Tuesday afternoon TechSpot North Emerging Generation Memory Technology: Update on 3DNAND, MRAM and RRAM Naga Chandrasekan of Micron provided Micron's view of 3D NAND. Five years ago simple scaling ruled and there were many suppliers. Today there are few suppliers, many customers and simple scaling of 2D devices is no longer viable. Micron is focused 100% on 3D after the 16nm generation. Cost per Gb is lower for 3D than 2D. Scaling for 3D is limited by how high you can stack it and Micron thinks they can scale for at least 4 generations. There are a lot of process challenges around high aspect ratio deposition and etch, uniformity, hard mask materials, low temperature deposition, gap fill, stress and alignment. He thinks other emerging memories go into storage class memory but can't displace NAND for storage because 3D NAND will still be the lowest cost.