Methods of Adhesion Promotion for Metal Films Deposited on Substrates
The invention describes methods and resulting structures in which a metal layer is adhered to a surface of a substrate. The methods involve applying a sacrificial acidic organic layer to the substrate prior to depositing the metal layer. The sacrificial layer is consumed, leaving behind a metal/substrae interface that has excellent adhesion properties.
Fabrication of micro-electronics, such as integrated circuits
The method reduces the amount of contaminating oxides, thus resulting in better adhesion and improved performance of the devices.