Silicon die self-alignment on a wafer: stable and instable modes
J. Berthier, F. Grossi, L. Di Cioccio
Cea-Leti Minatec, FR
Keywords: die, alignment, modes, yaw, roll, minimal surface
Abstract:To create advanced Microsystems by 3D integration, die-to-wafer assembly is required to obtain fast and reliable packaging. In order to overcome the main difficulties of current techniques, self-assembly methods are promising due to their serial aspect. The aim of this work is to understand the mechanisms of self alignment. Using “Surface Evolver” software, we were able to study misalignments of the system and their evolutions.