tester pattern generation (TPG) n - the generation of a program that runs on an integrated circuit hardware tester (integrated circuit tester). The purpose of this program is to permit test vectors to be applied to the pins of the integrated circuit, and measurements made to determine the performance of the integrated circuit. [1994 National Technology Roadmap for Semiconductors] Also called tester program generation.
test pattern - see pattern, test.
test techniques n - any methods used for the expressed purpose of testing integrated circuits. Examples include built-in self test (BIST), automatic test pattern generator (ATPG), static current test (IDDQ ), and boundary scan. [1994 National Technology Roadmap for Semiconductors]
test vectors n - sequences of signals applied to the pins of an integrated circuit to determine whether the integrated circuit is performing as it was designed. [1994 National Technology Roadmap for Semiconductors]
total reflection X-ray fluorescence (TXRF) n - an analytical method usually used to characterize the level of metallic (and nonmetallic elemental) surface contamination. In TXRF, an X- ray beam excites fluorescence from the contamination that is present on a silicon surface. Since the beam is incident at grazing angles, it totally reflects from the surface, thus maximizing the signal. [SEMATECH]
trapped charges n - charges trapped either in the gate oxide or, in the case of a lightly doped drain (LDD) metal-oxide semiconductor field-effect transistor (MOSFET), in the spacer region. Trapped charges in the gate or the spacer lead to threshold voltage shift or to transconductance degradation, respectively. [SEMATECH]
TXRF - see total reflection X-ray fluorescence.
ULSI - see Ultra Large Scale Integration
Ultra large Scale Integration - the placement of at least 1,000,000 active devices on a single die. [JESD99]
undercutting n - the lateral etching into a substrate under a resistant coating, as at the edge of a resist image. [ASTM F127-84]
unencapsulated thermal test chip n - an unpackaged, specially designed silicon die with standard test junctions that, after mounting into a package, may be used to thermally characterize that package. This technique is useful in determining the difference between various vendors’ packages and package designs. [SEMATECH]
Very Large Scale Integration - n the placement of at least 1000 active devices on a single die. [JESD99]
via n 1 - a connection between two conducting layers above the silicon surface that is created by a different material or deposition step.
VLSI - see Very Large Scale Integration
void 1 - see dielectric void. 2 - see glass void. 3 - see metallization void.
wafer n - in semiconductor technology, a thin slice with parallel faces cut from a semiconductor crystal. [ASTM F1241] Also called a slice. Also see substrate.
well n - a localized n-type region on a p-type wafer or a p-type region on an n-type wafer. [SEMATECH]
X-ray fluorescence n 1 - the property of atoms to absorb X rays and emit light of characteristic wavelengths. [SEMATECH] 2 - a material diagnostic technique that determines the surface concentration of contaminants. [SEMATECH]