Ultrasound imaging probes for volumetric (3D real time) scanning
Lead partner: Vermon
- High density integration and 3D interconnection
- Power dissipation
- Reduction of form factor
- Interconnect suitable with US backing functionality.
Demonstrator & challenges
Design a smart concept of high density matrix based transducer assembly:
- Methods for making a suitable 2D transducer array (piezoelectric and/or CMUTs (capacitive micromachined ultrasonic transducers))
- Designs and manufacture of high density (up to 64x64 channels) matrix interconnect backing block using micro fabrication techniques.
- 3D packaging/integration methods for transducer control electronics compatible with the array footprint (surface of array).
- Design of customizable system/platform interface.