The Autoplacer MP300 die sorter is specifically engineered for automatic die sort using ink dots and wafer maps, with rich support for die binning and sorting multi-project wafers (sometimes called "Pizza" wafers) with output to Waffle packs, Gel-Pak™, film frames, JEDEC trays and substrates.
650 Universal Bond Tester
The System 650 Universal Bond Tester is todays solution for a broad spectrum of bond testing needs
Download the data sheets! Royce Instruments Bond Testing and Die Sorting Systems
Royce Instruments provides high quality solutions for your Bond Testing, Die Handling and Die Sorting needs.
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