|Número de publicación||US4203648 A|
|Tipo de publicación||Concesión|
|Número de solicitud||US 05/935,151|
|Fecha de publicación||20 May 1980|
|Fecha de presentación||23 Ago 1978|
|Fecha de prioridad||15 Ago 1977|
|Número de publicación||05935151, 935151, US 4203648 A, US 4203648A, US-A-4203648, US4203648 A, US4203648A|
|Cesionario original||North American Specialties Corp.|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citas de patentes (3), Citada por (61), Clasificaciones (20)|
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
This application is a continuation-in-part of Ser. No. 824,441, filed Aug. 15, 1977, now Patent No. 4,120,558, issued Oct. 17, 1978.
This invention relates to a solder bearing terminal clip for attachment to a contact pad on a substrate wherein one or two solder plugs are mechanically engaged with the clip in positions to be melted for bonding the clip to the contact pad.
Various means have been provided wherein a quantity of solder is associated with a terminal clip so that when the clip has been positioned on a contact pad (usually a metal surface on a substrate introduced into the jaws of the clip) and the assembly is heated, the molten solder covers the adjacent surfaces of the clip and pad to form, when cool, a soldered metallurgical joint between the clip and pad. Clips of this general type are shown in Cox et al. U.S. Pat. No. 3,689,684 wherein the pads are pre-tinned; Landman U.S. Pat. No. 3,750,252 wherein a continuous solder wire extends along a strip of clips and is held by a bent back clip arm; and Schell U.S. Pat. No. 4,019,803 wherein an individual solder mass is soldered to a clip arm on the side opposite the contact surface with a solder globule extending across one or both edges of the arm to the adjacent contact surface.
It is an object of the present invention to provide means for attaching securely a solder mass to a terminal clip in a purely mechanical manner.
It is a further object of the invention to provide a solder bearing clip wherein each clip has its own supply of solder in two convenient locations for melting to form bonds with a pad.
It is another object of the invention to provide a solder and clip assembly which can be made by very simple and efficient stamping steps.
It is a still further object of the invention to provide certain improvements in the form, construction and arrangement of the parts whereby the above-named and other objects may effectively be attained.
The invention accordingly comprises an article of manufacture possessing the features, properties, and the relation of elements which will be exemplified in the article hereinafter described, and the scope of the invention will be indicated in the claims.
Practical embodiments of the invention are shown in the accompanying drawings wherein:
FIG. 1 represents a side view of a clip according to the invention.
FIG. 2 represents a front elevation of the clip shown in FIG. 1;
FIG. 3 represents a plan view of the blank as stamped to produce a clip according to FIGS. 1 and 2;
FIG. 4 represents a detail side view of the head of a first modified form of clip;
FIG. 5 represents a section on the line V--V Of FIG. 4;
FIG. 6 represents a plan view of the blank as stamped to produce a clip according to FIGS. 4 and 5;
FIG. 7 represents a detail side view of the head of a second modified form of clip;
FIG. 8 represents a section on the line VIII--VIII in FIG. 7; and
FIG. 9 represents a detail plan view of the blank as stamped to produce the clip of FIGS. 7 and 8.
Referring to the drawings, and particularly to FIGS. 1 to 3, the solder terminal strip includes a continuous carrier strip 11 with individual terminal clips 12 connected thereto by stems 13. The carrier strip may be provided with pilot holes 14 at regular intervals, as is customary.
Each clip includes a flat body portion 15, a pair of spring fingers 16, bent to extend upwardly and laterally from the plane of the body portion distally of the clip and spaced apart by the width of a central spring finger 17 which extends laterally in a position spaced from and substantially parallel to the fingers 16, defining a gap 21 adapted to receive the edge of a substrate (not shown). The fingers 16 and 17 are formed from the blank shown in FIG. 4 by the parallel cuts 18 which extend from the free end and terminate at end points 18'. The free end of the finger 17 is curved arcuately away from the fingers 16, in a position to wrap around and grip securely, through more than 180°, the short cylindrical mass or slug of solder 22, as clearly shown in FIGS. 1 and 2.
