Taiwan Semi's chip-on-wafter-substrate (CoWoS) packaging technology enables placing multiple chips like GPUs, memory and interconnects on a silicon interposer, which is attached to a larger substrate. CoWoS capacity is another limiting factor for producing AI GPUs. NVIDIA has been taking up all the capacity, causing production bottlenecks. Taiwan Semi and NVIDIA have been working to alleviate the bottlenecks to bolster CoWoS capacity.