|Publication number||US7629690 B2|
|Application number||US 11/294,140|
|Publication date||Dec 8, 2009|
|Priority date||Dec 5, 2005|
|Also published as||CN1979841A, CN100452389C, US20070200241|
|Publication number||11294140, 294140, US 7629690 B2, US 7629690B2, US-B2-7629690, US7629690 B2, US7629690B2|
|Inventors||Tsang-Jiuh Wu, Syun-Ming Jang|
|Original Assignee||Taiwan Semiconductor Manufacturing Company, Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (4), Referenced by (1), Classifications (13), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates generally to fabrication processes of the interconnection structure of an integrated circuit, and more particularly to damascene processes.
Conventional integrated circuits contain a plurality of patterns of metal lines separated by inter-wiring spacings, and a plurality of interconnect lines, such as bus lines, bit lines, word lines and logic interconnect lines. Typically, the metal patterns of vertically spaced metal lines are electrically interconnected by vias. Metal lines formed in trench-like openings typically extend substantially parallel to the semiconductor substrate. Semiconductor devices of such type according to current technology may comprise eight or more levels of metallization to satisfy device geometry and micro-miniaturization requirements.
A common method for forming metal lines or vias is known as “damascene”. Generally, this process involves forming an opening in the dielectric interlayer that separates the vertically spaced metallization layers. The opening is typically formed using conventional lithographic and etching techniques. After an opening is formed, the opening is filled with copper or copper alloys to form a via. Excess metal material on the surface of the dielectric interlayer is then typically removed by chemical mechanical planarization (CMP).
Copper has replaced aluminum because of its lower resistivity and higher reliability. However, copper still suffers from electro migration (EM) and stress migration (SM) reliability issues as geometries continue to shrink and current densities increase.
In conventional interconnection structures, metal lines, which are typically formed of copper or copper alloys, are interconnected by vias. Etch stop layers (ESLs) are formed for better etch control. Diffusion barrier layers are typically formed to prevent copper from diffusing into neighboring low-k dielectric layers. The ESLs play an important role in the structure. Besides acting as etch stops, the ESLs also act as diffusion barrier layers preventing copper from diffusing into the respective overlying low-k dielectric layers, which are typically porous and vulnerable to copper “poisoning”.
The above-discussed structure, however, suffers performance problems when used in very small-scale integrated circuits. The ESLs are typically formed of a dielectric material having a higher k value than that of the low-k dielectric layers. As is well known in the art, the capacitance of a capacitor is proportional to the dielectric constant (k value) of the dielectric material between the capacitor plates. With ESLs having a higher k value, the effective k value of the material between the capacitor plates (metal lines) increases. Additionally, capacitance between closely located metal lines in the same metallization layer also increases. Consequently, RC delay of the integrated circuit increases.
A non-ESL method has been developed to solve this problem by forming metal cap layers instead of ESLs on the copper lines. The cap layers are typically formed of materials that suffer less from diffusion, and that can prevent copper from diffusing into the overlying low-k dielectric layers. Without the ESLs, the parasitic capacitance is reduced.
The non-ESL approach, however, has introduced another problem. A low-k dielectric layer typically has an inherent tensile stress. Stacked tensile layers tend to crack when the thickness is beyond a threshold called the cracking threshold. ESL layers typically have inherent compressive stress and can provide a structure support to the semiconductor structure, preventing overlying and underlying low-k dielectric layers from cracking. The lack of ESLs, therefore, may result in a weaker semiconductor structure.
In order to maintain the integrity of the semiconductor structures without sacrificing performance of the integrated circuits, a new method of forming interconnection structures is needed.
The preferred embodiment of the present invention provides a non-ESL semiconductor interconnection structure and a method of forming the same.
In accordance with one aspect of the present invention, the non-ESL semiconductor interconnection structure includes a first low-k dielectric layer comprising a first region and a second region overlying a substrate, a plurality of conductive features (such as metal lines) in the first low-k dielectric layer, a cap layer on at least a portion of the conductive features, and a dielectric capping layer overlying the first low-k dielectric layer in the second region but not in the first region. The conductive features in the second region have a substantially greater spacing than the conductive features in the first region. The dielectric capping layer preferably has an inherent compressive stress.
In accordance with another aspect of the present invention, recesses are formed in the first region of the first low-k dielectric layer. The recesses may have a depth of greater than about 10 Å, and more preferably between about 10 Å and about 200 Å.
In accordance with another aspect of the present invention, the semiconductor structure further includes a third low-k dielectric layer over the second low-k dielectric layer. Conductive features in the third low-k dielectric layer preferably have greater spacings than the conductive features in the first and second low-k dielectric layers. It is optional to form a dielectric capping layer between the second and the third low-k dielectric layers. The dielectric capping layers may be formed over every other high-level low-k dielectric layers.
