Fasoli, A and Milne, WI (2012) Overview and status of bottom-up silicon nanowire electronics. Materials Science in Semiconductor Processing, 15. pp. 601-614. ISSN 1369-8001Full text not available from this repository.
This review summarises the recent advances in the field of silicon nanowire electronics from bottom-up assembled materials. The aim is to draw a comparison between bottom-up and top-down approaches, examining respective achievements and evaluating advantages and disadvantages of each methodology. Existing techniques for synthesis and doping are discussed to provide the framework in which practical electronic applications can be developed. Next, key device categories are reviewed, emphasising current challenges and proposed solutions. Finally, field perspectives are outlined. © 2012 Elsevier Ltd.
|Divisions:||Div B > Solid State Electronics and Nanoscale Science|
|Depositing User:||Cron Job|
|Date Deposited:||18 May 2016 18:08|
|Last Modified:||26 May 2016 06:42|