Xiaomi and ZTE are also developing their own APs. Even LG Electronics is also working to develop its AP. "Qualcomm is in a dire situation where it has to continue its relationship with Samsung." said a representative for a semiconductor industry. However there is a high chance that Samsung will ask other businesses to be responsible for rear-end process packages. Qualcomm is planning to apply next Fan Out packaging technology to Snapdragon 830 for the first time. Apple already had produced A10s for iPhone 7s by using TSMC's InFO (Integrated Fan Out) that is a similar technology. If Fan Out technology is used, PCB (Printed Circuit Board) for semiconductor package boards is not needed. Overall production can be reduced and number of I/O (Input/Output) ports can easily be increased. Also thickness of overall package can be reduced. It is heard that Qualcomm will first produce chips through FoPLP (Fan Out Panel Level Package) that is being co-developed by Samsung Electronics and Samsung SEM.