The terminal clip just described, or an array of several such terminal clips, is applied to the edge of a substrate having one or several contact pads, with the finger 17 resting against the pad (the assembly being inverted) and heat is supplied to melt the solder, which flows around the finger 17 and bonds the clip securely to the substrate with a good electrical contact. The solder, in this clip, is held on the side of the gap nearer the body portion.
While clips of the type just described have been widely and successfully used, there may be situations where the solder from a single slug fails to form a strong and reliable bond. Provision is therefore made for using two solder plugs, one on each opposite surface of the substrate, as described below.
Referring to FIGS. 4 to 6, the first modified form of clip is shown as having a flat body portion 25, a single central spring finger 27 formed from the blank shown in FIG. 6 by the U-shaped cut 28, which has its ends directed toward the free end of the body portion and oppositely disposed additional spring finger 26, said latter finger being constituted by the free end of the body portion itself. The free ends of the fingers 26 and 27 are arcuately curved away from each other (and from the gap 29) in positions to wrap around and grip securely, through more than 180°, the cylindrical masses or slugs of solder 30 and 31. The application of such a clip to a contact pad on a substrate is effected in the same manner as described above, except that a soldered bond can be formed by each of the two solder slugs, on opposite surfaces of the substrate.
The second modified form of clip, shown in FIGS. 7 to 9, is basically the same as that shown in FIGS. 4 to 6, having a single central finger 37 formed from the main body 35 of the blank by a U-shaped cut 38 and an oppositely disposed additional finger 36. The fingers 36 and 37 are arcuately curved away from each other and wrapped, through more than 180°, around the cylindrical masses or slugs of solder 40 and 41. In this clip, however, each of the fingers 36 and 37 is provided with a narrow elongated slot 42 and 43, respectively, so located longitudinally of the fingers that the slotted portions of the fingers define the gap 39 into which the edge of a substrate S is to be introduced, as shown in FIG. 7. The narrow finger portions on each side of each slot bite into the softer metal of the solder plugs to give the fingers an extra strong grip on the slugs, and the slots provide additional access for the solder, when melted, to flow onto the substrate surface at and near the points of contact between the fingers and such surface. This multiplies the soldered area by including the walls of the slots as well as the substrate and finger surfaces, creating improved electrical conductivity as well as stronger binding.
While the slots are shown in connection with the double solder clips of FIGS. 7 to 9, advantages would also result from the provision of a slot in the single finger 17 of FIGS. 1 to 3, if desired, or either one of the slots 42 or 43 could be omitted. In FIGS. 1 to 3 the total width of the fingers 16 should equal or slightly exceed the width of the central finger 17, to substantially equalize the strength of the fingers on opposite sides of the gap 21.
In each of the clips described above, the solder slug, in the form of a cylindrical bar or wire is in firm mechanical engagement with the clip fingers or body, in a position to be melted for the formation of a bond between the fingers and terminal pad or the like. The solder slugs may, if desired, have a cross-section of square or other geometrical form, or be made from spherical pellets. Each clip also can be made by simple stamping and assembling steps, with minimal waste of material.
It will thus be seen that the objects set forth above, among those made apparent from the preceding description, are efficiently attained and, since certan changes may be made in the above article without departing from the spirit and scope of the invention, it is intended that all matter contained in the above description and shown in the accompanying drawing shall be interpreted as illustrative and not in a limiting sense.
