System Management for Advanced & Replacement Technology
Small Business Information
EDAPTIVE COMPUTING, INC.
1245 Lyons Road, Building G, Dayton, OH, 45458
AbstractEDAptive Computing, Inc. (EDAptive) and the University of Kansas (KU) present our Phase II proposal for a unique and commercially viable solution to the problem of high Operation and Support (O & S) costs resulting from the large manual effort required forrecertification of electronic parts upon replacement or upgrade. Our System Management for Advanced & Replacement Technology (SMART) will automate several steps required for recertification of digital parts, especially obsolete parts retargeted to FPGAs.This includes multiple use modules such as the ALQ16B Unimodule that need replacement as a result of Diminishing Manufacturing Sources/Material Shortages (DMS/MS). We have established the technical feasibility of the SMART product during a Phase I SBIRproject and have developed a plan to develop a proof-of-concept implementation and demonstration during a Phase II project. Further, we have established the commercial feasibility of the SMART product, as evidenced through endorsements from investors,potential customers, possible partners and the press. In this proposal we present our approach to apply the feasibility we established, the commercialization avenues we opened, and the preliminary design we developed in Phase I, to prove the concept,produce the product, and accomplish technology transition in Phase II. Maturation and integration of tools and languages proposed under this effort will alleviate the electronics parts obsolescence problem and reduce the cost of addressing it by at leastan order of magnitude, especially for avionics system upgrades/replacement. In addition to DoD applications, the proposed system could be used for commercial aviation, space-based systems to identify potential problems when upgrading or replacing forobsolescence or performance needs and ultimately design of large and complex commercial electronics systems such as System-On-Chip.
* information listed above is at the time of submission.