TSMC will also continue to challenge the limits of process miniaturization. Wan Ruiyang said that looking forward to the future, in order to meet the huge demand for high-performance computing for AI innovation, 3D chip stacking and advanced packaging technology will become increasingly important. TSMC is a global leader in advanced manufacturing. We expect to integrate more than 200 billion transistors on a single chip in the next few years, and reach more than one trillion transistors through 3D packaging. This would be an exciting breakthrough in semiconductor technology. At the same time, Wan Ruiyang pointed out that TSMC has also promoted countless innovations. Through close cooperation, it has created a win-win strategic alliance, unleashed more powerful AI with leading semiconductor technology, achieved seemingly impossible innovations, and made the world a better place.