In accordance with yet another aspect of the present invention, a method of forming the preferred embodiments of the present invention includes providing a substrate, forming a first low-k dielectric layer overlying the substrate, forming a plurality of openings in the first low-k dielectric layer in a first region and a second region, filling the openings with a conductive material to form a plurality of conductive features, selectively forming a cap layer overlying the conductive features, and forming a dielectric capping layer over the first low-k dielectric layer in the second region but not the first region. The conductive features in the second region have a greater spacing than the conductive features in the first region.
The preferred embodiments of the present invention not only improve the strength of the semiconductor structure, but also reduce the parasitic capacitance between conductive features.
For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
The making and using of the presently preferred embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.
The compressive layer 42 is a dielectric typically having a higher dielectric constant than the low-k dielectric layer 20 and the subsequently formed IMD layer. Therefore, it adversely affects the parasitic capacitance. Portions of the compressive layer 42 causing the most effects to the parasitic capacitance are preferably removed.
Whether the compressive layer 42 should be removed from a certain region or not is preferably determined by the spacing of the conductive lines in the region. For example, in region 100, conductive lines 30, 32 and 34 are closely located, and the parasitic capacitances between these conductive lines are more significant. The compressive layer 42 thus needs to be removed from region 100. Generally, if the spacing D1 between conductive lines in a region is less than a maximum spacing, the compressive layer 42 is preferably removed from the region. The maximum spacing is preferably less than about 200 percent of the line width W1 of the respective conductive lines. Preferably, the maximum spacing is less than about 2000 Å.
In region 200, the spacing between the conductive lines 34 and 36 is greater, hence the parasitic capacitance between those lines is smaller. Preferably, if the spacing D2 between two conductive lines is greater than a minimum spacing, which is about 300 percent of the line width W1 of the respective conductive lines, the compressive layer 42 therebetween is not removed. Preferably, the minimum spacing is greater than about 3000 Å.
One skilled in the art will realize that the criteria used for determining whether the compressive layer should be removed from a region or not is a design decision, and can be affected by various other factors, such as the k value and the mechanical property of the low-k dielectric layer 20. Typically, the lower the k value of the dielectric layer 20, the greater effect a compressive layer 42 has on the parasitic capacitance, and the more compressive layer is removed. The factors also include the mechanical properties of the low-k dielectric layer 20, wherein weaker low-k dielectric layers 20 and IMD layers demand more of the compressive layer 42 to be saved. One skilled in the art will be able find an optimum balancing point between removing and saving the compressive layer. If the spacing between metal features in a device region falls between the maximum spacing and the minimum spacing, the above discussed factors will be taken into account to determine whether the compressive layer should be removed from the device region or not.
After the formation of conductive lines 30, 32, 34 and 36 and metal caps 38, dual damascene processes are preferably performed to form vias and upper-level conductive lines. In alternative embodiments, the vias and upper-level conductive lines can be formed by single damascene processes. Referring to
The preferred embodiments of the present invention have several advantageous features. Compressive layers are provided to structurally support low-k dielectric layers, particularly extremely low-k dielectric layers, thus reducing the likelihood of cracking. The compressive layer is removed from regions having closely spaced conductive lines. Therefore, the adverse effects caused by the compressive layer are eliminated/reduced, thus the parasitic capacitance is also reduced.
Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US6417094 *||Dec 31, 1998||Jul 9, 2002||Newport Fab, Llc||Dual-damascene interconnect structures and methods of fabricating same|
|US6472306 *||Sep 5, 2000||Oct 29, 2002||Industrial Technology Research Institute||Method of forming a dual damascene opening using CVD Low-K material and spin-on-polymer|
|US20040251549 *||Jun 24, 2003||Dec 16, 2004||Tai-Chun Huang||Hybrid copper/low k dielectric interconnect integration method and device|
|US20060234443 *||Apr 15, 2005||Oct 19, 2006||Chih-Chao Yang||MIM capacitor and method of fabricating same|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US20120261813 *||Oct 18, 2012||International Business Machines Corporation||Reinforced via farm interconnect structure, a method of forming a reinforced via farm interconnect structure and a method of redesigning an integrated circuit chip to include such a reinforced via farm interconnect structure|
|U.S. Classification||257/758, 257/E21.575, 257/E21.597|
|International Classification||H01L23/52, H01L29/40|
|Cooperative Classification||H01L23/528, H01L2924/0002, H01L23/53295, H01L21/76849, H01L21/76829|
|European Classification||H01L21/768B10, H01L23/528, H01L23/532N4|
|Dec 5, 2005||AS||Assignment|
Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WU, TSANG-JIUH;JANG, SYUN-MING;REEL/FRAME:017327/0966
Effective date: 20051128
|Mar 8, 2013||FPAY||Fee payment|
Year of fee payment: 4