| Número de publicación||US6207288 B1|
|Tipo de publicación||Concesión|
| Número de solicitud||US 07/924,591|
| Fecha de publicación||27 Mar 2001|
| Fecha de presentación||8 Ago 1992|
| Fecha de prioridad||5 Feb 1991|
| Número de publicación||07924591, 924591, US 6207288 B1, US 6207288B1, US-B1-6207288, US6207288 B1, US6207288B1|
| Inventores||Terry Bloom|
| Cesionario original||Cts Corporation|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citas de patentes (27), Otras citas (29), Citada por (1), Clasificaciones (25), Eventos legales (4) |
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
Conductive composition chemically bonded to substrate
US 6207288 B1
A copper conductor formulation which exhibits outstanding properties when fired upon an aluminum nitride substrate is disclosed. The conductor formulation primarily includes copper and further includes oxygen-bearing copper, lead monoxide containing glass and a screening agent. A conductor formed in accord with the invention exhibits outstanding properties including initial and aged adhesion, conductivity and solderability.
1. A conductive composition chemically bonded to an aluminum nitride substrate, said conductive composition comprising a first metallic conductive material and an adhering means chemically reacted with the aluminum nitride in said substrate for adhering to said conductive material and to said substrate, said adhering means comprising a glass frit which consists of 80 weight % lead monoxide, 10 weight % boron oxide and 10 weight % silica.
This application is a continuation of Ser. No. 07/650,960 filed Feb. 5, 1991.
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention pertains to electrically conductive compositions in general, and specifically to thick film copper and glass containing conductives formulated for screen printing application on aluminum nitride substrates.
2. Description of the Related Art
Modern electronic circuits are almost exclusively assembled via printed wiring substrates. These substrates eliminate the need for the “rat's nest” of wires that abound with discretely wired circuitry and improve the yield of assembled circuitry because the wiring boards improve the consistency of device interconnection. Additionally, wiring boards have encouraged miniaturization by providing size benefit as well as signal integrity that might otherwise be compromised on higher frequency circuitry.
Wiring substrates for commercial applications are typically fabricated from a polymer material such as epoxy or polyimide which may be cast or laminated into the desired configuration. The polymer materials are desirable because of low cost and the relative ease of general processing but have drawbacks in thermal characteristics such as maximum exposure temperature, maximum operating temperature, thermal coefficient of expansion, and thermal conductivity. Polymer substrates also may suffer from poor aged performance, mechanical strength and rigidity and other factors.
Where polymer wiring substrates have proved to be ineffective in meeting the demands of an application, the electronics industry has generally relied upon either alumina, porcelain or glass, or beryllia substrates. These substrates typically have better performance in many of the areas that prevent the use of polymer substrates. However, as with most things in the real world, these substrates are not also without particular limitation. For example, beryllia is a very good thermal conductor having high mechanical strength. Unfortunately, beryllia is also very toxic if inhaled in dust form. Exposure to beryllia dust is now restricted in the work place in many countries around the world.
Aluminum nitride, only recently commercially viable, has many properties much more desirable than those heretofore known compositions. Aluminum nitride has thermal conductivity comparable to beryllia without the toxicity. Aluminum nitride has mechanical strength and chemical stability that is comparable to other ceramic substrates. Particularly advantageous is the thermal coefficient of expansion of this material, which very closely corresponds to the thermal coefficient of expansion of silicon, allowing for the mounting of semiconductor devices that are required to endure many thermal cycles without separating from the wiring substrate. When the high thermal conductivity of the material is considered in concert with a thermal coefficient of expansion matching silicon, the application to high power semiconductor circuits in small, high reliability packages becomes apparent.
In spite of the many advantages aluminum nitride has to offer, there are again some drawbacks. Principal among the heretofore limitations of aluminum nitride is the fact that the substrate is a non-oxide substrate. The use of a non-oxide substrate limits the selection of conductive and resistive materials suitable for application to the substrate and limits the method of application. Some of the formulations previously used with alumina react too vigorously with aluminum nitride or in other cases fail to generate any chemical adhesion whatsoever. For example, in the hybrid industry most circuits are formed upon alumina substrates using a thick film screen printing process. The screen printing process is favored where suitable over vapor deposition processes because of the lower costs of production involved.
