SUNNYVALE, Calif., April 2, 2012 /PRNewswire/ -- Spansion Inc. (NYSE: CODE ) and SK Hynix today announced an alliance to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The first Spansion® SLC NAND products resulting from this alliance will be available beginning in the second quarter of 2012. As part of the relationship, the companies will enter into a patent cross-licensing agreement.