OCZ Launches Water Cooled Memory Modules – FlexXLCTue, Nov 21, 2006 - 12:00 AM
OCZ Internal Test Numbers
The Following Information Was Copied From OCZ’s Internal Thermal Analysis Test Result Documents. None of the testing below was completed by or confirmed by Legit Reviews!
The purpose of this research is to determine the effectiveness of the Flex XLC (Extreme Liquid Cooling) under various conditions. The conditions will range from idle to memory stressing with different settings.
The water cooling system consists of the following components, but not limited to:
? Danger Den MAGII Water Pump
? SwiftTech RAD676 120mm Radiator
? ThermalTake Liquid Tank (Reservoir)
? Fluid XP EXP Extreme Coolant
All cooling equipment was placed in a generic computer case containing an ASUS P5B Deluxe motherboard with an Intel 975 chipset. Two OCZ26481800P9FGU modules have been placed on the motherboard as well for testing.
One module (control) will have no supplemental cooling device attached, while the other module (experimental) will have the Flex XLC block attached. Both will contain independent temperature probes. Temperature is monitored live through a digital temperature gauge and noted every minute of the time, control temperature, and experimental temperature. The experiment will run through four different tests, but Legit Reviews will only be showing Test 1 and Test 4 as the data found in test 2 and 3 are not along the same lines as test four.
- Test 1: Factory Settings
- Test 2: 2.25v @ 900 MHz IDLE
- Test 3: 2.25v @ 900 MHz MEMTEST #6
- Test 4: 2.25v @ 950 MHz MEMTEST #6
*Average cooling differences were taken in the last five minutes of the test since that is where the least amount of temperature change occurs (plateau).
The average difference that the FLEX XLC provides in water cooling is an average of 7.2C in the last five minutes of the test.
The average difference that the FLEX XLC provides in water cooling is an average of 16.0 oC in the last five minutes of the test under memtest #6.
According to the test, results have determined that the Flex XLC is efficient in cooling over clocked ram modules. For the over clocked results, the water cooled unit has maintained an average of 29.8 oC overall (excluding Test 1), with the largest cooling difference of 17 oC from Test 4.
Post Experimental Procedures
The average of the Flex XLC could possible be lowered by performing the following experiment. The average cooling temperature of ALL tests was 29.41 oC while the room temperature was at 28.6 oC. Additional cooling at the radiator could be applied by additional fans or chilling the liquid medium. The radiator was not running at full capacity. The radiator has the capacity to hold 3 fans while only 2 were mounted for bracketing reasons.