However, the use of aluminum nitride has previously required either the use of precious metal formulations which are necessarily expensive and which are not good conductors, owing to the relatively poor intrinsic conductivity of the materials and the high price those precious metals are sold for on the open market, or the use of expensive vapor deposition processes using materials such as tungsten and molybdenum. The advantages offered by a copper-based screen printable conductive are well described in U.S. Pat. No. 4,186,615, incorporated herein by reference, which discusses the application of copper to oxide-based substrates. While heretofore known formulations were not found to be suitable for use on an aluminum nitride substrate, there is a place and a need for a copper conductor formed upon aluminum nitride.
SUMMARY OF THE INVENTION
Copper conductor inks fully compatible with aluminum nitride substrates and with low associated materials cost which are intrinsically very conductive are disclosed herein. These conductor inks contain lead oxide which evokes a reaction with the aluminum nitride substrate, thereby producing a chemically bound and highly adherent conductor. These copper conductors bring forth all the advantages associated with aluminum nitride substrates, owing to the high thermal conductivity and high electrical conductivity of the resultant copper conductor while retaining the low costs associated with base metal materials.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Copper in the preferred embodiment is derived from a mixture of pure copper and either cupric oxide or copper hydroxide. The preferred level of copper is approximately 77 parts by weight and the oxygen bearing copper should comprise approximately 15 parts by weight. Eight parts by weight are a glass frit containing lead monoxide, boric oxide and silica. These “active” agents may then be blended with approximately 14 parts by weight suitable screening agent, yielding a formulation well suited for screening onto an aluminum nitride substrate. The element is then fired in a nitrogen atmosphere to a peak temperature of 880° C. yielding a well adhered, defect free conductor.
While the suitable “active” ingredient percentage levels for oxygen-bearing copper vary from approximately 8% cupric oxide and from approximately 15% copper hydroxide, these are only minimum levels and levels of 23% cupric oxide and 30% copper hydroxide do not appear to significantly adversely affect adhesion to aluminum nitride. However, as the oxygen-bearing copper content rises, solderability of resultant conductors worsens. The present preference is for levels of about 15% cupric oxide and about 25% copper hydroxide.
Glass levels also are somewhat variable, although less so than for oxygen-bearing copper. Where 25% copper hydroxide is used, levels of only 2% glass have been determined to be adequate, with levels at least to 8% performing satisfactorily. Where 15% cupric oxide is used, glass levels from 4 to 12 percent have performed satisfactorily, with 8% being preferred.
A critical component of the preferred embodiment is the glass composition. The glass used in each of the above examples was comprised by 80% by weight lead monoxide, 10% by weight boric oxide, and 10% by weight silica. Very small changes in this formulation have been found to improve the initial adhesion of the fired conductive, but only at the significant expense of aged adhesion performance. Example 1 illustrates the variability introduced by changing the glass composition.
The use of lead oxide in the present formulation, especially at these very high levels, is believed to be very novel since much literature has been directed to problems associated with the use of lead-bearing glasses in association with aluminum nitride and the resultant attempts by others to use lead-free compositions. The fact that the preferred embodiment has such outstanding characteristics serves to question the teachings of the prior art.
In the following example, an ink was formulated from 77 parts copper, 15 parts cupric oxide, and 8 parts glass. 14 parts screening agent which included pine oil, Elvacite and CO-430 was added to provide appropriate rheology, and the formulation was screened upon an aluminum nitride substrate. The substrate was then fired, and initial adhesion tested for some of the samples. The remaining samples were then aged in air at 150° C. for 1000 hours and adhesion was tested.
