11, 2021 The new high-density advanced packaging (HDAP) enablement solutions stem from ASE's participation in the Siemens OSAT Alliance —program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE's latest achievements as part of the OSAT Alliance include an assembly design kit (ADK) that helps customers using ASE's Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to fully leverage the Siemens HDAP design flow. ASE and Siemens have also agreed to extend their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these joint initiatives leverage Siemens' Xpedition Substrate Integrator software and Calibre 3DSTACK platform.