'My PIC is dead. THE SEQUEL'
> Did both die from thermal shock, perhaps the connections from the die to the
> outer package being unable to keep up with the thermal expansion of the
Yep, the ultrasonically welded bonding wires from the die to the lead
frame go first.
I.C.'s are tested with thermal cycling and vibration. The ones that
pass the toughest tests are the military grade.
Or something like that. Microchip Data Book has a chapter on reliability
that tells about their testing.
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