While the foregoing details what is felt to be the preferred embodiment of the invention, no material limitations to the scope of the claimed invention is intended. Further, features and design alternatives that would be obvious to one of ordinary skill in the art are considered to be incorporated herein. The scope of the invention is set forth and particularly described in the claims hereinbelow.
| Patente citada|| Fecha de presentación|| Fecha de publicación|| Solicitante|| Título|
|US4299876 *||13 Jun 1980||10 Nov 1981||Honeywell Information Systems Inc.||Gold dispersed in inorganic binder of cuprous oxide, lead fluoride, and cadmium oxide|
|US4409261 *||18 Nov 1981||11 Oct 1983||Cts Corporation||Process for air firing oxidizable conductors|
|US4436785 *||16 May 1983||13 Mar 1984||Johnson Matthey Inc.||Silver-filled glass|
|US4521329||20 Jun 1983||4 Jun 1985||E. I. Du Pont De Nemours And Company||Copper conductor compositions|
|US4536435 *||14 Oct 1982||20 Ago 1985||Nippon Electric Co., Ltd.||Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material|
|US4623482 *||25 Oct 1985||18 Nov 1986||Cts Corporation||Copper conductive paint for porcelainized metal substrates|
|US4659611 *||27 Feb 1985||21 Abr 1987||Kabushiki Kaisha Toshiba||Circuit substrate having high thermal conductivity|
|US4714645 *||7 Jul 1986||22 Dic 1987||Mitsubishi Mining & Cement Co., Ltd.||Ceramic substrate, metal coating; electrodes|
|US4756976 *||7 Ago 1987||12 Jul 1988||Kabushiki Kaisha Toshiba||Ceramic with anisotropic heat conduction|
|US4840853 *||9 Mar 1987||20 Jun 1989||Ngk Spark Plug Co., Ltd.||Surface structure of AlN substrate and a process for producing the same|
|US4863658||28 Jun 1988||5 Sep 1989||Kabushiki Kaisha Toshiba||Aluminum nitride ceramic substrate for copper and method for production thereof|
|US4882212 *||30 Oct 1986||21 Nov 1989||Olin Corporation||Electronic packaging of components incorporating a ceramic-glass-metal composite|
|US4892703 *||24 Mar 1989||9 Ene 1990||Ngk Spark Plug Co., Ltd.||Surface structure of A1N substrate and a process for producing the same|
|US4906514||21 Nov 1988||6 Mar 1990||Corning Incorporated||Metallized substrate for electronic device|
|US5057376||15 Nov 1989||15 Oct 1991||Asahi Glass Company Ltd.||Heat dissipation of semiconductors; noncracking|
|US5063121||22 Sep 1989||5 Nov 1991||Kabushiki Kaisha Toshiba||Sheet with metallized layer containing molybdenum, tungsten, activator metal or their alloys and interface layer of yttria and alumina|
|US5085923 *||17 Abr 1991||4 Feb 1992||Sumitomo Electric Industries, Ltd.||Printed circuits; high purity, high density|
|US5087509||18 May 1990||11 Feb 1992||Mitsubishi Metal Corporation||Substrate used for fabrication of thick film circuit|
|US5089172||31 Ago 1987||18 Feb 1992||Ferro Corporation||Thick film conductor compositions for use with an aluminum nitride substrate|
|US5096768||5 Feb 1990||17 Mar 1992||Mitsubishi Metal Corporation||Dielectric|
|US5150830||20 Feb 1991||29 Sep 1992||Telemecanique||Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate|
|US5152931||12 Mar 1990||6 Oct 1992||Ferro Corporation||Mixing organic vehicle and metallic powders, forming a paste; electroconductivity|
|US5159432||4 May 1992||27 Oct 1992||Sumitomo Electric Industries, Ltd.||Semiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interface|
