The expansion of advanced nodes (below 20nm) is accelerating due to the demand for AI. TSMC not only continues to build 2nm and 3nm in Taiwan but also 4/5nm in the U.S. which will soon be in mass production. Samsung is honing its 2nm in Hwaseong, Korea, capitalizing on its experience of entering the GAA generation first. Meanwhile, Intel is focusing on 18A process development under its new strategic plan and aiming to attract more external customers over the coming years. Overall, wafer manufacturing is projected to increase by 7% annually in 2025, with advanced nodes capacity rising by 12% annually. Average capacity utilization rate is expected to remain above 90% and the AI-driven semiconductor boom will continue.