Livermore, Calif.FormFactor Inc. has developed a family of advanced wafer probe cards designed to address the rising cost and technology challenges associated with testing wire bond logic and system-on-chip (SoC) devices.
The TrueScale product family leverages FormFactor's MicroSpring contact technology to provide increased throughput and uptime that wire bond logic and SoC manufacturers need to lower their test cost per die and support their technology roadmaps for tighter pad pitches.
FormFactor's cards feature the ability to reduce device pad pitch, with a roadmap to scale to 30-micron pitch inline. The high precision of the MicroSpring contacts minimizes pad damage and allows for greater test uptime. In addition, the improved electrical performance of the TrueScale probe card family allows customers to fully test the performance limits of their devices at probe, ensuring confidence that devices meet performance specifications before they are packaged.
FormFactor is now taking orders for the TrueScale wafer probe card family.
FormFactor, 1-925-290-4000, www.formfactor.com