TSMC's first U.S. fab, already in development, anticipates commencing high-volume production by the first half of 2025. This investment marks a significant milestone, as TSMC's $65 billion-plus commitment stands as the largest foreign direct investment in a new U.S. project in history, according to the Commerce Department. In 2022, Congress passed the Chips and Science Act to bolster domestic semiconductor output, allocating $52.7 billion in research and manufacturing subsidies, along with $75 billion in government loan authority. TSMC Arizona has further pledged to support the advancement of advanced packaging capabilities through partnerships within the U.S. This initiative aims to enable customers to procure cutting-edge chips entirely manufactured on U.S. soil, with 70% of TSMC's customers being U.S. companies. TSMC's CEO, C.C. Wei, expressed the company's commitment to assisting U.S. tech firms in harnessing their innovations by expanding capacity for leading-edge technology through TSMC Arizona.