Synopsys is currently leading the industry transformation from monolithic system-on-chips to multi-die systems with a comprehensive and scalable solution for fast heterogeneous integration. Multi-die systems enable early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity and improved manufacturing and reliability. The solution, including electronic design automation tools and intellectual property, is integrated with Ansys' multi-physics analysis technology and developed on Taiwan Semiconductor's 7-nanometer (nm), 5nm and 3nm process technologies with support for TSM's 3DFabric technologies and 3Dblox standard.