The EVG®560HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing. The flexible tool supports metal, adhesive and fusion bonds of various substrate types. Cassette-to-cassette operation, multisubstrate bonding capability and a modular design with up to four swap-in process modules make the EVG®560HBL the perfect solution for high-volume HB-LED manufacturing. EVG's field proven wafer bonding technology, as well as our unique approach to low temperature metal wafer bonding, results in highest throughput and yields.
Features Highest throughput up to 160 bonds/h (2" wafer equivalents)Optimized pressure and temperature uniformity for highest yieldAutomatic handling of bowed and warped wafers
Dedicated wafer bonding system for HB-LEDs
Low temperature metal wafer bonding Integrated pre-processing modules for low-temperature metal wafer bondingEutectic, Transient-Liquid-Phase (TLP) and thermo-compression bondingE.g. Au-Au, Au-In, Au-Sn, Cu-Sn, Cu-Cu,..
Fully automated system for high volume manufacturing Cassette-to-cassette operationModular design with swap-in modulesEasy switch between wafer sizes
EVG's field proven wafer bonding technology In-situ low-force wafer wedge compensation and proprietary compliant layer technologiesContact force options for high yield metal based bondsFast heating ramps and controlled cooling on external cooling stationUnique bond chamber design that allows for easy maintenance and minimal tool downtime
Total solution for HB-LEDsField-proven equipment for high volume manufacturingWorldwide process engineering supportWorldwide customer support structure