming conformal carbon films, structures and devices including a conformal carbon film, and system of forming same|
|WO2005027189A2 *||Sep 2, 2004||Mar 24, 2005||Tokyo Electron Limited||Formation of a metal-containing film by sequential gas exposure in a batch type processing system|
|WO2005027189A3 *||Sep 2, 2004||Jan 5, 2006||Dip Anthony||Formation of a metal-containing film by sequential gas exposure in a batch type processing system|
|U.S. Classification||117/84, 117/88, 257/E23.16, 257/E23.162, 438/685, 427/250, 427/253, 257/E23.167, 438/680, 257/E21.168, 257/E21.582, 257/E21.171, 438/687, 257/E23.161, 257/E21.585, 427/255.28, 257/E23.145|
|International Classification||C23C16/04, H01L21/768, C30B25/14, C30B29/02, C23C16/44, C23C16/02, C30B29/36, C23C16/455, H01L21/285, C23C16/08, C23C16/34, H01L23/522, C30B25/02, C23C16/32, C30B29/38, H01L23/532|
|Cooperative Classification||H01L21/28568, H01L21/76877, C23C16/45553, H01L21/76871, H01L23/53242, H01L23/5329, H01L21/76876, C23C16/0272, C30B29/38, H01L23/53238, H01L21/28562, C30B29/36, C23C16/045, H01L21/76838, C23C16/14, C23C16/34, H01L23/53252, H01L21/76843, C23C16/45527, H01L23/5226, H01L23/53223, C23C16/45555, H01L23/53228, H01L23/53295, C23C16/08, C23C16/32, C23C16/44, C30B25/02, C23C16/4401, C30B25/14, H01L21/76807, C23C16/45525, C30B29/02, C23C16/45542, H01L2924/0002|
|European Classification||C30B25/02, C23C16/455F2B, C23C16/455F2, C23C16/455F2B8F, C23C16/455F2K, H01L21/768C3S6, C23C16/14, H01L23/532M1C4, C30B25/14, H01L21/285B4L, C23C16/32, H01L23/532N4, C23C16/34, H01L23/532M1C, H01L23/532M1A4, H01L21/285B4H2, C23C16/44A, H01L23/532M1N4, C23C16/04D, C23C16/08, H01L21/768B2D, C30B29/38, H01L21/768C4, H01L23/532M1N, H01L23/532N, C30B29/36, H01L21/768C, C23C16/44, H01L23/522E, C30B29/02, C23C16/02H, H01L21/768C3B, H01L21/768C3S, C23C16/455F2H|
|Feb 5, 2001||AS||Assignment|
Owner name: ASM MICROCHEMISTRY OY, FINLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ELERS, KAI-ERIK;SAANILA, VILLE ANTERO;KAIPIO, SARI JOHANNA;AND OTHERS;REEL/FRAME:011505/0800;SIGNING DATES FROM 20001208 TO 20010102
|Apr 11, 2001||AS||Assignment|
Owner name: ASM MICROCHEMISTRY OY, FINLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ELERS, KAI-ERIK;SAANILA, VILLE ANTERO;KAIPIO, SARI JOHANNA;AND OTHERS;REEL/FRAME:011694/0504;SIGNING DATES FROM 20010328 TO 20010329
|Dec 23, 2003||AS||Assignment|
Owner name: ASM INTERNATIONAL N.V., NETHERLANDS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ASM MICROCHEMISTRY OY;REEL/FRAME:014852/0964
Effective date: 20031126
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