|Patente citada||Fecha de presentación||Fecha de publicación||Solicitante||Título|
|US3351704 *||18 Mar 1965||7 Nov 1967||Berg Electronics Inc||Soldering aid terminal|
|US4019803 *||15 Oct 1975||26 Abr 1977||E. I. Du Pont De Nemours And Company||Solder substrate clip|
|DE2321828A1 *||30 Abr 1973||8 Nov 1973||Du Pont||Loetoesenstreifen|
|Patente citante||Fecha de presentación||Fecha de publicación||Solicitante||Título|
|US4302067 *||18 Abr 1980||24 Nov 1981||Western Electric Company, Incorporated||Edge connectors for circuit cards and methods of assembly|
|US4345814 *||4 Feb 1981||24 Ago 1982||Western Electric Company, Inc.||Solder-bearing lead having solder flow-control stop means|
|US4357069 *||4 Feb 1981||2 Nov 1982||Western Electric Company, Inc.||Solder-bearing lead having solder-confining stop means|
|US4367910 *||2 Feb 1981||11 Ene 1983||Jack Seidler||Mini-terminal|
|US4482197 *||29 Oct 1982||13 Nov 1984||At&T Technologies, Inc.||Low-insertion force solder-bearing lead|
|US4500149 *||28 Jul 1982||19 Feb 1985||At&T Technologies, Inc.||Solder-bearing lead|
|US4502745 *||19 Dic 1983||5 Mar 1985||At&T Technologies, Inc.||Progressively-increasing clamping force lead and lead-substrate assembly|
|US4537461 *||28 Jul 1982||27 Ago 1985||At&T Technologies, Inc.||Lead having a solder-preform and preform-carrying finger engageable directly with a contact pad|
|US4556276 *||6 May 1983||3 Dic 1985||At&T Bell Laboratories||Solder beams leads|
|US4592617 *||6 Feb 1985||3 Jun 1986||North American Specialties Corporation||Solder-bearing terminal|
|US4597628 *||19 Sep 1985||1 Jul 1986||North American Specialties Corporation||Solder bearing clip|
|US4605278 *||24 May 1985||12 Ago 1986||North American Specialties Corporation||Solder-bearing leads|
|US4679889 *||31 Oct 1985||14 Jul 1987||North American Specialties Corporation||Solder-bearing leads|
|US4697865 *||1 Jul 1985||6 Oct 1987||North American Specialties Corp.||Edge clip and terminal|
|US4728305 *||11 Abr 1986||1 Mar 1988||North American Specialties Corp.||Solder-bearing leads|
|US4738627 *||17 Mar 1987||19 Abr 1988||North American Specialties Corporation||Edge clip and terminal|
|US4872846 *||21 Jul 1988||10 Oct 1989||Clark Thomas C||Solder containing electrical connector and method for making same|
|US4883435 *||7 Dic 1987||28 Nov 1989||North American Specialties Corporation||Solder-bearing terminal pin and lead|
|US4900279 *||24 Abr 1989||13 Feb 1990||Die Tech, Inc.||Solder terminal|
|US4984359 *||19 May 1989||15 Ene 1991||Amp Incorporated||Method of making a solder containing electrical connector|
|US5052954 *||3 Oct 1989||1 Oct 1991||North American Specialties Corporation||Solder-bearing terminal pin and lead|
|US5411420 *||27 May 1993||2 May 1995||Die Tech, Inc.||Solder terminal strip|
|US5571034 *||20 Ene 1995||5 Nov 1996||North American Specialties Corporation||Method of making an array of electrical components with leads attached and the product thereof|
|US5699032 *||7 Jun 1996||16 Dic 1997||Littelfuse, Inc.||Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material|
|US5875546 *||7 Oct 1996||2 Mar 1999||North American Specialties Corporation||Method of forming solder-holding clips for applying solder to connectors|
|US5977860 *||21 Feb 1997||2 Nov 1999||Littelfuse, Inc.||Surface-mount fuse and the manufacture thereof|
|US5989700 *||5 Ene 1996||23 Nov 1999||Tekscan Incorporated||Pressure sensitive ink means, and methods of use|
|US6099365 *||29 Dic 1997||8 Ago 2000||North American Specialties Corporation||Solder-holding clips for applying solder to connectors or the like|
|US6261136||10 Jul 2000||17 Jul 2001||Die Tech, Inc.||Edge clip terminal|
|US6402574||29 Dic 1997||11 Jun 2002||North American Specialties Corporation||Solder-holding clips for applying solder to connectors or the like|
