US 20070165408 A1
A high-power LED package structure applied to spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The high-power LED package structure comprises at least one light emitting diode chip attached to an outer surface of a metallic heat sink of high heat conductivity. The structure further comprises a heat-conducting base on which the metallic heat sink is embedded. There is an insulating layer between the metallic heat sink and the heat-conducting base. The tri-structure significantly increases the mechanical toughness and the heat-conducting area of the present invention, whereby the heat produced in the metallic heat sink will be diffused quickly to the heat-conducting base and then dissipated away. Therefore, the effect of heat dissipation will be enhanced.
1. A high-power LED package structure, comprising:
a lamb shade cup;
a light-emitting diode (LED) chip array used as a light source having at least one LED chip;
a metallic heat sink on which said LED chip array is embedded having a volume much larger than said LED chip array, a top surface of said metallic heat sink further including said lamp shed cup covered with said lens, said lens having a preset curvature for projecting light in a predetermined angle; and
a heat-conducting base on which said metallic heat sink is mounted, a heat-conducting insulating layer being disposed between said heat-conducting base and said metallic heat sink, whereby the mechanical toughness, electric insulating and heat conduction of said high-power LED package structure will be enhanced;
whereby the heat generated in said LED chip array will be quickly transferred to said metallic heat sink and then to said heat-conducting base, and whereby said LED chip array will support a higher electric current and have brighter light intensity.
2. The high-power LED package structure of
3. The high-power LED package structure of
4. The high-power LED package structure of
5. The high-power LED package structure of
6. The high-power LED package structure of
7. The high-power LED package structure of
8. The high-power LED package structure of
9. The high-power LED package structure of
The present invention relates to high-power LED package structures, more particularly to a high-power LED package structure used as a light source, whereby the mechanical toughness, insulator toughness and heat-conducting area are increased. Therefore, the effect of heat dissipation is enhanced.
It is a trend that light emitting diode (LED) is widely used to replace conventional light bulb in various occasions, such as LED projector light source, spot light, traffic signal light and automobile brake light. A light bulb made of LEDs has the advantage of small volume but is limited in luminosity, which limits its application. To increase its luminosity, light source made of a plurality of LEDs is necessary, causing a proportional increase in the operation current. However, the conventional LED light bulbs rely on metallic bracket for the LEDs to dissipate heat, which is not sufficient for an operation at high electric current, and therefore the luminosity is still limited. To operate the LED light bulbs at high current and therefore high luminosity for a long time is easy to burn out the LED chips therein. To tackle this disadvantage, a multi-layer structure wherein the LED chips are attached on a thin copper sheet that is mounted on a metallic block by a gluing material. Therefore, as heat is generated in the chips, it will be transferred quickly downward to the metallic block. However, the design is still not efficient enough, and therefore the durability of the LED chips is still limited.
The primary objective of the present invention is to provide a high-power LED package structure utilizing LED chips as a light source and powered by a direct current source. The present invention can be used in spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The present invention comprises at least one LED chip.
The secondary objective of the present invention is to provide a high-power LED package structure wherein the upper end of the lamp shade of the light bulb is provided with a lens made of glass or acrylic. The lens can be selected from a convex, concave and a planar lenses; the lens is easy to replace in accordance with customer's request.
It is a further objective that a high-power LED package structure of the present invention wherein the cup body of the lamp shade is made of plastic or aluminum alloy and has a parabolic inner surface for focusing the light beams from the LED, whereby the present invention can be used to project and focus light in various directions. The cup body of the lamp shade is connected to the heat-conducting base for mounting and protection.
Further, an another objective of the present invention is to provide a high-power LED package structure wherein the heat-conducting base may have a contour selected from a circle, a square or another geometric shape. The contour of the lens, the lamp shade and the heat-conducting base can also be varied.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings.
To summarize, the present invention has the following advantages:
The metallic heat sink, the insulating layer, the heat-conducting base and the lamp shade cup are connected to form an integral metallic body capable of transferring heat generated in LED chips outward quickly. Thereby, the LED chips can sustain a large amount of electric current and become brighter.
Since each of the chips can be brighter, the total number of LED chips is limited, and therefore the production cost is lower.
Since the heat conduction is more efficient, the LED chips are at a much lower temperature; therefore, their durability is enhanced.
The heat sink is engaged within a receptacle on the heat-conducting base, between which two a thin layer of insulating material of high thermal conductivity is sandwiched. Therefore, the mechanical toughness and heat conduction are enhanced, and simultaneously the electric insulating is assured.
The present invention is thus described, and it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.