This study presents a novel process of using micro-electro-discharge-machining (micro-EDM) combined with electro-codeposition to fabricate the micro-grinding-tool to machining a micro-hole on high nickel alloy. During the machining process, a micro-grinding-tool is fabricated by wire electro-discharge grinding (WEDG) and electro-codeposition directly by using micro-EDM for machining the micro-hole and by micro-grinding to finish the hole wall.
The experimental result shows the suitable parameters obtained to fabricating micro-grinding-tool for electro-codeposition are considered to be the following: electric current of 10 mA, hole diameter of positive ring is 5 mm, SiC particle size of 4μm, SiC particle concentration of 10 g/L, rotational speed of 15 rpm and CTAB of 150 ppm. By this method, The micro-grinding-tool will provided with smoothness surface on coating layer, uniform particle distribution and suitable adhesion particle quantity. Finally, the tool feed adopts as 30 μm/min in micro-grinding process, the surface roughness reduces from 1.47 μm Rmax (0.2 μm Ra) to 0.462 μm Rmax (0.026 μm Ra) after micro-grinding.
1. Seong. S. Choi, Jung, D. W. Kim, M. A. Yakshin, J. Y. Park and Y. Kuk “Frabrication and microelectron gun arrays using laser micromachining” 1998 Microelectronic Engineering 41/42 167-170.
2. A. C. Wang, B. H. Yan, X. T. Li and F. Y. Huang “Use of micro ultrasonic vibration lapping to enhance the precision of microholes drilled by micro electro-discharge machining” 2002 International Journal of Machine Tools and Manufacture 42 915-923.
3. H Huang, H Zhang, L Zhou and H Y Zheng “Ultrasonic vibration assisted electro-discharge machining of microholes in Nitinol “ 2003 J. Micromech. Microeng. 13 693–700.
4. W. Ehrfeld and H. Lehr “Deep X-Ray Lithography for the production of three-dimensional microstructures from metals, polymers and ceramics” 1995 Radiat. Phys. Chem 45 3 349-365.
5. R. K Kupka, F. Bouamrance, Cremers, Smegtert, Smegtert “Mircofabrication : LIGA-X and applications “ 2000 Applied Surface Science 164 1-4 97-110.
6. Hung Sung Liu, Biing Hwa Yan, Chien Liang Chen and Fuang Yuan Huang “Application of micro-EDM combined with high-frequency dither grinding to micro-hole machining” 2006 International Journal of Machine Tools & Manufacture 46 80–87.
7. Bo Hyun Kim, Shi Hyoung Ryu, Deok Ki Choi and Chong Nam Chu “Micro electrochemical milling” 2005 J. Micromech. Microeng. 15 124–129.
8. Gulielmi, N. “Kinetics of the Deposition of Inert Particles from Electrolytic Baths” 1972 Journal of the Electrochemical Society 119 8 1009-1012.
9. Celis, J. P., Roos, J. R. and Buelens, C. “A Mathematical Model for the Electrolytic Codeposition of Particles with a Metallic Matrix” 1987 Journal of the Electrochemical Society 134 6 1402-1408.
10. Hwang, B. J. and Hwang, C. S. “Mechanism of Codeposition of Silicon Carbide with Electrolytic Cobalt” 1993 Journal of the Electrochemical Society 140 4 979-984.
11. Garcia, I., Fransaer, J., Celis, J. P., “Electrodeposition and Sliding Wear Resistance of Nickel Composite Coatings Containing Micron and Submicron SiC Particles” 2001 Surface & Coatings Technology 148 2-3 171-178.
12. Marc De Vogelaere, Volkmar Sommer, Heike Springborn,Ursula Michelsen-Mohammadein “High-speed plating for electronic applications” 2001 Electrochimica Acta 47 1-2 109-116.
13. James Q. Feng, Dan A. Hays “Relative importance of electrostatic forces on powder particles” 2003 Powder Technology 135-136 65-75.
14. Nabeen K. Shrestha, Ichiro Miwa, and Tetsuo Saji,” Composite Plating of Ni/SiC Using a Cationic Surfactant with an Azobenzene Group” 2001 Journal of The Electrochemical Society, 148 2 C106-C109.