|Publication number||US7363964 B2|
|Application number||US 11/395,844|
|Publication date||Apr 29, 2008|
|Filing date||Mar 30, 2006|
|Priority date||Oct 5, 2005|
|Also published as||US20070074852|
|Publication number||11395844, 395844, US 7363964 B2, US 7363964B2, US-B2-7363964, US7363964 B2, US7363964B2|
|Inventors||Shu-Ju Lin, Li-Tai Liu|
|Original Assignee||Inventec Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (6), Referenced by (4), Classifications (9), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to a heat sink, and more particularly, to a heat sink for dissipating heat generated from a heat generating component which is in contact with the heat sink.
It is well known that heat generating components in a computer such as central processing units, microprocessors or chipsets generate a large amount of heat during the computer operates. As the generated heat increases above a critical temperature, a failure can occur in the heat generating components. Therefore, the excess heat must be dissipated to prevent such failures.
Since a chipset is responsible for data transferring between primary chips and peripheral I/O components, it is particularly important to dissipate heat generated by the chipset. Usually, the chipset is in close contact with a heat sink for efficient heat dissipation. Such a heat sink is shown in
As shown in
However, since the heat sink is made of different materials with different coefficients of thermal expansion, the heat stress is introduced which can cause such problems as cracks of the soldering portions 40 and deformations of the printed circuit board 50, thereby decreasing reliability of products.
Accordingly, there is a need to develop a heat sink which can efficiently decrease the heat stress.
According to the above defects, an objective of the present invention is to provide a heat sink which can efficiently decrease the heat stress.
Another objective of the present invention is to provide a heat sink which can increase reliability of products.
To achieve the above and other objectives, the heat sink of the present invention comprises a base, a set of fins mounted to the base and at least a fixing portion, wherein the heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base, and further formed with at least a slot at a lateral side of the base such that at least a deformable portion can be defined on the base. However, it should be understood that the location, amount and distribution of the fixing portion, slot and deformable portion may vary and are not limited to that described and illustrated. For instance, the heat sink may comprise a plurality of the fixing portions, slots and deformable portions.
Preferably, the slots are in rectangular shape. The fixing portion is disposed at a corner of the base of the heat sink and preferably, the heat sink comprises two fixing portions. The fixing portion can be disposed on the deform able portions of the base. The deformable portions can be rectangular-shaped blocks. Preferably, the heat sink has two deformable portions. The heat sink has a contact region for interfacing with a heat generating component such as a chipset. The contact region can be rectangular-shaped corresponding to the heat generating component. Further, a soldering portion can be formed on the heat sink.
Compared with the prior art, the deformable portions disposed on the base of the heat sink can increase the deformable length of the base such that the heat stress can be efficiently decreased, thereby avoiding such problems as cracks of the soldering portions and deformations of the printed circuit board in the prior art and accordingly increasing product reliability.
Hereunder, embodiments of the present invention will be described in full detail with reference to the accompanying drawings.
The base 11 is a substantially rectangular-shaped conductive block, which can be made of aluminum, for example. A rectangular contact region 113 is formed in the center of the base 11 for directly contacting a chipset. The slots 111 formed at the lateral sides of the base 11 can also be in the shape of rectangular and the length of the slots 111 is denoted as h, for example.
It should be noted that the shape of the base 11, the slots 111 and the contact region 113 is not limited to the present embodiment. For example, the slots 111 can be of any other regular or irregular shape. Similarly, the length of the slots 111 is not limited to h as shown in
In the present embodiment, the fins 13 of sheet shape are spaced apart on the surface of the base 11, which are used to increase the surface area such that heat generated from the heat generating component can be dissipated quickly. It should be noted that the shape, number and arranging structure of the fins 13 can be modified in practical implementation. In addition, the base 11 and the fins 13 can be made of other materials instead of aluminum.
The fixing portions 15 are respectively disposed at two corners of the base 11 and fixed to a printed circuit board with the heat generating component mounted thereon. The fixing portions 15 are used for supporting the base 11 such that the base 111 can be located over and directly contacted with the heat generating component such as a chipset. The number and position of the fixing portions 15 are not limited to the present embodiment. Meanwhile, the fixing portions 15 can be of cylindrical shape and made from iron or aluminum alloy.
The deformable portions 17 of rectangular shape are disposed at two sides of the base 11. The fixing portions 15 are disposed on the deformable portions 17.
In addition, the distance from both sides of the base 11 to the printed circuit board 50 is same and denoted as a.
Therefore, since the deformable portions 17 increase the deformable length of the base 11, that is, the deformable distance between the base 11 and the printed circuit board 50 increases. Accordingly, the heat stress caused from different coefficients of thermal expansion of different materials is decreased, thereby protecting the soldering portions and the printed circuit board from being damaged by the heat stress. As a result, the product reliability is increased.
The invention has been described using exemplary preferred embodiments. However, it is to be understood that the scope of the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
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|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7957146 *||Nov 3, 2008||Jun 7, 2011||Osram Gesellschaft mit beschränkter Haftung||Illumination device comprising a substrate plate and a heat sink|
|US9159642 *||Jun 28, 2013||Oct 13, 2015||Gerald Ho Kim||Silicon-based heat dissipation device for heat-generating devices|
|US20090129025 *||Nov 3, 2008||May 21, 2009||Osram Gesellschaft Mit Beschrankter Haftung||Illumination device comprising a substrate plate and a heat sink|
|US20140293543 *||Jun 28, 2013||Oct 2, 2014||Gerald Ho Kim||Silicon-Based Heat Dissipation Device For Heat-Generating Devices|
|U.S. Classification||165/80.3, 257/E23.102, 361/704, 165/81|
|Cooperative Classification||H01L2023/4081, H01L23/367, H01L2924/0002|
|Mar 30, 2006||AS||Assignment|
Owner name: INVENTEC CORPORATION, TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, SHU-JU;LIU, LI-TAI;REEL/FRAME:017722/0202
Effective date: 20060301
|Sep 21, 2011||FPAY||Fee payment|
Year of fee payment: 4
|Oct 14, 2015||FPAY||Fee payment|
Year of fee payment: 8