TSMC has also developed ultra-low power technologies for IoT edge nodes, high-voltage processes for automotive, as well as MEMS and Sensors for a wide range of applications. Expanding even beyond wafers, TSMC has invested in packaging technology. After introducing Chip on Wafer on Substrate ( CoWOS) technology in 2012, TSMC developed a very thin and low cost IC packaging technology, called Integrated Fan Out (InFO) to meet the needs for thinner single- and multi-die ICs (Figure 1). Several, usually reliable, sources told me that the A10 application processor in Apple's iPhone 7, to be introduced in Fall 2016, will be taking advantage of InFO. This will encourage Apple's many IC vendors to match Apple's thin Application Processor (AP) and use InFO or equally thin packages utilizing chip-scale packaging or Interposer solutions. Figure 1: TSMC's InFO technology ( Image source, Semiwiki )