With software tools like Ansys RedHawk-SC Electrothermal™ and Ansys Icepak™, designers can efficiently address these issues to facilitate rapid prototyping and architectural exploration. Early-stage thermal and mechanical analysis is critical to prevent problems like hotspots, warping, and system failures due to poor heat dissipation or physical stress. Importance of Early Verification Verification at an early stage of multi-die design is pivotal. As multiple dies are stacked together in a small form factor, verifying the overall system becomes increasingly difficult, yet even more essential. Failure to catch potential issues early, such as thermal bottlenecks or power integrity problems, could lead to costly delays and suboptimal performance. One of the key challenges in multi-die design is managing voltage drop and electromigration (EM/IR), which can lead to power integrity failures.