|US6494754||2 Ene 2002||17 Dic 2002||North American Specialties||Solder-holding clips for applying solder to connectors or the like|
|US6964205||30 Dic 2003||15 Nov 2005||Tekscan Incorporated||Sensor with plurality of sensor elements arranged with respect to a substrate|
|US6969286||20 Oct 2004||29 Nov 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US6979238||28 Jun 2004||27 Dic 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US6993954||27 Jul 2004||7 Feb 2006||Tekscan, Incorporated||Sensor equilibration and calibration system and method|
|US7052337||1 Jul 2005||30 May 2006||Samtec, Inc.||Connector having improved contacts with fusible members|
|US7125293||1 Jul 2005||24 Oct 2006||Samtec, Inc.||Connector having improved contacts with fusible members|
|US7159312||20 Oct 2004||9 Ene 2007||Samtec, Inc.||Connector having improved contacts with fusible members|
|US7178232||20 Oct 2004||20 Feb 2007||Samtec, Inc.||Connector having improved contacts with fusible members|
|US7258026||11 Jul 2005||21 Ago 2007||Tekscan Incorporated||Sensor with a plurality of sensor elements arranged with respect to a substrate|
|US7785704||31 Ago 2010||Tekscan, Inc.||High temperature pressure sensitive devices and methods thereof|
|US7837522||23 Nov 2010||Samtec, Inc.||Electrical contacts with solder members and methods of attaching solder members to electrical contacts|
|US8851933||11 Mar 2013||7 Oct 2014||Kerdea Technologies, Inc.||Releasable electrical connection|
|US20050145045 *||30 Dic 2003||7 Jul 2005||Tekscan Incorporated, A Massachusetts Corporation||Sensor|
|US20050268699 *||11 Jul 2005||8 Dic 2005||Tekscan, Inc.||Sensor with a plurality of sensor elements arranged with respect to a substrate|
|US20050287830 *||20 Oct 2004||29 Dic 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US20050287831 *||20 Oct 2004||29 Dic 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US20050287832 *||20 Oct 2004||29 Dic 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US20050287844 *||1 Jul 2005||29 Dic 2005||Samtec Inc.||Connector having improved contacts with fusible members|
|US20050287845 *||1 Jul 2005||29 Dic 2005||Samtec Inc.||Connector having improved contacts with fusible members|
|US20050287879 *||28 Jun 2004||29 Dic 2005||Samtec, Inc.||Connector having improved contacts with fusible members|
|US20060021418 *||27 Jul 2004||2 Feb 2006||Tekscan Incorporated||Sensor equilibration and calibration system and method|
|US20060147700 *||14 May 2004||6 Jul 2006||Thomas Papakostas||High temperature pressure sensitive devices and methods thereof|
|US20070184688 *||8 Feb 2006||9 Ago 2007||Cesar Avitia||Interconnection device for a double-sided printed circuit board|
|US20100173507 *||8 Jul 2010||Samtec, Inc.||Electrical connector having multiple ground planes|
|EP0040942A1 *||18 May 1981||2 Dic 1981||AMP INCORPORATED (a New Jersey corporation)||Electrical contact receptacle for substrate to printed circuit board connection|
|EP0167493A2 *||10 Ene 1985||8 Ene 1986||North American Specialities Corporation||Edge clip|
|WO1984000445A1 *||16 Jun 1983||2 Feb 1984||North American Specialities||Solder bearing terminal pin|
|WO1984000643A1 *||25 Jul 1983||16 Feb 1984||North American Specialities||Solder bearing edge clip|
|WO1986004741A1||30 Ene 1986||14 Ago 1986||North American Specialties Corporation||Solder-bearing terminal|
|WO1995028017A1 *||5 Abr 1995||19 Oct 1995||North American Specialties Corporation||Electrical lead for surface mounting of substrates|
|Clasificación de EE.UU.||439/876, 257/E23.068|
|Clasificación internacional||H01L21/48, H01R4/02, H05K3/34, H01R43/02, H01L23/498|
|Clasificación cooperativa||H01L21/4842, H01R43/0256, H05K2201/10984, H01L2924/0002, H05K2201/10386, H01L23/49811, H05K3/3405, H01R12/57|
|Clasificación europea||H01R12/57, H01R43/02P, H01L23/498C, H05K3/34B, H01L21/48C3M|