"Achieving successful silicon bring-up of 3nm 24 Gbps UCIe subsystem with TSMC's advanced packaging is a significant milestone for Alphawave Semi and underscores the company's expertise in utilizing the TSMC 3DFabric™ ecosystem to deliver top-tier connectivity solutions," said Mohit Gupta, Alphawave Semi's SVP and GM, Custom Silicon and IP. Gupta also stated the IP sets "a new benchmark in high-performance connectivity solutions." Alphawave Semi's UCIe subsystem IP complies with the latest UCIe Specification Rev 1.1 and includes comprehensive testability and de-bug features such as JTAG, BIST, DFT, and Known Good Die (KGD) capabilities.