|US5164246||22 Dic 1988||17 Nov 1992||Kabushiki Kaisha Toshiba||For semiconductors, aluminum nitride ceramics, electroconduc-tive coating, metal nitride, tungsten and molybdenum|
|US5164885||21 Nov 1991||17 Nov 1992||Motorola, Inc.||Electronic package having a non-oxide ceramic bonded to metal and method for making|
|US5165983||28 Ene 1991||24 Nov 1992||Kabushiki Kaisha Toshiba||Method for production of aluminum nitride ceramic plate|
|US5165986||5 Jun 1991||24 Nov 1992||Ferro Corporation||Copper conductive composition for use on aluminum nitride substrate|
|1||A. Mohammed, A. Abdo, G. Scarlett and F. Sherrima, "Effect of Lot Variations on the Manufacturability of Thick and Thin Film Aln Substrates"-ISHM '90 Proceedings, pp. 7 thru 12.|
|2||A. Mohammed, A. Abdo, G. Scarlett and F. Sherrima, "Effect of Lot Variations on the Manufacturability of Thick and Thin Film Aln Substrates"—ISHM '90 Proceedings, pp. 7 thru 12.|
|3||C. V. Cox, M. J. Huftless, etal, "A New Thick Film Materials System for Aluminum Nitride"-International Journal for Hybrid Microelectronics, V10, N3, 3rd Qtr. 1987-pp. 8 thru 12.|
|4||C. V. Cox, M. J. Huftless, etal, "A New Thick Film Materials System for Aluminum Nitride"—International Journal for Hybrid Microelectronics, V10, N3, 3rd Qtr. 1987—pp. 8 thru 12.|
|5||Ceramic Glazes Parmalee, Cullen W., International Publications, Inc., Chicago, 1951, pp. 24-26, 30-34. (No Month).|
|6||E. S. Dettmer and H. K. Charles, Jr., "Fundamental Characterization of Aluminum Nitride and Silicon Carbide for Hybrid Substrates Applications"-International Journal for Hybrid Microelectronics, 2nd Qtr. 1987, V10, N2-pp. 9 thru 18 Journal.|
|7||E. S. Dettmer and H. K. Charles, Jr., "High Reliability Thick Film Development Considerations for Aluminum Nitride Substrates"-ISHM '87 Proceedings-pp. 19 thru 29.|
|8||E. S. Dettmer and H. K. Charles, Jr., "Fundamental Characterization of Aluminum Nitride and Silicon Carbide for Hybrid Substrates Applications"—International Journal for Hybrid Microelectronics, 2nd Qtr. 1987, V10, N2—pp. 9 thru 18 Journal.|
|9||E. S. Dettmer and H. K. Charles, Jr., "High Reliability Thick Film Development Considerations for Aluminum Nitride Substrates"—ISHM '87 Proceedings—pp. 19 thru 29.|
|10||Electronic Materials Division, Ferro Corporation-News Release: "Thick Film Materials Developed for Aluminum Nitride Substrates"-Oct. 1988-1 pg.|
|11||Electronic Materials Division, Ferro Corporation—News Release: "Thick Film Materials Developed for Aluminum Nitride Substrates"—Oct. 1988—1 pg.|
|12||Glass-Ceramics, McMillan, P.W., Academic Press, London, 1964, pp. 17-19, 23-3. (No Month).|
|13||Guy Ackerman, Dana L. Hankey, "Effects of Laser Trimming Thick Film Resistor Materials on Aluminum Nitride Substrates"-Proceedings of 2nd ASM International Apr. 24-28, 1989 pp. 231 thru 239 (Odd pages only).|
|14||Guy Ackerman, Dana L. Hankey, "Effects of Laser Trimming Thick Film Resistor Materials on Aluminum Nitride Substrates"—Proceedings of 2nd ASM International Apr. 24-28, 1989 pp. 231 thru 239 (Odd pages only).|
|15||Handbook of Glass Manufacture, Jay V. Tooley, ed. Ogden Publishing Company, New York, 1953, pp. 57, 60-4, 73 (No Month).|
