Together with partners across the ecosystem, Samsung will provide a one-stop turnkey service to better support customers' technological innovation. Samsung plans to actively respond to customer and market needs by developing customized packaging solutions that are tailored to the individual needs of various applications including HPC and automotive. Pushing Boundaries With Partners for Enhanced Fabless Support Following the Samsung Foundry Forum, Samsung will be hosting the Samsung Advanced Foundry Ecosystem (SAFE) Forum on June 28 under the theme 'Accelerating the Speed of Innovation.' Together with over a hundred partners across electronic design automation (EDA), design solution partners (DSP), outsourced semiconductor assembly and test (OSAT), cloud and IP, Samsung is promoting mutual growth of the foundry ecosystem to power the success of customers.