This is a critical enabling milestone for Intel's foundry business. The RibbonFET and PowerVia are core Intel 18A technologies that enable greater processor scale and efficiency, which is required to drive forward AI computing. RibbonFET allows for tight control over the electrical current in the transistor channel, enabling further miniaturisation of chip components while reducing power leakage, a critical factor as chips become increasingly dense. PowerVia optimises signal routing by separating power delivery from the front side of the wafer, thus reducing resistance and improving power efficiency. Together, these technologies demonstrate a powerful combination that could lead to substantial gains in computing performance and battery life in future electronic devices. Intel's first-to-market position with both technologies is a win for foundry customers worldwide.