|16||ISHM Proc., 1985-Anwar A. Mohammed and Steven J. Corbett, "Thick Film Metallizations and Performance of a Power Hybrid Module on Aluminum Nitride Substrates" 1985-pp. 218 thru 224.|
|17||ISHM Proc., 1985—Anwar A. Mohammed and Steven J. Corbett, "Thick Film Metallizations and Performance of a Power Hybrid Module on Aluminum Nitride Substrates" 1985—pp. 218 thru 224.|
|18||Iwase et al-"Thick Film and Direct Bond Copper Forming Technologies for Aluminum Nitride Substrate"-IEEE Transactions on Components, Hybride and Manufacturing Technology, Vo. Chmt 8, No. 2, Jun., '85-pp. 253 thru 258.|
|19||Iwase et al—"Thick Film and Direct Bond Copper Forming Technologies for Aluminum Nitride Substrate"—IEEE Transactions on Components, Hybride and Manufacturing Technology, Vo. Chmt 8, No. 2, Jun., '85—pp. 253 thru 258.|
|20||J. Ishigame, T. Kubota, S. Sekihara and K. Fujimura, "Technological Advances of Thick Film Resistors for Aluminum Nitride Substrates with New Conductive Compositions"-ISHM '88 Proceedings-pp. 349 thru 357.|
|21||J. Ishigame, T. Kubota, S. Sekihara and K. Fujimura, "Technological Advances of Thick Film Resistors for Aluminum Nitride Substrates with New Conductive Compositions"—ISHM '88 Proceedings—pp. 349 thru 357.|
|22||John B. Blum, "Aluminum Nitride Substrates for Hybrid Microelectronic Applicantions"-Hybrid Circuit Technology, Aug. 1989, pp. 7 thru 14.|
|23||John B. Blum, "Aluminum Nitride Substrates for Hybrid Microelectronic Applicantions"—Hybrid Circuit Technology, Aug. 1989, pp. 7 thru 14.|
|24||K. Kachelries, J. Olenick and S. Konsowski, "Evaluation of Thick Film Multi-Layers on AIN"-ISHM '88 Proceedings-pp. 170 thru 182.|
|25||K. Kachelries, J. Olenick and S. Konsowski, "Evaluation of Thick Film Multi-Layers on AIN"—ISHM '88 Proceedings—pp. 170 thru 182.|
|26||N. Iwase and K. Anzai, "Aluminum Nitride Substrates Having High Thermal Conductivity"-Solid State Technology, Oct. 1986-pp. 135 thru 138.|
|27||N. Iwase and K. Anzai, "Aluminum Nitride Substrates Having High Thermal Conductivity"—Solid State Technology, Oct. 1986—pp. 135 thru 138.|
|28||Y. Kuromitsu, T. Nagase, H. Yoshida, F. Miyazawa, Y. Ikeda, "Evaluation of the Hybrid made of Surface Treated AIN Substrate" ISHM '90 Proceedings-pp. 19 thru 26.|
|29||Y. Kuromitsu, T. Nagase, H. Yoshida, F. Miyazawa, Y. Ikeda, "Evaluation of the Hybrid made of Surface Treated AIN Substrate" ISHM '90 Proceedings—pp. 19 thru 26.|
| Patente citante|| Fecha de presentación|| Fecha de publicación|| Solicitante|| Título|
|US8486308||8 Dic 2011||16 Jul 2013||E I Du Pont De Nemours And Company||Conductive paste composition containing lithium, and articles made therefrom|
| || |
| Clasificación de EE.UU.||428/472, 428/469, 428/702, 428/701, 428/698, 257/E23.075, 428/457|
| Clasificación internacional||H01L23/498, C03C8/18, H05K1/09, H01B1/16, C04B41/51|
| Clasificación cooperativa||H01B1/16, H01L2924/0002, C04B2111/00844, C04B41/009, H05K1/092, H01L23/49883, C04B41/5127, C03C8/18|
| Clasificación europea||C04B41/00V, H01L23/498M4, H01B1/16, C03C8/18, C04B41/51J|
|19 May 2009||FP||Expired due to failure to pay maintenance fee|
Effective date: 20090327
|27 Mar 2009||LAPS||Lapse for failure to pay maintenance fees|
|6 Oct 2008||REMI||Maintenance fee reminder mailed|
|27 Sep 2004||FPAY||Fee payment|
Year of fee payment: 4